Untitled
Abstract: No abstract text available
Text: SILICONE RUBBER LAMINATED DRUM HEATERS SHDH Series Heavy Duty Drum Heaters ߜ Low Watt Density Electrical Resistance Heater ߜ 4.5 Watts/Sq. Inch Exposure Temperature up to 450°F ߜ Rugged & Flexible Heater Element ߜ Constant Watt Density ߜ Quick and Simple
|
Original
|
systems240
SHDH-1000-240
SSDH-C-1200-120
SHDH-C-1000-120
SSDH-C-1200-240
SHDH-C-1000-240
SSDH-700-120
SSDH-700-240
SSDH-550-120
SSDH-550-240
|
PDF
|
cbc 182
Abstract: Taiyo Yuden LBC2518 4R7 Taiyo Yuden lem 2520 Inductor LBM2016 o820 LEM2520 Lem Flex lbr202
Text: 信号系巻線チップインダクタ WOUND CHIP INDUCTORS FOR SIGNAL LINE LB SERIES M TYPE LE SERIES M TYPE OPERATING TEMP. LBM2016 TYPE −25~+120℃(製品自己発熱含む) −25∼+120℃ (Inducting self-generated heat) −40∼+85℃
|
Original
|
LBM2016
LEM2520
LBM2016
LEM2520
cbc 182
Taiyo Yuden LBC2518 4R7
Taiyo Yuden lem 2520 Inductor
o820
Lem Flex
lbr202
|
PDF
|
LBR2518
Abstract: LEM2520 LB2016 LB2518 LB3218 LBC2012 LBC2016 LBC2518 LBMF1608 LBR2012
Text: 巻線チップインダクタ WOUND CHIP INDUCTORS LB SERIES OPERATING TEMP. −25~+105℃(製品自己発熱含む) (Including self-generated heat) 特長 FEATURES 豊富なラインアップ形状と標準低Rdc、大電流シリーズでお客様の広範
|
Original
|
LB32183225
LBMF1608
LB3218
LBMF1608
LBR2518
LEM2520
LB2016
LB2518
LBC2012
LBC2016
LBC2518
LBR2012
|
PDF
|
C322
Abstract: CB2012 CBC3225 CBMF1608 DSA0042841 LEM 3225 TAIYO YUDEN LEM
Text: 巻線チップパワーインダクタ WOUND CHIP POWER INDUCTORS CB SERIES OPERATING TEMP. −25~+105℃(製品自己発熱含む) (Including self-generated heat) 特長 FEATURES ・ LB / LBC シリーズに対し大電流化に対応しています。小型のDC/DCコン
|
Original
|
CBMF1608
C322
CB2012
CBC3225
DSA0042841
LEM 3225
TAIYO YUDEN LEM
|
PDF
|
block diagram for RF transmitter AND RECEIVER doc
Abstract: BPSK ST19NR66 AES-128 iso 3309 eeprom st
Text: ST19NR66 Dual contactless smartcard MCU with 66 Kbytes high density EEPROM, enhanced RF performances and dedicated packages Features Hardware features • Enhanced 8-bit CPU core with extended addressing modes ■ 224 Kbytes User ROM ■ 6 Kbytes User RAM
|
Original
|
ST19NR66
block diagram for RF transmitter AND RECEIVER doc
BPSK
ST19NR66
AES-128
iso 3309
eeprom st
|
PDF
|
DSLAM d50
Abstract: Zephyr Engineering AN2577 harrier
Text: Advance Information MPC185HWRM Rev. 2.2, 4/2003 MPC185 Hardware Reference Manual Matthew Short Security Applications matt.short@motorola.com This document describes how to design a system with the MPC185 and the MPC8260 or MPC107. This document describes pertinent electrical and physical characteristics of the
|
Original
|
MPC185HWRM
MPC185
MPC8260
MPC107.
MPC185.
XPC185VFA
DSLAM d50
Zephyr Engineering
AN2577
harrier
|
PDF
|
GPMC OMAP NAND
Abstract: XOMAP3530FCUS IR P 648 H w2 p1 XOMAP3530BCBBE
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
GPMC OMAP NAND
XOMAP3530FCUS
IR P 648 H w2 p1
XOMAP3530BCBBE
|
PDF
|
12ae7
Abstract: A7B9 hamming code 512 bytes OMAP3530DCBB72 cmos IMAGE SENSOR global shutter HD
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
12ae7
A7B9
hamming code 512 bytes
OMAP3530DCBB72
cmos IMAGE SENSOR global shutter HD
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
|
PDF
|
s-PBGA-515
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
s-PBGA-515
|
PDF
|
SPRS507F
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
SPRS507F
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x+
OMAP3530
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
|
PDF
|
IC 8 PIN LM 6142
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
IC 8 PIN LM 6142
|
PDF
|
|
lvds 20 pin lcd panel 10 pin out
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
lvds 20 pin lcd panel 10 pin out
|
PDF
|
graphic lcd panel fpga example
Abstract: GPMC OMAP NAND
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
graphic lcd panel fpga example
GPMC OMAP NAND
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x+
OMAP3530
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x+
OMAP3530
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
|
PDF
|
Untitled
Abstract: No abstract text available
Text: OMAP3515/03 Applications Processor www.ti.com SPRS505F – FEBRUARY 2008 – REVISED SEPTEMBER 2009 1 OMAP3515/03 Applications Processor 1.1 Features • • • OMAP3515/03 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3515/03
SPRS505F
720-MHz
OMAP3515
|
PDF
|
SPRS507F
Abstract: ARMv6 Architecture Reference Manual transistor SS6 A 1051 A 12x12 cmos sensor 12-pin
Text: OMAP3530/25 Applications Processor www.ti.com SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009 1 OMAP3530/25 Applications Processor 1.1 Features • • OMAP3530/25 Applications Processor: – OMAP 3 Architecture – MPU Subsystem • Up to 720-MHz ARM Cortex™-A8 Core
|
Original
|
OMAP3530/25
SPRS507F
720-MHz
520-MHz
TMS320C64x
OMAP3530
SPRS507F
ARMv6 Architecture Reference Manual
transistor SS6 A 1051 A
12x12 cmos sensor 12-pin
|
PDF
|
rgn 1064
Abstract: vergleichsliste mo465 telefunken hr 660 tungsram Ubf 11 TK4100 RGN2004 Telefunken g-2504 Telefunken ebf 11
Text: ' RÖHRENDATEN für Schule u, Werkstatt y ^ 1. VergleichstabeSIe F 2, Austauschliste Ausgabe 1928— 1945 . ' *en W ü n schen v ie le r Interessenten, en tsp rech en d , bringen w ir mit n ach fo lg e n d e r A ufstellung eine Vergleichsliste d e r e u ro p äisch en Röhren so w ie eine Austaüschrtste* die
|
OCR Scan
|
|
PDF
|
RGN2004
Abstract: rgn 1064 rgn 4004 RGN1054 DN904 s41 604 lf RGN354 TL 413 RGN1404 L416D
Text: Type A4 A A 4 AM H e rste lle r GleicheType C a stilla C a stilla RENS 1274 RENS 1284 RENS 1294 AF 2 AF 3 AF 7 RENS 1244 C astilla C o stilla C a stilla C a s tilla C a stilla C a stilla C a stilla C a stilla C a s tilla A 4 DD A 4 DP 1 C a stilla C a stilla
|
OCR Scan
|
|
PDF
|