Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CERAMIC QFP PACKAGE 100 LEAD Search Results

    CERAMIC QFP PACKAGE 100 LEAD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    CERAMIC QFP PACKAGE 100 LEAD Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A02 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02)


    Original     		FPT-100C-A02 100-pin FPT-100C-A02) F100013SC-1-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC To Top / Package Lineup / Package Index FPT-100C-A01 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A01 100-pin ceramic QFP (FPT-100C-A01)


    Original     		FPT-100C-A01 100-pin FPT-100C-A01) F100002SC-2-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC FPT-100C-A02 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02) 0.51(.020) TYP 8.89(.350)DIA TYP


    Original     		FPT-100C-A02 100-pin FPT-100C-A02) F100013SC-1-2 PDF

    ceramic QFP Package 100 lead

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 100 PIN CERAMIC FPT-100C-A01 Lead pitch 0.65mm Lead shape Gullwing Sealing method Metal seal 100-pin ceramic QFP FPT-100C-A01 100-pin ceramic QFP (FPT-100C-A01) 1.60(.063)TYP 0.51(.020)TYP 17.91(.705) TYP INDEX AREA 14.00±0.25


    Original     		FPT-100C-A01 100-pin FPT-100C-A01) F100002SC-2-2 ceramic QFP Package 100 lead PDF

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN CERAMIC FPT-100C-A01 100-pin ceramic QFP Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal FPT-100C-A01 100-pin ceramic QFP (FPT-100C-A01) 1.60(.063)TYP 0.51(.020)TYP 17.91(.705)


    Original     		FPT-100C-A01 100-pin FPT-100C-A01) F100002SC-2-2 PDF

    ceramic QFP Package 100 lead

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 100 PIN CERAMIC FPT-100C-A02 Lead pitch 0.65 mm Lead shape Gullwing Sealing method Metal seal 100-pin ceramic QFP FPT-100C-A02 100-pin ceramic QFP (FPT-100C-A02) 0.51(.020) TYP 8.89(.350)DIA TYP 17.91(.705) TYP 16.00(.630) 14.00±0.25


    Original     		FPT-100C-A02 100-pin FPT-100C-A02) F100013SC-1-2 ceramic QFP Package 100 lead PDF

    432W6

    Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P


    Original     		240K6X-A 240P6Y-A 240P6Z-A 255F7F 256F7B 256F7X-A/B 256P6J-E 256P6K-E 272F7X-A/B 281S8-C 432W6 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228 PDF

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481 PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    ceramic QFP Package 100 lead

    Abstract: 5998a 33.8m AN 7056
    Text: Model 5998A 240 Lead QFP Test Clip with PGA, .50 mm Lead Pitch FEATURES: Test clips provide the user with an easy means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The clip mechanically attaches to a surface mounted chip.


    Original     		D1094520 ceramic QFP Package 100 lead 5998a 33.8m AN 7056 PDF

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN PDF

    FR4 substrate

    Abstract: QFP-68 28-pin SOJ SRAM FR4 epoxy
    Text: 1Cu sto m Module Ca pa bilitie s Custom Module Capabilities Flat SIP Introduction Cypress’s Multichip Products group is a leading supplier of custom memory and/or logic modules. This turnkey capability provides designers with a fast, low-risk solution for when they


    Original     		PDF

    mitsubishi 32 pin SOP

    Abstract: hssop
    Text: Single Inline Package Heat sink Single Inline Package Zig-zag Inline Package Dual Inline Package Shrink Dual Inline Package SIP HSIP ZIP DIP SDIP PACKAGE – 2.54 1.778 2.54 1.27 750 600 500 400 300 600 400 300 400 325 – – 2.54 1.778 WIDTH mil LEAD PITCH


    Original     		PDF

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages PDF

    NEC A39A

    Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
    Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES


    Original     		C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B PDF

    5998

    Abstract: No abstract text available
    Text: Modl 5998AL, 5998AL-1 240 Lead QFP Locking Test Clip, 0.50 mm Lead Pitch FEATURES: Locking test clips provides easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The special locking fingers at each corner attach to the body of the chip and hold the clip firmly against the chip leads.


    Original     		5998AL, 5998AL-1 5998AL 70atest D1094521 5998 PDF

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    ILX511B

    Abstract: CXA1691 ILX511 optical pickup unit philips cdr 870 sony car stereo CXA2549M ILX511 applications deck sound filter CIRCUIT picture CXA1733M CXD3300R
    Text: CCD Under development CCD AREA IMAGE SENSOR COLOR VIDEO CAMERA CCD IMAGE SENSOR Product name Optical format inch TV system Effective pixels (H x V) Sensitivity Typ. (mV) Package Pins Recommended timing pulse generator ICX038BNA ICX038DNA ICX039BNA ICX039DNA


    Original     		ICX038BNA ICX038DNA ICX039BNA ICX039DNA ICX038BNB ICX038DNB ICX039BNB ICX039DNB ICX054AK ICX055AK ILX511B CXA1691 ILX511 optical pickup unit philips cdr 870 sony car stereo CXA2549M ILX511 applications deck sound filter CIRCUIT picture CXA1733M CXD3300R PDF

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF