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    CDIP Search Results

    CDIP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    26LS29/BEA Rochester Electronics LLC Rochester Manufactured 26LS29, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    EP610DM-35/B Rochester Electronics LLC Rochester Manufactured EP610, LOGIC (EPLD), 28 CDIP Package, Mil Temp spec. Visit Rochester Electronics LLC Buy
    26LS31/BEA Rochester Electronics LLC Rochester Manufactured 26LS31, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    EP910DI-25 Rochester Electronics LLC Rochester Manufactured EP910, LOGIC (EPLD), 40 CDIP Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
    MC6821CS Rochester Electronics LLC Rochester Manufactured 6821, Interface, 40 CDIP Package, Industrial Temp spec. Visit Rochester Electronics LLC Buy
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    CDIP Price and Stock

    Amphenol FCi PPC-DIP-308-726C

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics PPC-DIP-308-726C 772
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    M-Systems Corp DOC-DIP DIMM-EVB-PCI

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics DOC-DIP DIMM-EVB-PCI 1
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    TT Electronics plc DIP-1999-01-1003-FB

    100K OHM 1% 100PPM 16PIN DIP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI DIP-1999-01-1003-FB Tube 1
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    TT Electronics plc DIP-1989-02-1003-B

    Resistor Networks & Arrays 100K 0.1% 50PPM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI DIP-1989-02-1003-B Tube 120
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    MikroElektronika READY FOR PIC (DIP28)

    Dev.kit: Microchip PIC; Components: PIC18F25K22; PIC18
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME READY FOR PIC (DIP28) 2 1
    • 1 $55.2
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    CDIP Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CDIP Amkor Technology Ceramic Dual-Inline Package Original PDF
    CDIP2-T8 Intersil Obsolete Product Datasheet Original PDF

    CDIP Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 23-Jun-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) 5962-9451301MPA ACTIVE CDIP JG


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    23-Jun-2013 5962-9451301MPA 9451301MPA UCC1801 5962-9451302MPA 9451302MPA UCC1802 5962-9451303MPA 9451303MPA UCC1803 PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) 5962-9557401QCA ACTIVE CDIP J


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    24-Jan-2013 5962-9557401QCA 5962-9557401QC SNJ5432J 5962-9557401QDA 5962-9557401QD SNJ5432W JM38510/30501B2A JM38510/ 30501B2A PDF

    JM38510/01405BEA

    Abstract: SN54365A
    Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9687802QEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type 5962-9687802QFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type 1 Package Drawing


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    12-Jan-2006 5962-9687802QEA 5962-9687802QFA JM38510/16303BEA JM38510/16304BEA JM38510/32201B2A JM38510/01405BEA SN54365A PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN54S134J ACTIVE CDIP J 16 SN74S134N OBSOLETE PDIP N 16 1 Lead/Ball Finish MSL Peak Temp (3) TBD Call TI


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    26-Sep-2005 SN54S134J SN74S134N SNJ54S134J SNJ54S134W SNJ54S134W PDF

    Untitled

    Abstract: No abstract text available
    Text: SDLS042A - MAY 1983 - REVISED MAY 2005 A PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9755301QCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type 5962-9755301QDA ACTIVE CFP W 14 1 TBD Call TI


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    SDLS042A 12-Jan-2006 5962-9755301QCA 5962-9755301QDA SN54121J SN74121D SN74121DE4 SN74121DR SN74121DRE4 SN74121N PDF

    max303

    Abstract: No abstract text available
    Text: SCOPE: PRECISION DUAL HIGH SPEED ANALOG SWITCHES Device Type 01 02 03 Generic Number MAX301M x /883B MAX303M(x)/883B MAX305M(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter JE LP Mil-Std-1835 GDIP1-T16 or CDIP2-T16


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    MAX301M /883B MAX303M MAX305M /883B Mil-Std-1835 GDIP1-T16 CDIP2-T16 max303 PDF

    SN74LS09DR

    Abstract: SN7409N
    Text: PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8001901CA ACTIVE CDIP J 14 1


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    5-Sep-2011 0019012A 8001901CA 8001901DA SN54LS09J SN54S09J SN74LS09DR SN7409N PDF

    2012 ics class X date sheet

    Abstract: HCS32D HCS32DMSR HCS32HMSR HCS32K HCS32KMSR HCS32MS
    Text: HCS32MS Radiation Hardened Quad 2-Input OR Gate September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14 TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg


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    HCS32MS MIL-STD-1835 CDIP2-T14 -55oC 125oC 05A/cm2 2012 ics class X date sheet HCS32D HCS32DMSR HCS32HMSR HCS32K HCS32KMSR HCS32MS PDF

    HCS109MS

    Abstract: CDFP4-F16 HCS109DMSR HCS109HMSR HCS109KMSR HCS109
    Text: HCS109MS Radiation Hardened Dual JK Flip Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg


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    HCS109MS MIL-STD-1835 CDIP2-T16, 05A/cm2 HCS109 TA14340A. HCS109MS CDFP4-F16 HCS109DMSR HCS109HMSR HCS109KMSR PDF

    HCS244DMSR

    Abstract: HCS244HMSR HCS244KMSR HCS244MS
    Text: HCS244MS Radiation Hardened Octal Buffer/Line Driver, Three-State September 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • 3 Micron Radiation Hardened CMOS SOS • Total Dose 200K RAD (Si)/s


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    HCS244MS MIL-STD-1835 CDIP2-T20 HCS244DMSR HCS244HMSR HCS244KMSR HCS244MS PDF

    HCS164DMSR

    Abstract: HCS164HMSR HCS164KMSR HCS164MS
    Text: HCS164MS Radiation Hardened 8-Bit Serial-In/Parallel-Out Register September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)


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    HCS164MS MIL-STD-1835 CDIP2-T14, 94mils 05A/cm2 HCS164DMSR HCS164HMSR HCS164KMSR HCS164MS PDF

    CDFP4-F16

    Abstract: HCS193DMSR HCS193HMSR HCS193KMSR HCS193MS
    Text: HCS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)


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    HCS193MS MIL-STD-1835 CDIP2-T16, -55oC 125oC 05A/cm2 CDFP4-F16 HCS193DMSR HCS193HMSR HCS193KMSR HCS193MS PDF

    HCTS86D

    Abstract: HCTS86DMSR HCTS86HMSR HCTS86K HCTS86KMSR HCTS86MS
    Text: HCTS86MS TM Radiation Hardened Quad 2-Input Exclusive OR Gate October 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)


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    HCTS86MS MIL-STD-1835 CDIP2-T14, -55oC 125oC HCTS86D HCTS86DMSR HCTS86HMSR HCTS86K HCTS86KMSR HCTS86MS PDF

    vw 9a engines

    Abstract: ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS
    Text: ACTS373MS Radiation Hardened Octal Transparent Latch, Three-State April 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si • Single Event Upset (SEU) Immunity


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    ACTS373MS MIL-STD-1835 CDIP2-T20, -55oC 125oC vw 9a engines ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS PDF

    HCS00HMSR

    Abstract: HCS00D HCS00DMSR HCS00K HCS00KMSR HCS00MS
    Text: HCS00MS Radiation Hardened Quad 2-Input NAND Gate August 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T14 TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg


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    HCS00MS MIL-STD-1835 CDIP2-T14 -55oC 125oC 05A/cm2 HCS00HMSR HCS00D HCS00DMSR HCS00K HCS00KMSR HCS00MS PDF

    HCS273KMSR

    Abstract: HCS273 HCS273DMSR HCS273HMSR HCS273MS
    Text: HCS273MS Radiation Hardened Octal D Flip-Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg


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    HCS273MS MIL-STD-1835 CDIP2-T20, -55oC 125oC 05A/cm2 HCS273 TA14307B. HCS273KMSR HCS273DMSR HCS273HMSR HCS273MS PDF

    HCS573DMSR

    Abstract: HCS573HMSR HCS573KMSR HCS573MS
    Text: HCS573MS Radiation Hardened Octal Transparent Latch, Three-State September 1995 Features • • • • • • • • • • • • • Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20, LEAD FINISH C TOP VIEW 3 Micron Radiation Hardened SOS CMOS


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    HCS573MS MIL-STD-1835 CDIP2-T20, -55oC 125oC 05A/cm2 HCS573DMSR HCS573HMSR HCS573KMSR HCS573MS PDF

    CDFP4-F16

    Abstract: HCTS161ADMSR HCTS161AHMSR HCTS161AKMSR HCTS161AMS
    Text: HCTS161AMS Radiation Hardened Synchronous Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • Minimum LET for SEU Upsets: >100 MEV-cm2/mg


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    HCTS161AMS MIL-STD-1835 CDIP2-T16, -55oC 125oC 104mils 05A/cm2 HCTS161A CDFP4-F16 HCTS161ADMSR HCTS161AHMSR HCTS161AKMSR HCTS161AMS PDF

    HCTS374DMSR

    Abstract: HCTS374HMSR HCTS374KMSR HCTS374MS 107OC
    Text: HCTS374MS Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered August 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • Total Dose 200K RAD (Si)


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    HCTS374MS MIL-STD-1835 CDIP2-T20 HCTS374DMSR HCTS374HMSR HCTS374KMSR HCTS374MS 107OC PDF

    y6 smd

    Abstract: Y5 smd transistor smd transistor y5 y4 smd transistor Y5 smd Y6 11 y6 smd transistor 5962F9671001VRC 5962F9671001VXC ACS541HMSR
    Text: ACS541MS Radiation Hardened Octal Buffer/ Line Driver Three-State January 1996 Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • Detailed Electrical and Screening Requirements are Contained in


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    ACS541MS MIL-PRF-38535 MIL-STD-1835 CDIP2-T20, 600mm 600mm y6 smd Y5 smd transistor smd transistor y5 y4 smd transistor Y5 smd Y6 11 y6 smd transistor 5962F9671001VRC 5962F9671001VXC ACS541HMSR PDF

    SNJ54121J

    Abstract: sn74121 5962-9755301QCA 5962-9755301QDA SN54121J SN74121D SN74121DE4 SN74121DR SN74121DRE4 SN74121N
    Text: SDLS042A - MAY 1983 - REVISED MAY 2005 A PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9755301QCA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC 5962-9755301QDA ACTIVE CFP W 14 1 TBD Call TI


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    SDLS042A 26-Sep-2005 5962-9755301QCA 5962-9755301QDA SN54121J SN74121D Level-1-260C-UNLIM SN74121DE4 Level-1-260C-UNLplifiers SNJ54121J sn74121 5962-9755301QCA 5962-9755301QDA SN54121J SN74121D SN74121DE4 SN74121DR SN74121DRE4 SN74121N PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 JM38510/00903BCA OBSOLETE CDIP J 14 TBD Call TI Call TI JM38510/30605B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC Package Type Package Drawing Pins Package Eco Plan (2)


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    26-Sep-2005 JM38510/00903BCA JM38510/30605B2A JM38510/30605BCA JM38510/30605BDA PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty SN5454J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN54LS54J ACTIVE CDIP J 14 1 TBD A42 SNPB


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    6-Dec-2006 SN5454J SN54LS54J SN7454N SN74LS54D SN74LS54DR PDF

    Untitled

    Abstract: No abstract text available
    Text: PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type 5962-9558301QEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type 5962-9558301QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type 5962-9558301QFA ACTIVE


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    18-Jul-2006 5962-9558301QEA 5962-9558301QFA 8001701EA 8001701FA JM38510/30609B2A PDF