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    CC1206HNP Search Results

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    CC1206HNP Price and Stock

    TDK Corporation CC1206HNPO821J

    CC1206HNPO821J
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components CC1206HNPO821J 5,433
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    TDK Corporation CC1206HNPO680J

    C1206G680J050
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components CC1206HNPO680J 2,955
    • 1 $0.16
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    • 100 $0.16
    • 1000 $0.072
    • 10000 $0.052
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    TDK Corporation CC1206HNPO100J

    C1206G100J050
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Quest Components CC1206HNPO100J 1,937
    • 1 $0.198
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    • 100 $0.198
    • 1000 $0.1056
    • 10000 $0.0858
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    Others CC1206HNP0220J

    AVAILABLE EU
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    ComSIT USA CC1206HNP0220J 8,925
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    TDK Corporation CC1206HNPO470J

    INSTOCK
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Chip 1 Exchange CC1206HNPO470J 2,000
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    Find more CC1206HNP price and stock on Findchips.com

    CC1206HNP Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    CC1206HNP0152JTR

    Abstract: CC0603HNP0331JTR CC0805HNP0220JTR CC0603H CC0603HNP0 CC0805HNP0150J CC0805HNP0470JTR CC0805HNP0102J cc0603HNP0470JTR CC0603HNP0121J
    Text: 1/2 CLASS I C0G CERAMIC CAPACITORS CC SERIES • IECQ APPROVED • FUJI BULK CASSETTES AVAILABLE CLASS I, Temperature Compensated: CLASS II, High Dielectric Constant: C0G X7R & Y5V SPECIFICATIONS PARAMETER Temperature range Temp. coefficients Q or dielectric diss’n factor tan δ


    Original     		30ppm/ 10-30pF: 330pF CC1206HNP0391JTR 390pF CC1206HNP0471JTR 470pF CC1206HNP0561JTR 560pF CC1206HNP0681JTR CC1206HNP0152JTR CC0603HNP0331JTR CC0805HNP0220JTR CC0603H CC0603HNP0 CC0805HNP0150J CC0805HNP0470JTR CC0805HNP0102J cc0603HNP0470JTR CC0603HNP0121J PDF

    npo 22j

    Abstract: C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105
    Text: CAPACITORS C A P AC ITO R S Ceramic Chip TDK’s n4k> Sub-Miniature chip capacitor additions answer tbe electronics industry’s needfo r , bigber density packaging. TDK’s advanced technology allows fo r smaller size, bigbest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		30ppm/ VoltageR1C473M CKCA43X7R1C104M CKCA43Y5V1H223Z CKCA43V5V1H473Z CKCA43Y5V1H1 CKCA43X7R1H471M CA43X7R1H102M OCA43X7R1H222M CA43X7R npo 22j C2012COG1H capacitor type 104z 50v capacitors 22j NPO ceramic Y5V 104Z V104Z CC0603HNP0120J CC0805C CC0805HNPO C3216Y5V1C105 PDF

    L64811

    Abstract: M14008 video frame buffer AM27C256-205JC L64853 L64801 L64S24 L64825
    Text: LSI ILOGIC 53G4ÖC4 DDlllSfl 7 3 cì BBLLC L64825 SBus Video Frame Buffer Technical Manual E3 S304504 ODll'iS'J b7S EE3LLC This document is preliminary. As such, it contains data derived from func­ tional simulations and performance estimates. LSI Logic has not verified the


    OCR Scan     		L64825 S304504 D-102 SparKTT-20 SparKIT-20 ST02T00 L64811 M14008 video frame buffer AM27C256-205JC L64853 L64801 L64S24 PDF

    capacitor 104m z5u 50

    Abstract: 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K
    Text: CAPACITORS Ceramic Chip Electrical Specification Capacitance Range Temperature Characteristic 10pF to 10.0p,F NPO: 0±30ppm /°C -55°C to + 125°C 1Vrms, 1kHz 25°C X7R: NPO 1,000pF and less: 1MHz X5R: ±15% (-55°C to +85°C) Y5V: +22-82% (-30°C to +85°C)


    OCR Scan     		000pF 30ppm C3216Y5V1H474Z C3216Y5V1H105Z 1206EZ5U CC1206EZ5U224M C3216Z5U1E104M C3216Z5U1E224M CC1210CY5V106Z C3225Y5V1C capacitor 104m z5u 50 104m Z5U 50 TDK CC0805HNP CC0603H CC0805HX7R104K CC0805HX7R103K Z5U 104M C3216COG1H CC1206HNP0392J CC0603HX7R103K PDF

    CC0603HNP0

    Abstract: C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J
    Text: CAPACITORS CAPACITORS Ceramic Chip ti TDK’s ndbi Sub-Miniature chip capacitor additions answer tbe electronics industry’s need fo r , higher density packaging. TDK’s advanced technology allows fo r smaller size, highest capaci­ tance, increased reliability, and automated assembly. Applications include computers and


    OCR Scan     		CA43X7R1H CKCA43X7R1H CKCA43Y5V1H223Z CKCA43V5V1H473Z 43Y5V1H C224Z CKCA43Y5V1C474Z CC0603HNP0 C1608COG1H 1h473m CC0805HNP0 CC0805HNP0151J C1608COG1H820J PDF