T443
Abstract: Chomerics T710 D257 D374 D792 T310 T725 chomerics 77 PARKER HANNIFIN parker
Text: TECHNICAL BULLETIN • Phase-change thermal interface materials • Thermally conductive adhesive tapes • Thermally conductive insulator pads • Thermally conductive gap fillers • Thermally conductive silicone compounds • Flexible heat spreaders • Thermal management for BGAs
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MIL-T-47012
Abstract: PARKER HANNIFIN CHO-TP-57 parker-hannifin 2024 ASTM-D1000 SHIELD ELECTRICAL MIL D1000 MIL-T-10727 parker
Text: • • • • • Conductive elastomers • Knitted wire mesh Conductive coatings, sealants, adhesives Cable shielding products • EMI/ESD shielding laminates Shielded vents and windows FCC/VDE and TEMPEST testing LEADER IN EMI SHIELDING INNOVATION, DESIGN, AND TEST TECHNOLOGY
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3M1197SG-214
MIL-T-47012
PARKER HANNIFIN
CHO-TP-57
parker-hannifin
2024
ASTM-D1000
SHIELD ELECTRICAL MIL
D1000
MIL-T-10727
parker
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PARKER HANNIFIN
Abstract: L-1012-12 L-1012-6 L-1012-18 TM 1628 parker
Text: • • • • • TECHNICAL BULLETIN Conductive elastomers • Knitted wire mesh Conductive coatings, sealants, adhesives Cable shielding products • EMI/ESD shielding laminates Shielded vents and windows Commercial and military EMI testing LEADER IN EMI SHIELDING INNOVATION, DESIGN, AND TEST TECHNOLOGY
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1M599SG-200R
PARKER HANNIFIN
L-1012-12
L-1012-6
L-1012-18
TM 1628
parker
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74008
Abstract: TM 1628 74017 74004 74019 74021 74011 74013 74032 74022
Text: SOFT-SHIELD 5000 Series Conductive Jacket over Foam EMI Gaskets continued KNIFE-EDGE PROFILE W 74007 18 Compression lbs/lin.inch • • • • • H 16 Conductive elastomers • Knitted wire mesh Low closure force, foam core EMI gaskets Conductive coatings, sealants, adhesives
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5M300AG-247
74008
TM 1628
74017
74004
74019
74021
74011
74013
74032
74022
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MPC-120
Abstract: T725 AN-0003 gold wire
Text: Thermal Considerations for PAs AN-0003 Thermal Considerations for Power Amplifiers Overview Proper heatsinking to control junction temperature is an extremely important consideration for use of all power amplifiers. Gallium Arsenide GaAs devices can tolerate considerably higher junction
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AN-0003
MPC-120
T725
AN-0003
gold wire
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E7221
Abstract: 865g Motherboard 775 motherboard BGA reflow guide Chomerics T710 6700PXH 6702PXH chipset reflow profile FOXCONN 865gv foxconn MOTHERBOARD
Text: R Intel E7221 Memory Controller Hub MCH Thermal/Mechanical Design Guide September 2004 Document Number: 303632-001 R Notice: This document contains information on products in the design phase of development. The information here is subject to change without notice.
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E7221
865g Motherboard
775 motherboard
BGA reflow guide
Chomerics T710
6700PXH
6702PXH
chipset reflow profile
FOXCONN 865gv
foxconn MOTHERBOARD
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Untitled
Abstract: No abstract text available
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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0-320P
73-7-320A
173-7-330P
173-7-340P
173-7-350P
173-7-410P
173-7-510P
173-7-520P
173-7-610P
173-7-710P
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Untitled
Abstract: No abstract text available
Text: 7 8 6 5 3 4 1 2 REVISIONS REV. DATE ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ DETAIL K ADDED JAN 14/10 ZLJ ECN S T F S1 - S 0 2 - 1 X X X DESCRIPTION APPROVED F F MOUNTING SCREW OPTION 1 = 8 mm MOUNTING SCREW SHIPPED BULK IN SAME TRAYS WITH CAGE ASSEMBLIES
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C6305
123XX
P-FS1-S02-1XXX
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MIL-C-47113
Abstract: t405 6000 e595 Chomerics* T-405 deltabond ARCLAD 8223 T-412 chomerics KS21343 thermal grease Chomerics T710 174-9-250P
Text: Accessory Products THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS 120 SERIES The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal
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O-220
MIL-C-47113
t405 6000
e595
Chomerics* T-405
deltabond
ARCLAD 8223
T-412 chomerics
KS21343 thermal grease
Chomerics T710
174-9-250P
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JESD51-1
Abstract: intel 82566 Design Guide flotherm JESD-51-1 82566
Text: Intel 82566 Gigabit Platform LAN Connect Thermal Design Considerations January 2011 Order Number: 325027-001 Revision 1.2 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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82566EI
82566--Thermal
JESD51-1
intel 82566 Design Guide
flotherm
JESD-51-1
82566
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Chomerics T710
Abstract: PHC029C02012 845 motherboard foxconn motherboard intel 845 845 motherboard circuit a1349 INTEL 845 sdr 845 motherboard check point ICH2
Text: R Intel 845 Chipset Thermal and Mechanical Design Guidelines Design Guide September 2001 Document Number: 298586-001 R ® Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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A65066-001
A67031-001
A61203-001
A13494-005
HB96030-DW
A67625-001
PHC029C02012
Chomerics T710
PHC029C02012
845 motherboard
foxconn motherboard
intel 845
845 motherboard circuit
a1349
INTEL 845 sdr
845 motherboard check point
ICH2
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SAS 251
Abstract: No abstract text available
Text: A B C D E G F H REVISIONS REV DESCRIPTION, ECN, EAR NO. DATE S ELASTOMERIC GASKET OPTION ADDED SEP 15/09 ZLJ JAN 14/10 JAN 30/13 MAY 17/13 ZLJ ZLJ ZLJ T AA AB DETAIL H ADDED NO GASKET OPTION ADDED CORRECTED VIEW APP'D 1 F S1 - S F 2 - 1 X X X 1 MOUNTING SCREW OPTION
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C6305
SAS 251
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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845GL
Abstract: 845gv motherboard intel 845GL motherboard 845GV 82801DB foxconn motherboard Passive Heatsink FCBGA chipset reflow profile MOTHERBOARD INTEL 845 GMCH of motherboard
Text: R 3 Intel 845G/845GL/845GV Chipset Thermal Design Guide Intel® 82845G/82845GL/82845GV GMCH Thermal and Mechanical Design Guidelines October 2002 Document Number: 298655-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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845G/845GL/845GV
82845G/82845GL/82845GV
Pkg760
845GL
845gv motherboard
intel 845GL motherboard
845GV
82801DB
foxconn motherboard
Passive Heatsink FCBGA
chipset reflow profile
MOTHERBOARD INTEL 845
GMCH of motherboard
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AMD-K5
Abstract: anemometer AMD-K5 Processor Thermal grease MIL-I-49456A Chomerics* T405 296-pin K5 AMD power led heat sink Thermagon thermal grease
Text: TM AMD-K5 PROCESSOR Thermal Considerations Application Note Publication # 20092 Issue Date: September 1996 Rev: B Amendment/0 This document contains information on a product under development at Advanced Micro Devices AMD . The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice.
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20092B/0--Sep1996
AMD-K5
anemometer
AMD-K5 Processor
Thermal grease
MIL-I-49456A
Chomerics* T405
296-pin
K5 AMD
power led heat sink
Thermagon thermal grease
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Wakefield Thermal Solutions
Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 658-35AB 77AB datasheet of BGAS T405 bga package weight T411
Text: Cover.qxd 11/3/05 1:00 PM Page 1 THERMAL MANAGEMENT SOLUTIONS FOR BGAs DESIGN • ANALYSIS • FABRICATION CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES:
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82801BA
Abstract: 82801DB ATA-33 E7205 PHC029C02012 T-710 Intel E7205 A13494-005 bga intel
Text: R Intel E7205 Chipset Thermal Design Guide Intel® E7205 Chipset Memory Controller Hub MCH Thermal and Mechanical Design Guidelines November 2002 Document Number: 251940-001 R INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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E7205
82801BA
82801DB
ATA-33
PHC029C02012
T-710
Intel E7205
A13494-005
bga intel
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ATX 2.03 400 WATT
Abstract: FUJIKURA fan pentium MOTHERBOARD CIRCUIT diagram 600E 733B AD1021 PGA370 XTS454 NISSEI GUIDE CompactPCI specification
Text: Intel Pentium® III Processor Thermal Design Guide Application Note June 2000 Order Number: 273325-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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ShineTsu G-749
Abstract: intel packaging handbook 240800 AD1021 600E 733B PGA370 XTS454 273325 G749 G-749
Text: Intel Pentium® III Processor Thermal Design Guide Application Note December 2001 Order Number: 273325-004 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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Sumitomo G750
Abstract: G750 thermal conductivity Thermagon motor speed control mc-60 shicoh Thermagon t pad XTS454 T-PLI 200 thermagon Texas Instruments epoxy Sumitomo PBGA-B495
Text: Intel Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual
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FUJIKURA fan
Abstract: shicoh intel packaging handbook 240800 gus manual AD1021 PGA370 XTS454 273421 sunon fan NISSEI GUIDE
Text: Intel Celeron Processor Thermal Design Guide Application Note December 2000 Order Number: 273421-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
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i3-8637
FUJIKURA fan
shicoh
intel packaging handbook 240800
gus manual
AD1021
PGA370
XTS454
273421
sunon fan
NISSEI GUIDE
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hand movement based fan speed control
Abstract: No abstract text available
Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,
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CWT-125
CLWTC-1000
HP-97TM
hand movement based fan speed control
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Untitled
Abstract: No abstract text available
Text: InnovationS in thermal management DESIGN SERVICES and rapid prototyping E CREATE CREAT Through its computational facilities and thermal/fluids laboratories, ATS specializes in providing thermal analysis, mechanical and design services for telecommunications,
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CWT-125
CLWTC-1000
HP-97TM
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m83528
Abstract: MIL-G-83528
Text: DOC NO PART NUMBER 0C B ±.005 21-99786 SH OF 50097-93 M 1L - SPEC S E E N O T E 2 LTR r ev is io n s DESCRIPTION B M A T E R I A L WAS E C N : 84267 TYPE C DATE (TYPE D) APPVD 1 7 - F eb - 98 TOOMBS 21-99786- 22 0.070 0.98 9± .010 M83528/002-D-022 C ( C L I 1)
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M83528/002-D-022
M83528/002-D-024
M83528/002
MIL-G-83528,
m83528
MIL-G-83528
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