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    RadTol Eclipse FPGA

    Abstract: SW-DIP JP35 C143 T transistor fpq-352 C143 E S S transistor D 1413 transistor UT8RHEEB-208C H11-201 SN74HC14D
    Text: Standard Products UT8RHEEB-208C RadTol Eclipse FPGA UT6325 Evaluation Board Preliminary Data Sheet September 2008 www.aeroflex.com/FPGA INTRODUCTION FEATURES ‰ User configurable evaluation board for the UT6325 RadTol Eclipse FPGAs ‰ Supports the 208 ceramic quad flatpack


    Original     		PDF UT8RHEEB-208C UT6325 RadTol Eclipse FPGA SW-DIP JP35 C143 T transistor fpq-352 C143 E S S transistor D 1413 transistor H11-201 SN74HC14D

    L1A4474

    Abstract: L1A4 k1698
    Text: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.


    Original     		PDF 5998AL, 5998AL-1 5998AL-2 00\D5998AL L1A4474 L1A4 k1698

    xc68360

    Abstract: No abstract text available
    Text: Pomona Model 5998AL, 5998AL-1 & 5998AL-2 240 Lead QFP Locking Test Clip 0.50 mm Lead Pitch These new locking test clips provide the user with an easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips.


    Original     		PDF 5998AL, 5998AL-1 5998AL-2 Goldberg\FlukeDataSheet\d5998AL xc68360

    ceramic QFP Package 100 lead

    Abstract: 5998a 33.8m AN 7056
    Text: Model 5998A 240 Lead QFP Test Clip with PGA, .50 mm Lead Pitch FEATURES: Test clips provide the user with an easy means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The clip mechanically attaches to a surface mounted chip.


    Original     		PDF D1094520 ceramic QFP Package 100 lead 5998a 33.8m AN 7056

    5998

    Abstract: No abstract text available
    Text: Modl 5998AL, 5998AL-1 240 Lead QFP Locking Test Clip, 0.50 mm Lead Pitch FEATURES: Locking test clips provides easy and reliable means to connect instrumentation to the SMT leads of 240 pin plastic, metal and ceramic quad flatpack QFP chips. The special locking fingers at each corner attach to the body of the chip and hold the clip firmly against the chip leads.


    Original     		PDF 5998AL, 5998AL-1 5998AL 70atest D1094521 5998

    7C245

    Abstract: b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C T229X, W42C31, 231XNZ WB1330, 7C245 b1225 CERAMIC QUAD FLATPACK CQFP 22V10 PAL CMOS device 228X 16R8 7B991 PAL20 7C404 7C128

    16v8 PLD

    Abstract: 48C101 7c63000a 7C128 2061A B1225 CERAMIC QUAD FLATPACK CQFP
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 C = CMOS B = BiCMOS SUFFIX -45 D M B -70 S C -35 P C -15 J C -25 AS C -5 J C FAMILY CMOS SRAM - FAST


    Original     		PDF 7C128 62256L 7C245L 7C09389V 7C4292V 7B991 MIL-STD-883C 48C101, W42C31, 231XNZ 16v8 PLD 48C101 7c63000a 2061A B1225 CERAMIC QUAD FLATPACK CQFP

    CERAMIC QUAD FLATPACK CQFP

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C 231XNZ 7C63000A CERAMIC QUAD FLATPACK CQFP 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device

    HS-1840ARH

    Abstract: 5962F9563002VYC CERAMIC FLATPACK hs-1840RH 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840 CDFP3-F28 1840arh
    Text: HS-1840ARH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection July 1997 Description Description • Pin-to-Pin for Harris’ HS-1840RH and HS-1840/883S • MIL-PRF-38535 Screened to DSCC SMD 5962F95630


    Original     		PDF HS-1840ARH HS-1840RH HS-1840/883S MIL-PRF-38535 5962F95630 HS-1840ARH 038mm) 5962F9563002VYC CERAMIC FLATPACK 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840 CDFP3-F28 1840arh

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    HS9-1840BRH-Q 5962F9563003VYC

    Abstract: hs9-1840aeh HS-1840 HS9-1840ARH-Q 5962-95630 cdfp3-f28 5962F9563002VYC smd transistor ea HS-1840BEH 5962F9563003VYC
    Text: Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Features The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed


    Original     		PDF HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH HS-1840BRH HS-1840BEH 038mm) FN4355 HS9-1840BRH-Q 5962F9563003VYC hs9-1840aeh HS-1840 HS9-1840ARH-Q 5962-95630 cdfp3-f28 5962F9563002VYC smd transistor ea 5962F9563003VYC

    HS-1840ARH

    Abstract: No abstract text available
    Text: Rad-Hard 16 Channel BiCMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH Features The HS-1840ARH, HS-1840AEH, HS-1840BRH and HS-1840BEH are radiation hardened, monolithic 16 channel multiplexers constructed


    Original     		PDF HS-1840ARH, HS-1840AEH, HS-1840BRH, HS-1840BEH HS-1840BRH HS-1840BEH 038mm) FN4355 HS-1840ARH

    smd marking f2

    Abstract: 5962F9563002VYC smd transistor ea HS-1840 hs1840 HS9-1840ARH-Q smd 1n4002 HS-1840ARH
    Text: Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection HS-1840ARH, HS-1840AEH, HS-1840BRH Features TheHS-1840ARH, HS-1840AEH, HS-1840BRH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil RadHard Silicon Gate, bonded wafer, Dielectric Isolation process. They are


    Original     		PDF HS-1840ARH, HS-1840AEH, HS-1840BRH TheHS-1840ARH, HS-1840BRH 038mm) FN4355 smd marking f2 5962F9563002VYC smd transistor ea HS-1840 hs1840 HS9-1840ARH-Q smd 1n4002 HS-1840ARH

    HS-1840ARH

    Abstract: 5962F9563002VYC HS-1840 hs1840 HS9-1840ARH-Q 5962-95630 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840RH
    Text: HS-1840ARH, HS-1840BRH Features The HS-1840ARH, HS-1840BRH are radiation hardened, monolithic 16 channel multiplexers constructed with the Intersil Rad-Hard Silicon Gate, bonded wafer, Dielectric Isolation process. They are designed to provide a high input


    Original     		PDF HS-1840ARH, HS-1840BRH HS-1840BRH 038mm) FN4355 HS-1840ARH 5962F9563002VYC HS-1840 hs1840 HS9-1840ARH-Q 5962-95630 5962F9563002QXC 5962F9563002QYC 5962F9563002VXC HS-1840RH

    KD 2107

    Abstract: A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type A B C


    Original     		PDF A5580-01 KD 2107 A5515 A5568-01 A54450 PQFP 132 PACKAGE DIMENSION intel A5500-01 A5522-01 A5506 Intel 1702 eprom PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS

    TO metal package aluminum kovar

    Abstract: Side Brazed Ceramic Dual-In-Line Packages ceramic pin grid array package lead finish gold CERAMIC FLATPACK socket CERAMIC LEADLESS CHIP CARRIER LCC 52 socket metal can equivalent national
    Text: Hermetic Packages National Semiconductor offers a wide variety of ceramic and metal can packages for through-hole and surface mount applications. These ceramic and metal can packages are offered as solutions for high reliability and often high performance applications, and are extensively used in military/


    Original     		PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    Untitled

    Abstract: No abstract text available
    Text: Radiation Hardened, Low Noise Quad Operational Amplifiers HS-5104ARH, HS-5104AEH Features The HS-5104ARH, HS-5104AEH are radiation hardened, monolithic quad operational amplifiers that provide highly reliable performance in harsh radiation environments. Excellent noise characteristics coupled with a unique array of


    Original     		PDF HS-5104ARH, HS-5104AEH HS-5104AEH 100kRAD FN3025

    HS-1840ARH

    Abstract: smd transistor marking F4 63002VXC "top mark" intersil smd transistor marking A3 F5 smd marking transistor SMD T28 5962F9563002QXC 5962F9563002VXC HS-1840RH
    Text: HS-1840ARH Data Sheet July 27, 2009 Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection FN4355.2 Features • Electrically Screened to SMD # 5962-95630 • QML Qualified per MIL-PRF-38535 Requirements The HS-1840ARH is a radiation hardened, monolithic 16


    Original     		PDF HS-1840ARH FN4355 MIL-PRF-38535 HS-1840ARH 038mm) smd transistor marking F4 63002VXC "top mark" intersil smd transistor marking A3 F5 smd marking transistor SMD T28 5962F9563002QXC 5962F9563002VXC HS-1840RH

    diode databook package outline

    Abstract: sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC
    Text: Package / Module / PC Card Outlines and Dimensions 2 Intel Product Identification Codes NG 8 3 8 6 S X 1 Up to15 Alphanumeric Characters For Device Types 6 S X 3 8 7 Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements Package Type – –


    Original     		PDF A5579-01 A5580-01 diode databook package outline sip Connector, Pitch 2.5mm, 4 pin PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC a5501 A5540 Side Brazed Ceramic Dual-In-Line Packages Side Brazed Ceramic Dual-In-Line Packages 28 EPROM databook 35 x 35 PBGA, 580 100 balls 64 CERAMIC LEADLESS CHIP CARRIER LCC

    HS-1840ARH

    Abstract: No abstract text available
    Text: HS-1840ARH S E M I C O N D U C T O R Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection July 1997 Description Description • Pin-to-Pin for Harris’ HS-1840RH and HS-1840/883S • MIL-PRF-38535 Screened to DSCC SMD 5962F95630


    OCR Scan     		PDF HS-1840ARH HS-1840RH HS-1840/883S MIL-PRF-38535 5962F95630 500MQ HS-1840ARH 2820pm

    Untitled

    Abstract: No abstract text available
    Text: SEC pPB100474 1,024, X 4-Bit 100K ECL RAM NEC Electronics Inc. Description Pin Configurations NEC’s /JPB100474 is a very high-speed 100K interface ECL RAM organized as 1,024 words by 4 bits and designed with open-emitter, noninverted outputs. It is available in a 24-pin cerdip, 24-pin ceramic LCC, or


    OCR Scan     		PDF pPB100474 /JPB100474 24-pin 1024-word 83IK-6164B fiPB100474

    TAA710

    Abstract: No abstract text available
    Text: /xPB100422 256 X 4-Bit 100K ECL RAM W NEC Electronics Inc. Description Pin Configurations The fiPB100422 is a very high-speed 100K interface ECL RAM organized as 256 words by 4 bits and designed with noninverted, open-emitter outputs and low power con­ sumption. Two versions with fast access times of 7 or


    OCR Scan     		PDF uPB100422 256x4-Bit fiPB100422 24-pin 256-word 400-mil, MPB100422 TAA710

    Untitled

    Abstract: No abstract text available
    Text: Í*PB100422 256 X 4-Blt 100K ECL RAM NEC Electronics Inc. Description Pin Configurations The iiPB100422 is a very high-speed 100K interface ECL RAM organized as 256 words by 4 bits and designed with noninverted, open-emitter outputs and low power con­ sumption. Two versions with fast access times of 7 or


    OCR Scan     		PDF uPB100422 iiPB100422 24-pin 256-word 400-mil, tim88 jiPB100422