equivalent des circuit integre ttl
Abstract: a103j RESISTOR 9 pin cepe ocxo Resistors A103G stc crystal A103j resistor network a103j network resistor a103j RESISTOR iqxo-531 C-MAC Quartz Crystals
Text: New Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv SAWs Profile of C-MAC Frequency Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
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CD 5888 CB SMD IC
Abstract: A103j resistor network a103j RESISTOR smd diode S4 67A a103j network resistor a103j equivalent des circuit integre ttl C-MAc quartz a103g cepe ocxo
Text: New Products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iv SAWs Profile of C-MAC Frequency Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ii
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STP2208
Abstract: c-mac STP CMAC CMAC STP c-mac stp-2207
Text: STP 2208: Stratum 3E Performance 0 to 70°C M i c r o Te c h n o l o g y ISSUE 1: 1 APRIL 2002 Marking Description • Manufacturer’s Name: C-MAC ■ Part Number (for Series): STP 2208 ■ Miniature SC Cut OCXO (CFPO-6 A) ■ Nominal Frequency: 12.8MHz
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100Hz:
10kHz
STP2208
c-mac
STP CMAC
CMAC STP
c-mac stp-2207
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OCXO c-mac
Abstract: C-MAC OCXO CRYSTAL CMAC c-mac tcxo CMAC pluto tcxo
Text: Introduction C-MAC has introduced a range of TCXO’s utilizing key patented features of its “Pluto” temperature compensated ASIC, that fully complies with the requirements of the “COSPAS SARSAT” Emergency Beacon system, which is used to alert Search and Rescue
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028MHz
688375MHz)
-90dBc/Hz
100Hz
-115dBc/Hz
-127dBc/Hz
10kHz
-137dBc/Hz
100kHz
-143dBc/Hz
OCXO c-mac
C-MAC OCXO
CRYSTAL CMAC
c-mac
tcxo CMAC
pluto tcxo
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c mac ocxo
Abstract: stp ocxo C-MAC OCXO STP C-MAC ocxo
Text: Reference 44 avenue de la Glacière - BP 165 95105 ARGENTEUIL CEDEX - FRANCE Tel. : 33 0 39 98 36 00 E_mail : FirstnameSurname@cmac.com Fax : 33 ( 0 ) 39 98 36 90 TECHNICAL OCXO SPECIFICATION STP 2270 Page 1/2 Date Visa 16 Oct.02 Claude Trialoup « Stratum 3E» OCXO
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cdma QPSK modulation Walsh pilot
Abstract: qualcomm 8960 DSB-SC E1962B E5515C OCXO 406 E1999A-206 QUALCOMM Reference manual jammer E5515C uncertainty
Text: Agilent E1966A 1xEV-DO Terminal Test Application For the 8960 E5515C Wireless Communications Test Set Technical Overview Testing high data rates give you confidence in your 1xEV-DO wireless access terminals As the first one box test solution to support 1xEV-DO Release A and B, the Agilent
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E1966A
E5515C)
E1966A
Release2100
Cdma2000
5990-5635EN
cdma QPSK modulation Walsh pilot
qualcomm 8960
DSB-SC
E1962B
E5515C
OCXO 406
E1999A-206
QUALCOMM Reference manual
jammer
E5515C uncertainty
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RFC-5087
Abstract: TXC-06010AIBG TXC-06010-MB K4S283232E 0X0076 cesopsn TXC-06010
Text: PacketTrunk-4 Plus Device TDM-over-Packet Gateway Device TXC-06010 DATA SHEET PRELIMINARY TXC-06010- MB, Ed. 6 December 2009 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII;HDX or
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TXC-06010
TXC-06010-
TXC-06010-MB,
RFC-5087
TXC-06010AIBG
TXC-06010-MB
K4S283232E
0X0076
cesopsn
TXC-06010
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Untitled
Abstract: No abstract text available
Text: Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34S101,
DS34S102,
DS34S104,
DS34S108
DS34S101
DS34S102
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TXC-06010-MB
Abstract: TXC-06010 samsung Capacitance lables transwitch packettrunk fifo synchronus asynchronus PacketTrunk
Text: PacketTrunk-4 Plus Device TDMoIP/MPLS Gateway Device TXC-06010 DATA SHEET PRODUCT PREVIEW TXC-06010-MB, Ed. 2 June 2006 FEATURES APPLICATIONS • Four T1/E1/Serial or one T3/E3 TDM interfaces • One 10/100 Ethernet IEEE 802.3 MAC interface via MII/RMII/SMII/SSMII; HDX or
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TXC-06010
TXC-06010-MB,
TXC-06010-MB
TXC-06010
samsung Capacitance lables
transwitch packettrunk
fifo synchronus asynchronus
PacketTrunk
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TCXO A31 10MHZ
Abstract: MT48LC4M32B2TG-6 L1V16 Datum OCXO
Text: PRELIMINARY PRODUCT BRIEF: SUBJECT TO CHANGE Rev: 091407 DS34S108, DS34S104, DS34S102, DS34S101 Description Abridged General Description Features The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34S108 allows up to eight T1/E1 links or frame-based serial HDLC links to be
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DS34S108,
DS34S104,
DS34S102,
DS34S101
DS34S108
823/G
board25
DS34S108
TCXO A31 10MHZ
MT48LC4M32B2TG-6
L1V16
Datum OCXO
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diode CH9d
Abstract: CH7C diode CH8C diode diode ch6b rg703 Diode TS21C diode code eb13 RFC-5087 10407C 2125S
Text: 19-4835; 8/09 DS34T101, DS34T102, DS34T104, DS34T108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34T101,
DS34T102,
DS34T104,
DS34T108
823/G
DS34T108.
DS34T104.
diode CH9d
CH7C diode
CH8C diode
diode ch6b
rg703 Diode
TS21C
diode code eb13
RFC-5087
10407C
2125S
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cd 4553
Abstract: ic cd 4553 cmos 4553 ATM machine working circuit diagram GPON block diagram ic 4553 master 5087 mii to hdlc DS34S101 DS34S102
Text: ABRIDGED DATA SHEET Rev: 101708 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34S101,
DS34S102,
DS34S104,
DS34S108
cd 4553
ic cd 4553
cmos 4553
ATM machine working circuit diagram
GPON block diagram
ic 4553
master 5087
mii to hdlc
DS34S101
DS34S102
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DS34S101
Abstract: DS34S102 DS34S104GN DS34S108GN ic cd 4553
Text: ABRIDGED DATA SHEET Rev: 032609 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial
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DS34S101,
DS34S102,
DS34S104,
DS34S108
DS34S101
DS34S102
DS34S104GN
DS34S108GN
ic cd 4553
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Untitled
Abstract: No abstract text available
Text: 19-4750; Rev 1; 7/11 DS34S132 32-Port TDM-over-Packet IC General Description The IETF PWE3 SAToP/CESoPSN/HDLC-compliant DS34S132 provides the interworking functions that are required for translating TDM data streams into and out of TDM-over-Packet TDMoP data streams
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DS34S132
32-Port
DS34S132
100/1000Mbps
64Kbps
048Mbps
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tdmoip
Abstract: T1 231.02
Text: ABRIDGED DATA SHEET Rev: 071808 DS34T101, DS34T102, DS34T104, DS34T108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Description These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3 or STS-1 stream
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DS34T101,
DS34T102,
DS34T104,
DS34T108
823/G
DS34T104
tdmoip
T1 231.02
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RTL83
Abstract: cb111 rtl8363 RTL8363C
Text: Data Sheet May 2012 MAX24188 EV KIT Evaluates: MAX24188 General Description The MAX24188 EV Kit is an easy-to-use evaluation kit for the MAX24188 Low-Cost IEEE1588 Time Clock. An on-board high-stability TC-OCXO oscillator is provided to allow evaluation of 1588 performance with a variety
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MAX24188
MAX24188
IEEE1588
MAX24188.
RTL83
cb111
rtl8363
RTL8363C
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Untitled
Abstract: No abstract text available
Text: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15
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AM5K2E04,
AM5K2E02
SPRS864Bâ
AM5K2E04/02
Cortex-A15
Cortex-A15
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Untitled
Abstract: No abstract text available
Text: AM5K2E04, AM5K2E02 SPRS864B—June 2013—Revised January 2014 Multicore ARM KeyStone II System-on-Chip SoC 1 AM5K2E04/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz – 4MB L2 Cache Memory Shared by all Cortex-A15
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AM5K2E04,
AM5K2E02
SPRS864Bâ
AM5K2E04/02
Cortex-A15
Cortex-A15
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E5515B
Abstract: E5520A E5515C e5515 PRBS-15 E1987A pesq MCS6 intel MCS-4 E5515C uncertainty
Text: Agilent E1968A GSM/GPRS/EGPRS Test Application Technical Overview For the E5515C Wireless Communications Test Set and the E1987A Fast Switching Test Application Produce high volume quality phones at the lowest possible cost Flexible • The E1968A includes all essential
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E1968A
E5515C
E1987A
E1968A
5990-5708EN
E5515B
E5520A
e5515
PRBS-15
pesq
MCS6
intel MCS-4
E5515C uncertainty
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Untitled
Abstract: No abstract text available
Text: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz
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66AK2E05,
66AK2E02
SPRS865Bâ
66AK2E05/02
Cortex-A15
Cortex-A15
TMS320C66xâ
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Untitled
Abstract: No abstract text available
Text: 66AK2E05, 66AK2E02 SPRS865B—June 2013—Revised January 2014 Multicore DSP+ARM KeyStone II System-on-Chip SoC 1 66AK2E05/02 Features and Description • ARM Cortex -A15 MPCore™ CorePac – Up to Four ARM Cortex-A15 Processor Cores at up to 1.4-GHz
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66AK2E05,
66AK2E02
SPRS865Bâ
66AK2E05/02
Cortex-A15
Cortex-A15
TMS320C66xâ
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Untitled
Abstract: No abstract text available
Text: Clock & Timing IC Solutions www.hittite.com REF PLL CLK1 CLK2 CLOCK MANAGEMENT CLKN Hittite has developed an industr y-leading line of high per formance clock distribution and clock generation products that enable the system designer to maximize the performance from data converters and physical layer PHY
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CT-0313
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DS34T104GN
Abstract: 3216 footprint IPC TDM8 DS34T101GN DS34T102GN DS34T104 DS34T108GN 7U22 DS34T10x
Text: Rev: 072707 DS34T101/DS34T102/DS34T104/DS34T108 Single/Dual/Quad/Octal TDM-Over-Packet Chip General Description 3 The IETF PWE SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34T108 allows up to eight T1/E1 links or frame-based serial HDLC links to be transported transparently through a switched IP or
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DS34T101/DS34T102/DS34T104/DS34T108
DS34T108
823/G
DS34T104GN
3216 footprint IPC
TDM8
DS34T101GN
DS34T102GN
DS34T104
DS34T108GN
7U22
DS34T10x
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Untitled
Abstract: No abstract text available
Text: ABRIDGED DATA SHEET Rev: 072707 DS34T101/DS34T102/DS34T104/DS34T108 Single/Dual/Quad/Octal TDM-Over-Packet Chip General Description The IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC draft-compliant DS34T108 allows up to eight T1/E1 links or frame-based serial HDLC links to be
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DS34T101/DS34T102/DS34T104/DS34T108
DS34T108
823/G
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