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    CHIPS TECHNOLOGY MSL Search Results

    CHIPS TECHNOLOGY MSL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    CHIPS TECHNOLOGY MSL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    diagrams hitachi ecu

    Abstract: SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2003.11 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    PDF D-85622 REJ01K0003-0200Z diagrams hitachi ecu SMD Transistor exposed QFP 128 784-pin HQFP1414-64 QFN Thermal Resistance vs. Mounting Pad Area LFPAK footprint Renesas LFPAK footprint QFP PACKAGE thermal resistance "General Catalog"

    MSL-155XX

    Abstract: No abstract text available
    Text: MSL-155XX SERIES Surface Mount Bi-Color Chip LEDs Package Dimensions The MSL-155xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for LED die B (Long wavelength) 2.7 (.106) + range choices in wavelength and intensity . They are


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    PDF MSL-155XX MSL-155xx

    MSL-155XX

    Abstract: No abstract text available
    Text: Surface Mount Bi-Color Chip LEDs Description MSL-155XX SERIES Package Dimensions The MSL-155xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for SMT assembly method . This series contain different


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    PDF MSL-155XX MSL-155xx

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount Bi-Color Chip LEDs Description MSL-156X SERIES Package Dimensions The MSL-156xx , a series of bi-color Chip LED device , LED die A Short wavelength is designed in an industry standard package suitable for SMT assembly method . This series contain different


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    PDF MSL-156X MSL-156xx

    APD0520-000

    Abstract: No abstract text available
    Text: DATA SHEET APD Series: Silicon PIN Diode Chips Features Established Skyworks PIN diode process For switch and attenuator applications ● Low capacitance designs to 0.05 pF ● Voltage ratings to 100 V ● Chip size smaller than 15 mils square ● Available Green MSL-1 @ 250 °C per JEDEC J-STD-020


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    PDF J-STD-020 APD0520-000

    TRILITHIC

    Abstract: P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1 7741G
    Text: Powe r Key Features: • No bond damage, wire necking, bond lifting, die lifting, delamination after MSL1 at 260°C ■ Green materials - no antimony III Robust Package for OptiMOS BTS 7741G & BTS 7751G Join the TrilithIC Family As a result of recent environmental concerns regarding the use of lead, the


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    PDF 7741G 7751G 7741G 120mOhm P-TO263-15-1 P-DSO-28-9 220mOhm TRILITHIC P-TO263-15-1 BTS 7740 G 7741 7740 windscreen wiper P-TO-263-15-1

    AN2348

    Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
    Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.


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    PDF AN2348 AN1235. AN2348 EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12

    EIA standards 783

    Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
    Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.


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    PDF AN1235 AN2348. EIA standards 783 smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code

    PXA27x

    Abstract: sychip wifi schematic PXA27x Processor Family Users Manual schematic GSM Modem USB wifi to i2c schematic intel MSL wifi schematic in mobile wifi transceiver chip wi fi
    Text: Interfacing the Intel PXA27x Processor Family to 802.11 Companion Chips Application Note Document Order Number: 280009-001 Information in this document is provided in connection with Intel ® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    PDF PXA27x PXA27x sychip wifi schematic PXA27x Processor Family Users Manual schematic GSM Modem USB wifi to i2c schematic intel MSL wifi schematic in mobile wifi transceiver chip wi fi

    PHILIPS UOC tv kit service code with data

    Abstract: All nokia mobile ic code number image BCM3419 Nokia BTS BENQ gsm module circuit PNX8550 CMOS Camera Module NOKIA philips 5.1 home theater remote control ic 14 pin CHINA TV uoc Broadcom product roadmap
    Text: World News Volume 13 Semiconductors Number 2 Technology Focus May - June 2004 Inside World News page Automotive 2 Networking 3 Technology 4 to 6 Consumer 7&8 MultiMarket Semiconductors Identification 10 Products in brief 11 Communications 12 First 32-bit IVN gateway controller


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    PDF 32-bit 32-bit PHILIPS UOC tv kit service code with data All nokia mobile ic code number image BCM3419 Nokia BTS BENQ gsm module circuit PNX8550 CMOS Camera Module NOKIA philips 5.1 home theater remote control ic 14 pin CHINA TV uoc Broadcom product roadmap

    Clock Generators

    Abstract: No abstract text available
    Text: IDT - Integrated Device Technology - Clock Generators PLL > 841204-245 > 841204B. Page 1 of 2 Integrated Device Technology Products | Applications Clock / Timing Devices | Search Clock Distribution | Support The Analog and Digital Company | Investor


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    PDF 841204B. 841204BK-245LF ICS844204-245 Clock Generators

    smd transistor h2a

    Abstract: H2A SMD transistor H2A transistor SMD transistor smd H2A SMD Transistor Y8 TSHARC-12D TSHARC A2 smd transistor Y10 HSA2-040SIA/A2S23 HSA2-040SAA/A2320A
    Text: TSHARC-A2 Touch Screen Microcontroller Application Guide Ver. 2.0 3.3 – 5vDC 28 pin SOIC 12 – Bit Resolution TTL, RS-232 and USB


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    PDF \PigData\MasterBinders\03 RS-232 000MABJ-UT 000MHZ CD74HC4052PWR 16-TSSOP HSAX-040SIA SN74AHC1G04DCKR SC70-5 74HC4052 smd transistor h2a H2A SMD transistor H2A transistor SMD transistor smd H2A SMD Transistor Y8 TSHARC-12D TSHARC A2 smd transistor Y10 HSA2-040SIA/A2S23 HSA2-040SAA/A2320A

    PEAK tray drawing 3x3

    Abstract: No abstract text available
    Text: SBT-90 Product Datasheet SBT-90 LEDs Features: • Extremely high optical output: Over 1,800 lumens at 9.0A from a single chip white Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3


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    PDF SBT-90 PDS-001540 PEAK tray drawing 3x3

    luminus

    Abstract: microdisplay SBT-90 The MicroDisplay
    Text: SBT-90 Product Datasheet SBT-90 LEDs Features: • Extremely high optical output: Over 1,300 lumens at 9.0A from a single chip white Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3


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    PDF SBT-90 PDS-001540 luminus microdisplay The MicroDisplay

    Semicon volume 1

    Abstract: microcontroller based cell phone detector PROJECT sgs 601 gas sensor
    Text: EPSON CMOS LSIs Product Catalog 2013 Microcontrollers 4-bit / 16-bit / 32-bit Gate Arrays / Embedded Arrays / Standard Cells 2010 2010 CMOS LSIs Product Catalog ASICs CMOS LSIs Product Catalog 2013 ASSPs Application Specific Standard Products 2013 http://www.epson.jp/device/semicon_e/


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    PDF 16-bit 32-bit moS16949: Semicon volume 1 microcontroller based cell phone detector PROJECT sgs 601 gas sensor

    Untitled

    Abstract: No abstract text available
    Text: SST-50 W Product Datasheet SST-50 W LEDs Features: Table of Contents Technology Overview. . . . . . 2 Test Specifications . . . . . . . . . 2 White Binning Structure. . . . 3 Chromaticity Bins. . . . . . . . . . 4 • Extremely high optical output: Over 1,150 lumens from a single chip white


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    PDF SST-50 PDS-001345Rev

    Untitled

    Abstract: No abstract text available
    Text: SST-50 W Product Datasheet SST-50 W LEDs Features: Table of Contents Technology Overview . . . . . .2 Test Speciications . . . . . . . . .2 White Binning Structure . . . .3 • Extremely high optical output: Over 1,150 lumens from a single chip white • Extremely high eiciency: Over 100 lumens per watt at 1.75A


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    PDF SST-50 PDS-001345Rev

    Harris CMOS Integrated Circuits

    Abstract: AN6525 CD4001BEX AN6532 IC CD4047 CD4001* using NAND gates CD4094B FREE CD4047B Harris an6558 Harris an6532
    Text: Technical Overview CD4000B Series Dynamic power dissipation has three components: 1. The dissipation that results from current that charges and discharges the external load capacitance of the output buffers. The dissipation of each output buffer is equal to


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    PDF CD4000B 125oC 125oC CD4000B CD4001BE CD4001BEX Harris CMOS Integrated Circuits AN6525 CD4001BEX AN6532 IC CD4047 CD4001* using NAND gates CD4094B FREE CD4047B Harris an6558 Harris an6532

    CWR11

    Abstract: T49x
    Text: TANTALUM CHIP CAPACITORS PRODUCT DESCRIPTION KEMET’s family of solid tantalum chip capacitors is designed and manufactured with the demanding requirements of surface mount technology in mind. These devices extend the advantages of solid tantalum technology to today’s surface mount circuit


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    PDF 535BAAC. B/3528-21 C/6032-28 D/7343-31 X/7343-43 E/7360-38 R/2012-12 S/3216-12 T/3528-12 U/6032-15 CWR11 T49x

    Tantalum Capacitor kemet 10 uF

    Abstract: 104 TANTALUM capacitor 3528 FOR SMPS 7343 PACKAGE DIMENSIONS capacitive discharge ignition chip capacitors 3528 eia 3216-12 capacitor tantalum CD 7343 datasheet dielectric absorption mechanism
    Text: TANTALUM CHIP CAPACITORS PRODUCT DESCRIPTION KEMET’s family of solid tantalum chip capacitors is designed and manufactured with the demanding requirements of surface mount technology in mind. These devices extend the advantages of solid tantalum technology to today’s surface mount circuit


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    PDF 535BAAC. B/3528-21 C/6032-28 D/7343-31 X/7343-43 E/7360-38 R/2012-12 S/3216-12 T/3528-12 U/6032-15 Tantalum Capacitor kemet 10 uF 104 TANTALUM capacitor 3528 FOR SMPS 7343 PACKAGE DIMENSIONS capacitive discharge ignition chip capacitors 3528 eia 3216-12 capacitor tantalum CD 7343 datasheet dielectric absorption mechanism

    IC 7806 working

    Abstract: pin of 7806 ic puls transformer 141CT E5002 E5002NL E5002NLT E5002T PE-68051 PE-68062L
    Text: 10BASE-T QUAND SMT TRANSFORMER MODULES For RoHS part add suffix NL5 Peak solder temperature rating per Table 5-2 in IPC/ JEDEC J-STD-020C Family of parts – common foot print and pinout with a choice of filtering for customized EMI performance Space-efficient – 12 ports across 3.6 inches for


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    PDF 10BASE-T J-STD-020C 49Inc. All7806 EC101 IC 7806 working pin of 7806 ic puls transformer 141CT E5002 E5002NL E5002NLT E5002T PE-68051 PE-68062L

    TPS65168

    Abstract: TPS65194 intel i3 mtbf TPS65168RSBR
    Text: Lighting and Display Solutions - LCD/OLED Display Bias Solutions - TPS65168 - TI.com Page 1 of 3 Samples & Purchase Cart | Contact Us | TI Worldwide: United States | my.TI Login All Searches Search by Keyword GO Search by Part Number GO TI Home > Semiconductors > Power Management > Lighting and Display Solutions > LCD/OLED Display Bias Solutions >


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    PDF TPS65168 com/docs/prod/folders/print/tps65168 TPS65194 intel i3 mtbf TPS65168RSBR

    DS90C583

    Abstract: D SUB 15 MALE VGA PIN OUT 30 pin LCD connector CH-4542 DS90CF584 PC104 connector 20 pin lcd VGA 15 PIN wiring DIAGRAM DS90C563 lcd 7" 18-bit digital
    Text: TECHNICAL USER'S MANUAL FOR: PERIPHERAL BOARD MSLVDS- T ransmitter MSLVDS- R eceiver Nordstrasse 11/F CH- 4542 Luterbach Tel.: +41 0 32 681 58 00 Fax: +41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com DIGITAL-LOGIC AG


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