Loctite 7452
Abstract: PCM45 6700PXH 6702PXH INTEL 5000P Chipset Platform Design Guide PCM45F 631xesb D12403-001 D10234-001
Text: Intel 5000 Series Chipset Memory Controller Hub MCH Thermal/Mechanical Design Guide May 2006 Document Number: 313067-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
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631xESB/632xESB
Loctite 7452
PCM45
6700PXH
6702PXH
INTEL 5000P Chipset Platform Design Guide
PCM45F
631xesb
D12403-001
D10234-001
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Loctite 7452
Abstract: TT 2206 datasheet TT 2206 transistor tt 2206 motherboard with multimeter pcm45 PCM45F Loctite 3733 631X TT 2206 transistor
Text: Intel 5000 Series Chipset Memory Controller Hub MCH for Embedded Applications Thermal and Mechanical Design Guidelines September 2006 Order Number: 315344-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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315344-001US
Loctite 7452
TT 2206 datasheet
TT 2206
transistor tt 2206
motherboard with multimeter
pcm45
PCM45F
Loctite 3733
631X
TT 2206 transistor
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PCM45F
Abstract: intel core 2 duo e7500 T9400 atom intel Honeywell TIM2 3185* Intel METRIX+ox+5100
Text: Intel 5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications Thermal/Mechanical Design Guide July 2008 Revision 003US Order Number: 318676-003US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
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003US
318676-003US
x1131
D10234-001
A13494-005
HB96030-DW)
PCM45F
intel core 2 duo e7500
T9400
atom intel
Honeywell TIM2
3185* Intel
METRIX+ox+5100
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dupont 951
Abstract: proner comatel lv 5682 dupont 951 green tape PRONER C0328 c2029 dupont 943 cf04 PGA wire bonding
Text: Design Rules For Physical Layout of Low Temperature Co-Fired Ceramic Modules Revision 8.1 1/05/2000 Copyright 1996, 1997, 1998, 1999, 2000 National Semiconductor Corporation Unpublished Work - All Rights Reserved. No part of this work may be reproduced or utilized in any form or by any means electronic or
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lv 5682
Abstract: CF021 cf041 951AT c2029 pd36 951A2 dupont 951 green tape CF031 INCOMING RAW MATERIAL INSPECTION format
Text: Design Rules For Physical Layout of Low Temperature Co-Fired Ceramic Modules Revision 11/17/99 Copyright 1996, 1997, 1998, 1999 National Semiconductor Corporation Unpublished Work - All Rights Reserved. No part of this work may be reproduced or utilized in any form or by any means electronic or
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AUTOMATIC ROOM LIGHT CONTROLLER with visitor counter
Abstract: MIL-STD-3010 MS-90376 ASTM D2103 Ushio 1604LC semiconductors cross index JEDEC J-STD-033b D882 to 92 electronic weighing scale display
Text: 3M Electronic Solutions Division Static Control Products and Services Catalog See our products at: www.3Mstatic.com Innovations in Static Protection 3M and Dual Lock are trademarks of 3M Company. All All other other trademarks trademarks are are owned owned by
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2002/95/EC"
2002/95/EC,
2005/618/EC,
AUTOMATIC ROOM LIGHT CONTROLLER with visitor counter
MIL-STD-3010
MS-90376
ASTM D2103
Ushio
1604LC
semiconductors cross index
JEDEC J-STD-033b
D882 to 92
electronic weighing scale display
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D882 mosfet
Abstract: AMWS121M 3M EM air ionizer tester 3M ASTM-D-991 2179 CM 3M CTK2A6-C MS90376 dust cap MIL-STD-3010 esd 20.20
Text: 3M Electronic Solutions Division Static Control Products and Services Catalog See our products at: www.3M.com/static *“RoHS Compliant 2005/95/EC” means that the product or part “Product” does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC,
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2005/95/EC"
2002/95/EC,
2005/618/EC,
D882 mosfet
AMWS121M
3M EM
air ionizer tester 3M
ASTM-D-991
2179 CM 3M
CTK2A6-C
MS90376 dust cap
MIL-STD-3010
esd 20.20
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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PIC16 example ay0438
Abstract: 30014 QCI-30014 sugar production process 85c72 PIC16 example codes QCI-30397 PIC16-17 27c64 EEPROM AY0438
Text: DIE SUPPORT Overview of Microchip Die Specifications INTRODUCTION This overview is intended to give our customers a better understanding of Microchip’s process of die usage and manufacture. This information is not intended as what is needed to manufacture die. It is highly recommended
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DS30258B-page
PIC16 example ay0438
30014
QCI-30014
sugar production process
85c72
PIC16 example codes
QCI-30397
PIC16-17
27c64 EEPROM
AY0438
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CAR HORN Specification
Abstract: UTH5330UFLCH UHIRS213BCV 1008827CH Eaton MCB
Text: Metering Products Group Metering and Meter Breaker Family 4.1 Single Meter Sockets Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 4.4 4.7 4.10 V1-T4-29 V1-T4-34 V1-T4-35 V1-T4-37 V1-T4-39 V1-T4-48 V1-T4-59
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V1-T4-29
V1-T4-34
V1-T4-35
V1-T4-37
V1-T4-39
V1-T4-48
V1-T4-59
V1-T4-65
V1-T4-75
V1-T4-83
CAR HORN Specification
UTH5330UFLCH
UHIRS213BCV
1008827CH
Eaton MCB
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transistor A562
Abstract: A561 transistor trapatt diode A4 transistor A562 transistor transistor a561 transistor smd marking a73 reverse-conducting thyristor trapatt A5 DIODE
Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 20 April 2011. INCH-POUND MIL-PRF-19500P 20 October 2010 SUPERSEDING MIL-PRF-19500N 30 November 2005 PERFORMANCE SPECIFICATION SEMICONDUCTOR DEVICES,
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MIL-PRF-19500P
MIL-PRF-19500N
transistor A562
A561 transistor
trapatt diode
A4 transistor
A562 transistor
transistor a561
transistor smd marking a73
reverse-conducting thyristor
trapatt
A5 DIODE
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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systron Donner 410
Abstract: MIL-STD-750E Ultrasonic Atomizing Transducer systron donner accelerometer substitute diode PH 33D fastest finger first indicator synopsis emerson three phase dc motor driver service note tektronix 576 curve tracer MIL-STD-750E 1071 proximity detector sensor
Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 20 June 2007 INCH - POUND MIL-STD-750E 20 November 2006 SUPERSEDING MIL-STD-750D 28 FEBRUARY 1995 DEPARTMENT OF DEFENSE TEST METHOD STANDARD TEST METHODS FOR SEMICONDUCTOR DEVICES
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MIL-STD-750E
MIL-STD-750D
systron Donner 410
MIL-STD-750E
Ultrasonic Atomizing Transducer
systron donner accelerometer
substitute diode PH 33D
fastest finger first indicator synopsis
emerson three phase dc motor driver service note
tektronix 576 curve tracer
MIL-STD-750E 1071
proximity detector sensor
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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7LY510C2
Abstract: kss 1201 specifications of ic 1408
Text: TO SHIBA JT6M57-AS JT6M57-AS TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC JT6M57-AS CMOS 1 CHIP LSI FOR LCD ELECTRONIC CALCULATOR The JT6M57-AS is a 1 chip microcomputer for 12-digits 2-memory or 10-digits 2-memory electronic calculator. JT6M57-AS can drive the liquid crystal display LCD . Single power supply operation, wide operating
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JT6M57-AS
JT6M57-AS
12-digits
10-digits
10-digits
7LY510C2
kss 1201
specifications of ic 1408
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MECL 10000
Abstract: MCM6830A transistor bf 175 MCM6605AL1 c3460 equivalent MCM6810A mcm6616
Text: GENERAL INFORMATION 1 RANDOM ACCESS MEMORIES RAM 2 READ ONLY MEMORIES (ROM) 3 M6800 SYSTEM MEMORIES APPLICATION NOTES 5 RELIABILITY INFORMATION 6 MEMORY INTERFACE i Volume 7 / Series A prepared by Technical Information Center Semiconductor Data Library MOS MEMORIES
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M6800
MECL 10000
MCM6830A
transistor bf 175
MCM6605AL1
c3460 equivalent
MCM6810A
mcm6616
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HRMA-0470B
Abstract: Semicon volume 1 HPMA-2085 HP 33002A AVANTEK ATF26884 SJ 2036 HPMA-0470TXV HPMA-0485 HPMA-0370 DIODE GOC 61
Text: Whal HEWLETT \HrJk PACKARD Communications Components Designer’s Catalog, GaAs and Silicon Products A Brief Sketch Hewlett-Packard is one of the world’s leading designers and manufacturers of RF and microwave semiconductors, optoelectronic, and fiber optic
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E-28230
S-164
CH-8902
HRMA-0470B
Semicon volume 1
HPMA-2085
HP 33002A
AVANTEK ATF26884
SJ 2036
HPMA-0470TXV
HPMA-0485
HPMA-0370
DIODE GOC 61
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