Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53310K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53310K-C2-R0
GR-63-Core
MIL-STD-810
ATS-53310K-C1-R0
MGT310
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PDF
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53190K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53190K-C2-R0
GR-63-Core
MIL-STD-810
ATS-53190K-C1-R0
MGT190
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PDF
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53330R-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53330R-C2-R0
GR-63-Core
MIL-STD-810
ATS-53330R-C1-R0
MGT330
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PDF
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53190D-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53190D-C2-R0
GR-63-Core
MIL-STD-810
ATS-53190D-C1-R0
MGT190
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PDF
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53170R-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53170R-C2-R0
GR-63-Core
MIL-STD-810
ATS-53170R-C1-R0
MGT170
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PDF
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Untitled
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-53210K-C2-R0 D Features & Benefits » High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments » maxiGRIP™ attachment applies steady, even pressure to
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ATS-53210K-C2-R0
GR-63-Core
MIL-STD-810
ATS-53210K-C1-R0
MGT210
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PDF
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1085-ND ATS PART # ATS-51270R-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1085-ND
ATS-51270R-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1007-ND ATS PART # ATS-50300B-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1007-ND
ATS-50300B-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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ATS1191-ND
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1191-ND ATS PART # ATS-53375R-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to
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ATS1191-ND
ATS-53375R-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1191-ND
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ATS1174-ND
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1174-ND ATS PART # ATS-53350K-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to
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ATS1174-ND
ATS-53350K-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1174-ND
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1072-ND ATS PART # ATS-51310K-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1072-ND
ATS-51310K-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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ATS1153-ND
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1153-ND ATS PART # ATS-53290D-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to
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ATS1153-ND
ATS-53290D-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1153-ND
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ats1083
Abstract: ATS1083-ND
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1083-ND ATS PART # ATS-51230R-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1083-ND
ATS-51230R-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ats1083
ATS1083-ND
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ATS1167-ND
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1167-ND ATS PART # ATS-53250K-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to
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ATS1167-ND
ATS-53250K-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1167-ND
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1084-ND ATS PART # ATS-51250R-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1084-ND
ATS-51250R-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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PDF
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1081-ND ATS PART # ATS-51190R-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1081-ND
ATS-51190R-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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PDF
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1068-ND ATS PART # ATS-51250K-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1068-ND
ATS-51250K-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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ATS1025-ND
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1025-ND ATS PART # ATS-50325G-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1025-ND
ATS-50325G-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1025-ND
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ATS1170-ND
Abstract: No abstract text available
Text: High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1170-ND ATS PART # ATS-53300K-C2-R0 D Features & Benefits High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments C maxiGRIP™ attachment applies steady, even pressure to
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ATS1170-ND
ATS-53300K-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1170-ND
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ATS1001-ND
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1001-ND ATS PART # ATS-50190B-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1001-ND
ATS-50190B-C2-R0
GR-63-Core
MIL-STD-810
C1100F
ATS1001-ND
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PDF
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1028-ND ATS PART # ATS-50375G-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1028-ND
ATS-50375G-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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PDF
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Untitled
Abstract: No abstract text available
Text: Ultra High Performance BGA Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1037-ND ATS PART # ATS-50270P-C2-R0 Features & Benefits D C maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective
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ATS1037-ND
ATS-50270P-C2-R0
GR-63-Core
MIL-STD-810
C1100F
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PDF
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Untitled
Abstract: No abstract text available
Text: Custom High Performance Cooling Solutions w/ maxiGRIP Attachment* DIGI-KEY PART # ATS1366-ND ATS PART # ATS-59001-C2-R0 D Features & Benefits C Designed for flip-chip processors such as Freescale MPCs maxiGRIP™ attachment applies steady, even pressure to
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ATS1366-ND
ATS-59001-C2-R0
C1100F
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Untitled
Abstract: No abstract text available
Text: Custom High Performance Cooling Solutions w/ maxiGRIP Attachment ATS PART # ATS-59003-C2-R0 Features & Benefits D » Designed for flip-chip processors such as Freescale MPCs » maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
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ATS-59003-C2-R0
C1100F
ATS-59003-C1-R0
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