Untitled
Abstract: No abstract text available
Text: REVISION K No OF POS x .050 + .015) .002 .005 FIG. 1 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 "A" DO NOT SCALE FROM THIS PRINT .250 .180 CL .025 (TYP) CL NOTCH SPECIFICATION LEAVE BLANK: NO NOTCH -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY)
|
Original
|
PDF
|
ISDF-10-D-X
ISDF-05-D-R
|
SPP-010
Abstract: Chamfer Designation MO-222
Text: LGA Package 81-Lead 11.25mm x 11.25mm × 2.32mm aaa Z (Reference LTC DWG# 05-08-1809 Rev Ø) 11.250 BSC X Y 10.160 BSC 0.605 – 0.665 0.25 × 45° CHAMFER ×3 2.17 – 2.47 9 8 7 0.605 – 0.665 MOLD CAP 11.250 BSC SUBSTRATE 0.27 – 0.37 Z 1.90 – 2.10
|
Original
|
PDF
|
81-Lead
5M-1994
MO-222,
SPP-010
SPP-020
Chamfer Designation
MO-222
|
SPP-010
Abstract: Chamfer Designation
Text: LGA Package 108-Lead 15mm x 11.25mm × 2.32mm (Reference LTC DWG # 05-08-1757 Rev Ø) DETAIL A aaa Z 15 BSC X 13.97 BSC 2.22 – 2.42 Y 0.22 × 45° CHAMFER J H G MOLD CAP 11.25 BSC SUBSTRATE F 10.16 BSC E 0.27 – 0.37 PAD 1 CORNER D 1.27 BSC Z // bbb Z
|
Original
|
PDF
|
108-Lead
5M-1994
MO-222,
SPP-010
SPP-010
Chamfer Designation
|
Untitled
Abstract: No abstract text available
Text: REVISION R No OF POS x .050 + .015) .002 .005 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 DO NOT SCALE FROM THIS PRINT "A" .250 .180 CL SEE NOTE 2 R OPTIONS LEAVE BLANK: NO KEY R -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY) -L: FRICTION LOCK R
|
Original
|
PDF
|
ISDF-10-D-X
ISDF-05-D-R
|
Untitled
Abstract: No abstract text available
Text: REVISION W No OF POS x .050 + .015) .002 .005 (No OF POS x .050) - .050 (TOL NON-ACCUM) R.001 DO NOT SCALE FROM THIS PRINT "A" .250 .180 CL SEE NOTE 2 OPTIONS LEAVE BLANK: NO KEY -C: CHAMFER (SEE SHEET 2, FIG 2) (7 POSITION ONLY) -L: FRICTION LOCK (SEE SHEET 2, FIG 3)
|
Original
|
PDF
|
ISDF-10-D-X
033PRIETARY
ISDF-10-D-DS
|
MO-193 footprint
Abstract: CA 4570 QCI-39000
Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Microcontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
MO-193 footprint
CA 4570
QCI-39000
|
vsop 18
Abstract: No abstract text available
Text: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
DS00049I-page
vsop 18
|
28CXX
Abstract: 1117 TO92
Text: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
MS-026
DS00049J-page
1117 TO92
|
tip 3035 transistor
Abstract: K04-064 28CXX flash memory 28CXX eprom 28cxx Ic 7423 K04-104 K04-049 tip 222 TRANSISTOR tip 147 TRANSISTOR equivalent
Text: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
DS00049J-page
tip 3035 transistor
K04-064
28CXX flash memory
eprom 28cxx
Ic 7423
K04-104
K04-049
tip 222 TRANSISTOR
tip 147 TRANSISTOR equivalent
|
Ic 7423
Abstract: tip 3035 transistor ic SL 1626 31.76 DS00049 R0026
Text: M PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
DS00049K-page
Ic 7423
tip 3035 transistor
ic SL 1626
31.76
DS00049
R0026
|
QCI-39000
Abstract: No abstract text available
Text: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52
|
Original
|
PDF
|
DS00049Q-page
24LC65-I/SN
PIC16C54-RCI/SO
DS30258C-page
QCI-39000
|
QCI-39000
Abstract: C04090 C04-067
Text: SECTION 11 PACKAGING Commercial/Industrial Outlines and Parameters . 11-1 Product Tape and Reel Specifications . 11-52
|
Original
|
PDF
|
DS00049N-page
11-ii
24LC65-I/SN
PIC16C54-RCI/STemperature
DS30258C-page
QCI-39000
C04090
C04-067
|
68L SOT 353
Abstract: tip 3035 transistor C04-067 footprint jedec MS-026 TQFP SP-750 footprint jedec MS-026 TQFP 128 C0421 30014 c04090 transistor wm
Text: SECTION 11 PACKAGING Outlines and Parameters . 1 Product Tape and Reel Specifications . 58
|
Original
|
PDF
|
DS00049R-page
68L SOT 353
tip 3035 transistor
C04-067
footprint jedec MS-026 TQFP
SP-750
footprint jedec MS-026 TQFP 128
C0421
30014
c04090
transistor wm
|
c1651
Abstract: 200B 28CXX CLCC footprint 14047 Packaging Diagrams HA 1100 soic
Text: PACKAGING Commercial/Industrial Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX Device Type Options -XX X Speed or Temperature Frequency /XX XXX Package Pattern Examples: 24LC65-I/SN PIC16C54-RCI/SO Memory Products Mircocontroller Products
|
Original
|
PDF
|
24LC65-I/SN
PIC16C54-RCI/SO
28CXX
93LCXX
DS00049H-page
c1651
200B
CLCC footprint
14047
Packaging Diagrams
HA 1100 soic
|
|
|
238 pin PGA socket
Abstract: No abstract text available
Text: LIF PGA Series Description Applications PGA socket for all purposes in electronic area • This highly accommodating socket is designed with many valuable features. It is constructed of high temperature, glass-filled Thermoplastic so it will withstand both I.R.
|
Original
|
PDF
|
|
burndy 12 pin
Abstract: 238 pin PGA socket
Text: BURNDY LIF PGA Series Description Applications • This highly accommodating socket is designed with many valuable features. It is constructed of high temperature, glass-filled Thermoplastic so it will withstand both I.R. and vapor phase solder reflow temperatures
|
Original
|
PDF
|
94-VO.
burndy 12 pin
238 pin PGA socket
|
RS-186E
Abstract: TDP08H0SB1 TDP08H0SBD1
Text: ! NEW TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • I electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of
|
Original
|
PDF
|
TDP08
TDP04
TDP02
TDP08H1SBD1R
RS-186E
TDP08H0SB1
TDP08H0SBD1
|
Untitled
Abstract: No abstract text available
Text: ! NEW TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • I electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of
|
Original
|
PDF
|
TDP08
TDP02
TDP04
TDP06
TDP10
TDP08H1SBD1R
|
RS-186E
Abstract: TDP08H0SBD1
Text: TDP Series Ultra-miniature Surface Mount Half-pitch Side-Actuated DIP Switches Features/Benefits • World’s first ultra-miniature SMT half-pitch • • • H electronic devices • Instrumentation and controls DIP • side-actuated DIP Side actuation allows visual indication of
|
Original
|
PDF
|
UL94V-0)
TDP04
TDP08
TDP06
TDP08H1SBD1R
TDP10
RS-186E
TDP08H0SBD1
|
RG5 coaxial cable size
Abstract: RG5 coaxial cable RG-402 RG-405 Chamfer Designation
Text: Instruction Sheet 408-9333 Blind Mate 3.5 mm Connectors for Semi-Rigid RG-402 and RG-405 Coaxial Cables was IS 9333 10 MAR 09 Rev A PROPER USE GUIDELINES Cumulative Trauma Disorders can result from the prolonged use of manually powered hand tools. Hand tools are intended for occasional use and low volume
|
Original
|
PDF
|
RG-402
RG-405
RG-405
RG-402
RG5 coaxial cable size
RG5 coaxial cable
Chamfer Designation
|
Untitled
Abstract: No abstract text available
Text: Optical Encoders SERIES 62P Low Cost, PC Mount APPLICATIONS • Automotive Controls • White Goods • Audio FEATURES • Low Cost • Compact Size • PC Mount • No De-Bouncing Required • Reliable, Up to 2 Million Cycles • Choice of Detent and Pushbutton Force
|
Original
|
PDF
|
375Detent
62PXX-XXX
|
Chamfer Designation
Abstract: CuZn36Pb3
Text: REV 702B3625 c .750 ± .010 MATERIALS: 1 TERMINAL - BRASS, BS EN12164, CuZn36Pb3, HALF HARD GOLD PLATED .00003 OVER NICKEL .00005 OVER COPPER OR TIN PLATED 2 BOARD - FR4 .3 0 0 .4 5 0 .075 6 PLACES .0 5 0 X 4 5 ° CHAMFER . 032. CODE* ADD APPROPRIATE DESIGNATION FOR TERM. FINISH
|
OCR Scan
|
PDF
|
702B3625
EN12164,
CuZn36Pb3,
Chamfer Designation
CuZn36Pb3
|
FAA-PMA
Abstract: M39029/1-101 102TL2164-70 3 POSITION TOGGLE SWITCH 6 pin 102TL
Text: F O - 5 5 1 1 1 -A HONEYWELL PART NUMBER 102TL2164-70 FAA-PMA -CHAMFER AS REQUIRED FOR MOUNTING HARDWARE A S S E M B L Y /7 A A CIRCUIT MADE WITH TOGGLE LEVER NATURAL ALUMINUM FINISH CLEAR ANODIZED KEYW AY SIDE CENTER REV DOCUMENT 11 0008691 —A 3 *2 A
|
OCR Scan
|
PDF
|
102TL2164-70
250CT04
M39029/1â
250CT04
5M-1994
FAA-PMA
M39029/1-101
102TL2164-70
3 POSITION TOGGLE SWITCH 6 pin
102TL
|
Untitled
Abstract: No abstract text available
Text: REV. | A j UNLES5 OTHERWISE NOTED TITLE: DIMENSIONS ARE IN INCHES No OF MOLDED MAX BOW ALIGNMENT PINS ALLOWED .003 2 -1 4 .004 1 5 -2 8 .006 2 9 -3 6 .008 - ONE PLACE DECIMALS ±.1 [2.54]TH R EE PLACE DECIMALS ± . 0 0 5 [.1 3 ] ANGLES TWO PLACE DECIMALS ±.01 [.2 5 ]F 0 U R PLACE DECIMALS ± . 0 0 2 0
|
OCR Scan
|
PDF
|
LE-90-D
E130i
|
