T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6
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21x21
45x45
FHE35-35-27
/T710
/T410
/T411
/T412
FHE35-35-27/T710/T
RevA0614
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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27x27
40x40
RevA0614
FHP27-27-21
/T710
/T410
/T411
/T412
FHP27-27-21/T710/T
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
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21x21
45x45
confid43-43-16
FHL31-31-18
/T710
/T410
/T411
/T412
FHL43-43-16/T710/T
RevA0614
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHP Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 27x27 mm to 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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27x27
40x40
CB1014
FHP27-27-20
/T410
/T411
/T412
FHP27-27-20/T710/T
RevB1014
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHE SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 45.0
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21x21
45x45
FHE35-35-26
/T410
/T411
/T412
FHE43-43-26/T710/T
RevB1014
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D1065
Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 Chomerics T710 tape BGA 21x21 ARCLAD 8223 Chomerics T710 D10650-40 D10650-40 datasheet
Text: Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX BGA Sizes Foot Print mm Heat Sink Height (inches) Series # Solution Page # Attachment Method 21mm 21mm 25mm 27mm 35mm 35mm 37mm 37mm 40mm 40mm 40mm 40mm 45mm 45mm 45mm 45mm 45mm 45mm 21x21
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21x21
25x25
28x28
35x35
37x37
38x38
71x43
73x50
D1065
Chomerics* T-405
BERGQUIST softface
Chomerics* T405
Chomerics T710 tape
BGA 21x21
ARCLAD 8223
Chomerics T710
D10650-40
D10650-40 datasheet
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
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21x21
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confid3-17
FHL31-31-17
/T410
/T411
/T412
FHL43-43-17/T710/T
RevB1014
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Untitled
Abstract: No abstract text available
Text: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm
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FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
FHE40-40-40/T710/T
RevD1014
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprint 35x35 mm and 40x40 mm ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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35x35
40x40
sup35-20
FEX40-40-20
/T710
/T410
/T411
/T412
withT710
FEX40-40-20/T710/T
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FEX Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with 35x35 mm and 40x40 mm chipset footprints ■ Common 5VDC @ 0.5 A max USB 2.0 fan electrical
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35x35
40x40
RevB1014
FEX40-40-21
/T410
/T411
/T412
withT710
FEX40-40-20/T710/M2
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IXF1010
Abstract: T-710 36ga intel fan
Text: Intel IXF1010 Thermal Design Considerations Preliminary Application Note July 2002 This document contains preliminary information on new products. Information is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design.
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IXF1010
552-CBGA
T-710
36ga
intel fan
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zif rod
Abstract: No abstract text available
Text: – THERMAL MANAGEMENT PRODUCTS CATALOG www.ctscorp.com CTS TABLE OF CONTENTS PAGE HI-TEMP FAN HEAT SINKS 3 ADHESIVE PEEL AND STICK HEAT SINKS 6 FORGED HEAT SINKS WITH PLATE FINS 7 FORGED HEAT SINKS WITH PIN FINS 9 CLIP AND TAPE STYLES 10 ZIF STANDARD CIRCUIT BOARD RETAINERS
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O-126,
O-202,
O-218
O-220
zif rod
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
669-33AB
669-40AB
T405R
Chomerics* T405
BERGQUIST softface
T410R
intel 82495
Bergquist BP-108
intel 80486sx
Intel 82495 Cache Controller
651b
thermal printer 2 inch
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855GM
Abstract: 82801DB intel chipset g 41 motherboard no display intel 845gv MOTHERBOARD CIRCUIT 852GME foxconn motherboard T411 845G 855GME T-710
Text: Intel 855GME and Intel® 852GME Chipset Memory Controller Hub MCH Thermal Design Guide for Embedded Applications October 2003 Revision 1.0 Order Number: 273838-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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855GME
852GME
852GME
855GM
82801DB
intel chipset g 41 motherboard no display
intel 845gv MOTHERBOARD CIRCUIT
foxconn motherboard
T411
845G
T-710
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Intel A80856 Socket 478 Cooling Fan
Abstract: a80856-002 intel a80856 a57855-001 Nidec A80856 a38001-003 a57855 Nidec a38001-003 a80856 a38001
Text: Intel Pentium® 4 Processor and Intel® Celeron® Processor in the 478-Pin Package Thermal Design Guide for Embedded Applications January 2004 Order Number: 273704-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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478-Pin
886-2-29952666ext.
Intel A80856 Socket 478 Cooling Fan
a80856-002
intel a80856
a57855-001
Nidec A80856
a38001-003
a57855
Nidec a38001-003
a80856
a38001
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