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    CBZ1206-202-30

    Abstract: CBZ1206-202 CBC0805-600-202 cbz0805-252-20 CBC0603-600-102 CBP0805-600-152 cbc0805-12-152 CBC0603-470-102 ACB-0805A CBG0402-120-10
    Text: MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES 100% NO LEAD terminal component Multilayer technology, offering Monolithic structure, excellent for high reliability 100% Magnetic shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance


    Original     		PDF HP-4291A HP-16192A HP-663000 CBP0805-30-502 CBP0805-100-402 CBP0805-220-302 CBP0805-330-252 CBP0805-470-202 CBP0805-600-152 CBU0603-470-20 CBZ1206-202-30 CBZ1206-202 CBC0805-600-202 cbz0805-252-20 CBC0603-600-102 CBP0805-600-152 cbc0805-12-152 CBC0603-470-102 ACB-0805A CBG0402-120-10

    CBG0402-220-10

    Abstract: CBG1206-600-40 CBZ1206-202 ZCB-0805
    Text: MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES 100% NO LEAD terminal component Multilayer technology, offering Monolithic structure, excellent for high reliability 100% Magnetic shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance


    Original     		PDF HP-4291A HP-16192A HP-6632DC HP-16200A an0603 PCB-0603 YCB-0603 ZCB-0603 HCB-0805 PCB-0805 CBG0402-220-10 CBG1206-600-40 CBZ1206-202 ZCB-0805

    BCB-1210

    Abstract: CBL0805-220-25 CBC1206-600-102 CBG1206-26-50 CBZ1206-202-30 cbc0805-12-152 CBC0805-600-202 ZCB-0603 ZCB-1206 cbz0805-252-20
    Text: 108 MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES 100% NO LEAD terminal component Multilayer technology, offering Monolithic structure, excellent for high reliability 100% Magnetic shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance


    Original     		PDF HP-4291A HP-16192A HP-6632DC HP-16200A HP-4291A Obtained000 CBP0805-30-502 CBP0805-100-402 CBP0805-220-302 CBP0805-330-252 BCB-1210 CBL0805-220-25 CBC1206-600-102 CBG1206-26-50 CBZ1206-202-30 cbc0805-12-152 CBC0805-600-202 ZCB-0603 ZCB-1206 cbz0805-252-20

    Untitled

    Abstract: No abstract text available
    Text: 108 MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES 100% NO LEAD terminal component Multilayer technology, offering Monolithic structure, excellent for high reliability 100% Magnetic shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance


    Original     		PDF HP-4291A HP-16192A HP-6632DC HP-16200A HP-4291A Obtaine2000 CBP0805-30-502 CBP0805-100-402 CBP0805-220-302 CBP0805-330-252