Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    CERAMIC LEADLESS CHIP CARRIER LCC 68 Search Results

    CERAMIC LEADLESS CHIP CARRIER LCC 68 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    HMC1048ALC3BTR Analog Devices Mixer 12-Terminal Ceramic LCC Visit Analog Devices Buy

    CERAMIC LEADLESS CHIP CARRIER LCC 68 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CERAMIC LEADLESS CHIP CARRIER LCC 44

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet
    Text: Ceramic Leadless Chip Carrier LCC 20 Lead Ceramic Leadless Chip Carrier, Type C NS Package Number E20A 2000 National Semiconductor Corporation MS101105 www.national.com Ceramic Leadless Chip Carrier (LCC) August 1999 Ceramic Leadless Chip Carrier (LCC)


    Original     		PDF MS101105 EA20B EA028C CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 32 LCC 44 leadless chip carrier CERAMIC LEADLESS CHIP CARRIER package datasheet

    Capacitor 0.01 uf

    Abstract: No abstract text available
    Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:53 AM Page 38 3.3 Vdc • HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASV FEATURES: • Leadless chip carrier LCC , low profile. • Tight Symmetry Option. • Tristate Enable / Disable Function.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 22355 Abracon CORX 2-29.qxd 3/6/00 6:53 AM Page 33 HCMOS/ TTL COMPATIBLE CERAMIC SURFACE MOUNT CRYSTAL CLOCK OSCILLATORS ASL FEATURES: • Leadless chip carrier LCC , low profile. • HCMOS and TTL Compatible. • Tristate Enable / Disable Function. • High Density Surface-Mount Applications.


    Original     		PDF

    7142LA25L48B

    Abstract: 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA
    Text: IDT Military Offerings FIFO Military Offerings Logic Military Offerings Multi-Port Military Offerings SRAM Military Offerings May 2005 FIFO Military Offerings FIFO Military Selector Guide by Part Number FIFO Military Selector Guide (by SMD Number) Obsolete Part List and Replacement Guide


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 7200L20TDB 7200L30TDB 7201LA20DB 7201LA30DB 7142LA25L48B 7164L20 4Kx8 sram ttl 5962-8861011UA 7206l20l 5962-8855206YA 5962-8855206 5962-8953604 54FCT244AT 5962-8855206XA

    IDT54FCT541ATDB

    Abstract: 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA
    Text: FIFO MILITARY SELECTOR GUIDE As Of: November 1, 2001 FIFO Military Offerings Page FIFO Military Selector Guide by Part Number . 3-4 FIFO Military Selector Guide (by SMD Number) . 5 Obsolete Part List and Replacement Guide . 6-8


    Original     		PDF 72401L10DB 72401L15DB 72401L25DB 72401L35DB 72403L10DB 72403L35DB 72404L15DB 72404L35DB 7200L20TDB 7200L30TDB IDT54FCT541ATDB 5962-8861011UA 54FCT543DB 5962-8986301 54FCT162245TEB 54FCT543AT 54FCT541CTDB 5962-8860802 IDT54FCT162245ATEB 5962-8855201XA

    CERAMIC LEADLESS CHIP CARRIER LCC 68

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Packages Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad


    Original     		PDF 180Pin, CERAMIC LEADLESS CHIP CARRIER LCC 68 CERAMIC LEADLESS CHIP CARRIER LCC 24 CERAMIC LEADLESS CHIP CARRIER LCC 44 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER J-Lead, plcc PLCC 44 leadless quad flat j-leaded package 12 CERAMIC LEADLESS CHIP CARRIER LCC

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    CERAMIC LEADLESS CHIP CARRIER LCC 24

    Abstract: 20P3 JEDEC TSSOP 28 LEAD PACKAGE DIMENSIONS PQFP 132
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description 44A 44 Lead, Thin (1.0 mm)


    Original     		PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		PDF 44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		PDF 120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB

    Z84C0010PEC

    Abstract: MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead
    Text: PACKAGE INFORMATION CPS95CO0125 CUSTOMER P ROCUREMENT S PECIFICA TION PACKAGE INFORMATION ORDERING CODES IC PACKAGE CODES TEMPERATURE A = VQFP Very Small QFP C = Ceramic Sidebrazed D = Cerdip E = Ceramic Window F = Plastic Quad Flatpack G = Ceramic PGA (Pin Grid Array)


    Original     		PDF CPS95CO0125 Z84C0010PEC MIL-STD-883C CPS95CO0125 84C00 10X10 Z84C90 64 CERAMIC LEADLESS CHIP CARRIER LCC ceramic QFP Package 100 lead

    Atmel 918

    Abstract: c22v10 atv750-15dm SMD CODE list smd code book "SMD Code" transistor smd list "SMD Code" 15 SMD CODES AT22V10L
    Text: SMD PLDs Introduction to the SMD Product Listing Each Standardized Military Drawing SMD part number that Atmel supplies corresponds to an Atmel /883 part number. SMD products are compliant to MIL-STD-883, paragraph 1.2.1 and to the requirements of the applicable standardized military drawing. The tables in this section list the currently approved Atmel SMD parts by Atmel


    Original     		PDF MIL-STD-883, ATV5000L-35KM/883 60-Input, 52-Output ATV750-25GM/883 22-Input, 10-Output ATV750-25NM/883 Atmel 918 c22v10 atv750-15dm SMD CODE list smd code book "SMD Code" transistor smd list "SMD Code" 15 SMD CODES AT22V10L

    MO-142

    Abstract: PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide
    Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package 1 types available. This section provides size specifications and outlines for all package types. Package Description See Page 32B 32 Lead, 0.600" Wide,


    Original     		PDF 32DW6 MO-142 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC JEDEC MO-229 atmel MO-115 64 CERAMIC LEADLESS CHIP CARRIER LCC 8S2 EIAJ SOIC CERAMIC LEADLESS CHIP CARRIER LCC 24 dd 127 dd 127 d 3302 tsop soic 20 lead wide

    ADW22035

    Abstract: ADW22035Z ADW22035Z-RL1 ADW22035Z-RL71 ADW22037 ADW22037Z1 ADW22037Z-RL1 12 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Precision ±18 g Single-/Dual-Axis iMEMS Accelerometer ADW22035/ADW22037 FEATURES FUNCTIONAL BLOCK DIAGRAMS 5V High performance, single-/dual-axis accelerometer on a single IC chip Low power: 740 A at VS = 5 V typical High zero g bias stability High sensitivity accuracy


    Original     		PDF ADW22035/ADW22037 ADW22035 ADW22037 D07755-0-10/08 ADW22035 ADW22035Z ADW22035Z-RL1 ADW22035Z-RL71 ADW22037 ADW22037Z1 ADW22037Z-RL1 12 CERAMIC LEADLESS CHIP CARRIER LCC

    gold embrittlement

    Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
    Text: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner


    Original     		PDF AN-652 ADXL78/ADXL278/ADXL193 E03707 gold embrittlement ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 dimensions CERAMIC CHIP CARRIER LCC 68 socket LCC068 LCC124 LCC084 CERAMIC LEADLESS CHIP CARRIER LCC 52 sA 673 transistor
    Text: Request / Informations diverses : a.bolis@dsmielectronics.com Sales / Ventes : sales@dsmielectronics.com HOME PRODUCT SALE DSMI Electronics SA DSMI acquires Precicontact SA assets All the standard products are available as ROHS compliant and as non ROHS upon request


    Original     		PDF MIL-STD-1344, CERAMIC CHIP CARRIER LCC 68 socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket CERAMIC LEADLESS CHIP CARRIER LCC 124 CERAMIC LEADLESS CHIP CARRIER LCC 68 dimensions CERAMIC CHIP CARRIER LCC 68 socket LCC068 LCC124 LCC084 CERAMIC LEADLESS CHIP CARRIER LCC 52 sA 673 transistor

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    kds9

    Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
    Text: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at appseng@simtek.com. For RoHS Materials


    Original     		PDF Outlin420 5x10-8 75psig PL0181 kds9 kyocera 48 lead ceramic LCC package stk 0035 n stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97

    i87C51

    Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
    Text: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30


    Original     		PDF AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 87C51 i87C51 i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614

    CERPACK K73

    Abstract: 5962-9452201MXX 5962-8606320QXA cypress palce22v10 programming guide CY54FCT373CT CE22V1 cy27c256a-250wmb LCC 20.3 30MMA CY6116A-55DMB
    Text: PALCE22V10 Flash Erasable, Reprogrammable CMOS PAL Device 5 ns tPD 181-MHz state machine Features • Low power — 90 mA max. commercial 10 ns — 130 mA max. commercial (5 ns) • CMOS Flash EPROM technology for electrical erasability and reprogrammability


    Original     		PDF PALCE22V10 181-MHz 110-MHz 15-ns 25-ns Apr-98 01Q3A CY7B991-7LMB 01MXX CERPACK K73 5962-9452201MXX 5962-8606320QXA cypress palce22v10 programming guide CY54FCT373CT CE22V1 cy27c256a-250wmb LCC 20.3 30MMA CY6116A-55DMB

    54F00DM

    Abstract: 54F00FM 54F00LM 74F00 74F00PC 74F00SC 74F00SJ J14A M14A N14A
    Text: 54F 74F00 Quad 2-Input NAND Gate General Description Features This device contains four independent gates each of which performs the logic NAND function Y Commercial Guaranteed 4000V minimum ESD protection Package Number Military 74F00PC Package Description


    Original     		PDF 74F00 74F00PC 14-Lead 14-Lead 74F00SC 74F00SJ 54F00FM 54F00DM 54F00FM 54F00LM 74F00 74F00PC 74F00SC 74F00SJ J14A M14A N14A

    Untitled

    Abstract: No abstract text available
    Text: Raytheon Electronics Semiconductor Division R296XX/R297XX S tandard PROMs and P ow er-S w itched SPROMs Features Description • Devices are available in military -55°C to +125°C temperature range • Standard PROMs are offered in power-switched SPROM


    OCR Scan     		PDF R296XX/R297XX 24-pin,