DG509A
Abstract: CERAMIC FLATPACK 20pin dg509aal
Text: SCOPE: MONOLITHIC CMOS, ANALOG MULTIPLEXER Device Type 01 02 Generic Number DG508AA x /883B DG509AA(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter K L P Z Mil-Std-1835 GDIP1-T16 or CDIP2-T16 CDFP4-16
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DG508AA
/883B
DG509AA
/883B
Mil-Std-1835
GDIP1-T16
CDIP2-T16
CDFP4-16
DG509A
CERAMIC FLATPACK 20pin
dg509aal
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CDFP4-F24
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F24
350ied.
038mm)
CDFP4-F24
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5962-8750401XA
Abstract: qml-38535 5962-8750401EA CDFP4-F16 GDFP2-F16 GDIP1-T16 AS10H504F16
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R029-92. thn 91-11-22 Mionica L. Poelking B Changes according to NOR 5962-R130-93. tvn 93-04-12 Thomas M. Hess C Add package CDFP4-F16. Change document to current electronic format.
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5962-R029-92.
5962-R130-93.
CDFP4-F16.
0EU86
5962-8750401XA
qml-38535
5962-8750401EA
CDFP4-F16
GDFP2-F16
GDIP1-T16
AS10H504F16
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cdfp4-f16
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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MIL-STD-1835
CDFP4-F16
038mm)
cdfp4-f16
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cdfp4-f16
Abstract: No abstract text available
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K16.A MIL-STD-1835 CDFP4-F16 (F-5A, CONFIGURATION B) 16 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F16
245lied.
038mm)
cdfp4-f16
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10H524
Abstract: 5962-8756001ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 "5962-8756001FA"
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes in Table I. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs
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5962-R268-92.
CDFP4-F16.
0EU86
10H524
5962-8756001ea
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
"5962-8756001FA"
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10H525
Abstract: 5962-8750801ea MTL10H525EA qml-38535 AS10H525F16/883C MTL10H5252A CDFP4-F16 GDFP2-F16 GDIP1-T16 MTL10H525FA
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs
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5962-R107-93.
CDFP4-F16.
0EU86
10H525
5962-8750801ea
MTL10H525EA
qml-38535
AS10H525F16/883C
MTL10H5252A
CDFP4-F16
GDFP2-F16
GDIP1-T16
MTL10H525FA
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qml-38535
Abstract: CDFP4-F16 GDFP2-F16 GDIP1-T16 10h576
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Changes according to NOR 5962-R106-93. - ltg 93-03-29 Monica L. Poelking B Add package CDFP4-F16. Change document to current electronic format. Editorial changes throughout. - les 98-02-04 Raymond Monnin
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5962-R106-93.
CDFP4-F16.
0EU86
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
10h576
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Untitled
Abstract: No abstract text available
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Made technical changes to Table I. Figure 4 added. Editorial changes throughout. mlp 92-01-27 Monica L. Poelking B Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate. ljs
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5962-R107-93.
CDFP4-F16.
MIL-PRF-38535
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Untitled
Abstract: No abstract text available
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
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Untitled
Abstract: No abstract text available
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
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CDFP4-F20
Abstract: K20.A Package k20a
Text: Hermetic Packages for Integrated Circuits Ceramic Metal Seal Flatpack Packages Flatpack K20.A MIL-STD-1835 CDFP4-F20 (F-9A, CONFIGURATION B) 20 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN
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MIL-STD-1835
CDFP4-F20
245lied.
038mm)
CDFP4-F20
K20.A Package
k20a
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Untitled
Abstract: No abstract text available
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
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max703mja
Abstract: MAX643 MAX813LMJA OP-07P DG509AAL max708MJA MAX8211MFB MX7502SQ Group Specs 82 19-0053 G100 10 CAN DG200AAK/883B DG200AAK/883B DG201AAK/883B DG201AA IH5048
Text: SCOPE: QUAD SPST CMOS ANALOG SWITCHES Device Type 01 02 Generic Number DG201AA x /883B DG202A(x)/883B Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows: Outline Letter L K Z Mil-Std-1835 CDFP4-F16 GDIP1-T16 or CDIP2-T16
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DG201AA
/883B
DG202A
/883B
Mil-Std-1835
CDFP4-F16
GDIP1-T16
CDIP2-T16
CQCC1-N20
max703mja
MAX643
MAX813LMJA
OP-07P
DG509AAL
max708MJA
MAX8211MFB
MX7502SQ
Group Specs 82 19-0053 G100 10 CAN DG200AAK/883B DG200AAK/883B DG201AAK/883B DG201AA
IH5048
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CDFP4-F24
Abstract: No abstract text available
Text: Ceramic Package Ceramic Metal Seal Flatpack Packages Flatpack K24.A MIL-STD-1835 CDFP4-F24 (F-6A, CONFIGURATION B) 24 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE A e A INCHES PIN NO. 1 ID AREA -A- D -B- S1 b MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.045
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MIL-STD-1835
CDFP4-F24
038mm)
CDFP4-F24
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CDFP4-F16
Abstract: HCTS193DMSR HCTS193HMSR HCTS193KMSR HCTS193MS
Text: HCTS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features • • • • • • • • • • • • • Pinouts 3 Micron Radiation Hardened CMOS SOS Total Dose 200K RAD Si SEP Effective LET No Upsets: >100 MEV-cm2/mg Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/BitDay (Typ)
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HCTS193MS
-55oC
125oC
05A/cm2
HCTS193
TA14451A.
CDFP4-F16
HCTS193DMSR
HCTS193HMSR
HCTS193KMSR
HCTS193MS
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HCS109MS
Abstract: CDFP4-F16 HCS109DMSR HCS109HMSR HCS109KMSR HCS109
Text: HCS109MS Radiation Hardened Dual JK Flip Flop September 1995 Features Pinouts • 3 Micron Radiation Hardened SOS CMOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si) • SEP Effective LET No Upsets: >100 MEV-cm2/mg
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HCS109MS
MIL-STD-1835
CDIP2-T16,
05A/cm2
HCS109
TA14340A.
HCS109MS
CDFP4-F16
HCS109DMSR
HCS109HMSR
HCS109KMSR
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HCS244DMSR
Abstract: HCS244HMSR HCS244KMSR HCS244MS
Text: HCS244MS Radiation Hardened Octal Buffer/Line Driver, Three-State September 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T20 TOP VIEW • 3 Micron Radiation Hardened CMOS SOS • Total Dose 200K RAD (Si)/s
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HCS244MS
MIL-STD-1835
CDIP2-T20
HCS244DMSR
HCS244HMSR
HCS244KMSR
HCS244MS
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ISL4422ARH
Abstract: 5962F0152101QXC ISL7442ARH 5962F0152101VXC CDFP4-F16 HS-1825ARH IS-1845ASRH ISL74422ARH ISL74422ARHQF ISL74422ARHVF
Text: ISL74422ARH Data Sheet itle L74 2AR ea bt adian rded , nertwer ST iv utho ) eyrds terrpoion, minctor, dian rded, d rd, ace, tel, June 2001 Radiation Hardened 9A, Non-Inverting Power MOSFET Drivers File Number 9031.1 Features • QML Qualified per MIL-PRF-38535 Requirements
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ISL74422ARH
MIL-PRF-38535
ISL4422ARH
5962F0152101QXC
ISL7442ARH
5962F0152101VXC
CDFP4-F16
HS-1825ARH
IS-1845ASRH
ISL74422ARH
ISL74422ARHQF
ISL74422ARHVF
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CDFP4-F16
Abstract: HCS193DMSR HCS193HMSR HCS193KMSR HCS193MS
Text: HCS193MS Radiation Hardened Synchronous 4-Bit Up/Down Counter September 1995 Features Pinouts • 3 Micron Radiation Hardened CMOS SOS 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE SBDIP MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW • Total Dose 200K RAD (Si)
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HCS193MS
MIL-STD-1835
CDIP2-T16,
-55oC
125oC
05A/cm2
CDFP4-F16
HCS193DMSR
HCS193HMSR
HCS193KMSR
HCS193MS
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5962F9956002VXC
Abstract: 5962F9956001VXC HS-4424RH 4424 FS055 HS-4424BRH HS9-4424BRH-8 5962-F9956002QXC HS9-4424RH-8 SMD SINGLE GATE
Text: HS-4424RH, HS-4424BRH Data Sheet June 1999 Radiation Hardened Dual, Non-Inverting Power MOSFET Drivers The Radiation Hardened HS-4424RH and HS-4424BRH are non-inverting, dual, monolithic high-speed MOSFET drivers designed to convert TTL level signals into high current
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HS-4424RH,
HS-4424BRH
HS-4424RH
HS-4424BRH
HS-1825ARH
FS055,
5962F9956002VXC
5962F9956001VXC
4424
FS055
HS9-4424BRH-8
5962-F9956002QXC
HS9-4424RH-8
SMD SINGLE GATE
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vw 9a engines
Abstract: ACTS373DMSR ACTS373HMSR ACTS373KMSR ACTS373MS
Text: ACTS373MS Radiation Hardened Octal Transparent Latch, Three-State April 1995 Features Pinouts 20 LEAD CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR, CDIP2-T20, LEAD FINISH C TOP VIEW • 1.25 Micron Radiation Hardened SOS CMOS • Total Dose 300K RAD Si • Single Event Upset (SEU) Immunity
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ACTS373MS
MIL-STD-1835
CDIP2-T20,
-55oC
125oC
vw 9a engines
ACTS373DMSR
ACTS373HMSR
ACTS373KMSR
ACTS373MS
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5962-8756001EA
Abstract: 87-11-24 qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16 10H524 C0840
Text: REVISIONS LTR DESCRIPTIO N DATE YR -M O -D A A PPR O VED A Made technical changes in Table I. Editorial changes throughout, mlp 92-01-27 Monica L. Poelking B C hanges in accordance with NOR 5962-R268-92. tvn 92-08-04 Monica L. Poelking C Add package CDFP4-F16. Use new boilerplate.
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5962-R268-92.
CDFP4-F16.
0EU86
TGD470Ã
5962-8756001EA
87-11-24
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
10H524
C0840
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SMD ic 431c
Abstract: 10H525 5962-8750801ea qml-38535 CDFP4-F16 GDFP2-F16 GDIP1-T16
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA A Made technical changes to Table 1. Figure 4 added. throughout, mlp B Editorial changes APPROVED 92-01-27 Monica L. Poelking Changes in accordance with NOR 5962-R107-93. tvn 93-04-01 Monica L. Poelkinq C Add package CDFP4-F16. Use new boilerplate. Ijs
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5962-R107-93.
CDFP4-F16.
0EU86
TDG470Ã
SMD ic 431c
10H525
5962-8750801ea
qml-38535
CDFP4-F16
GDFP2-F16
GDIP1-T16
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