MC68377
Abstract: FA04 FA12
Text: SECTION 3 BURST INTEGRATION MODULE BIM 3.1 Introduction 3.1.1 Features The burst integration module (BIM) provides two-fold improvement in instruction bandwidth, as compared to previous integration modules, by utilizing a synchronous burst protocol. BIM applications also realize decreased memory costs due to a nearly onehalf clock speed improvement in memory access timing.
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MC68377
MC68377
FA04
FA12
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RCM2130
Abstract: RCM2020 idc connector idc connector 10 pin SDLC TO SPI RCM3410 connector 30 pin IDC RCM2250 SPI convert to parallel port RCM3400
Text: Selection Guide RCM2000/3000 RabbitCore Shared Features of the RCM2000/3000 RabbitCore Series Feature RCM2XXX RCM3XXX EMI Reduction Spectrum spreader for reduced EMI radiated emissions Serial Rate Max. asynchronous burst rate = CLK/32 Max. asynchronous burst rate = CLK/8
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RCM2000/3000
CLK/32
10-bit
RCM2130
RCM2020
idc connector
idc connector 10 pin
SDLC TO SPI
RCM3410
connector 30 pin IDC
RCM2250
SPI convert to parallel port
RCM3400
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RCM2020
Abstract: rcm-2020 rcm3710 SDLC TO SPI RCM2250 RCM3410 RCM2100 RCM2120 RABBIT SEMICONDUCTOR rcm2020 RCM3400
Text: Selection Guide 02/05 RCM2000/3000 RabbitCore Shared Features of the RCM2000/3000 RabbitCore Series Feature RCM2XXX RCM3XXX EMI Reduction Spectrum spreader for reduced EMI radiated emissions Serial Rate Max. asynchronous burst rate = CLK/32 Max. asynchronous burst rate = CLK/8
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RCM2000/3000
CLK/32
10-bit
10-bit
RCM2020
rcm-2020
rcm3710
SDLC TO SPI
RCM2250
RCM3410
RCM2100
RCM2120
RABBIT SEMICONDUCTOR rcm2020
RCM3400
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diode t25 4 B9
Abstract: diode t25 4 L5 g24 motorola module datasheet la 7680 T25 4 h5 AD14 MPC107 PC107A PC7400
Text: Features • Processor Bus Frequency up to 100 MHz • 64-bit or 32 bits Data Bus and 32-bit Address Bus • Provides Support for Either Asynchronous SRAM, Burst SRAM, or Pipelined Burst SRAM Compliant with PCI Specification, Revision 2.1 PCI Interface Operates up to 66 MHz/5.0V Compatible
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64-bit
32-bit
diode t25 4 B9
diode t25 4 L5
g24 motorola module datasheet
la 7680
T25 4 h5
AD14
MPC107
PC107A
PC7400
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PC7400
Abstract: No abstract text available
Text: Features H Processor bus frequency up to 100 MHz. H 64-bit or 32 bits data bus and 32-bit address bus. H Provides support for either asynchronous SRAM, burst SRAM, or pipelined burst SRAM. H Compliant with PCI specification, revision 2.1. H PCI interface operates up to 66 MHz/5.0 Volt compatible.
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64-bit
32-bit
PC107A
PC7400
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MPC107
Abstract: PC107A PC7400
Text: Features H Processor bus frequency up to 100 MHz. H 64-bit or 32 bits data bus and 32-bit address bus. H Provides support for either asynchronous SRAM, burst SRAM, or pipelined burst SRAM. H Compliant with PCI specification, revision 2.1. H PCI interface operates up to 66 MHz/5.0 Volt compatible.
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64-bit
32-bit
PC107A
MPC107
PC107A
PC7400
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Untitled
Abstract: No abstract text available
Text: Features H Processor bus frequency up to 100 MHz. H 64-bit or 32 bits data bus and 32-bit address bus. H Provides support for either asynchronous SRAM, burst SRAM, or pipelined burst SRAM. H Compliant with PCI specification, revision 2.1. H PCI interface operates up to 66 MHz/5.0 Volt compatible.
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64-bit
32-bit
PC107A
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qualcomm rfr6500
Abstract: Qualcomm MSM
Text: MSM6800 CHIPSET SOLUTION H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES SDRAM CMOS CCD BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client GRAPHICS MSM6800 BREW OpenGL ES 3D, 2D Modem QDSP4000 PLL VIDEO MPEG-4,
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Qualcomm MSM
Abstract: qualcomm MDDI 1.2
Text: MSM6550 CHIPSET SOLUTION SDRAM CMOS CCD H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client MSM6550 GRAPHICS OpenGL ES 3D, 2D Modem QDSP4000 VIDEO PLL MPEG-4,
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Qualcomm MSM
Abstract: No abstract text available
Text: MSM6550 CHIPSET SOLUTION SDRAM CMOS CCD H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client MSM6550 GRAPHICS OpenGL ES 3D, 2D Modem QDSP4000 VIDEO PLL MPEG-4,
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transmitter and receiver MINI CAMERA
Abstract: Wireless Camera transmitter 72-polyphony qualcomm tcxo smps animation Qualcomm transmit diversity MSM Qualcomm rtr6 uhf wireless microphone transmitter QDSP qualcomm rfr6500
Text: MSM6700 CHIPSET SOLUTION SDRAM CMOS CCD H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client GRAPHICS MSM6700 BREW OpenGL ES 3D, 2D Modem QDSP4000 PLL VIDEO MPEG-4,
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Qualcomm MSM
Abstract: No abstract text available
Text: MSM6800 CHIPSET SOLUTION H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES SDRAM CMOS CCD BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client GRAPHICS MSM6800 BREW OpenGL ES 3D, 2D Modem QDSP4000 PLL VIDEO MPEG-4,
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RFR6500
Abstract: MSM6700 MSM6550 msm qualcomm mddi ev-do qualcomm chipsets qdsp4000 qualcomm vctcxo PM6650 qualcomm rfr6500 rf direction finder
Text: MSM6700 CHIPSET SOLUTION SDRAM CMOS CCD H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client MSM6700 GRAPHICS Open GL ES 3D, 2D Modem QDSP 4000 VIDEO PLL MPEG-4,
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MSM6550
Abstract: qualcomm msm6550 ev-do qualcomm chipsets Qualcomm pm6650 PM6650 usb mp3 player with radio fm module lcd display qualcomm 3G mp3 player with digital fm radio receiver circuit msm qualcomm mddi qualcomm RFR6120
Text: MSM6550 CHIPSET SOLUTION SDRAM CMOS CCD H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES BURST P SRAM BURST NOR LCD EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client MSM6550 GRAPHICS Open GL ES 3D, 2D Modem QDSP 4000 VIDEO PLL MPEG-4,
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pm6650
Abstract: RFT6100 Qualcomm MSM QDSP4000 Qualcomm RF chipset USIM card interface Qualcomm pm6650 RFL6000 RFR6120 RFR6125
Text: MSM6150 CHIPSET SOLUTION CDMA H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES SDRAM CMOS CCD BURST P SRAM BURST NOR LCD NAND EBI 1 EBI 2 DUAL MEMORY BUSES CAMERA PROCESSING MDDI Client MSM6150 GRAPHICS Open GL ES 3D, 2D Modem QDSP 4000 VIDEO PLL
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Qualcomm pm6650
Abstract: QUALCOMM MSM6275 MSM6275 PM6650 smps animation QDSP 4000 Qualcomm 3G HSDPA cell capacity planning Qualcomm MSM UMTS Qualcomm MSM "power management"
Text: MSM6275 CHIPSET SOLUTION H T T P : / / W W W. C D M AT E C H . C O M TECHNOLOGIES SDRAM CMOS CCD BURST P SRAM BURST NOR LCD MSM6275 GRAPHICS Open GL ES 3D, 2D Modem QDSP 4000 VIDEO PLL MPEG-4, H.263, H.264 Microphone Stereo Input ARM 926ejs with Jazelle
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tc 97101
Abstract: No abstract text available
Text: ADVANCE MICRON I rtCHNCLOG * INC M714LD T 164 B(N), MT8LD264 B(N), MT16LD464 B(N) 1 , 2 , 4 MEG X 64 BURST EDO DRAM MODULES BURST EDO DRAM MODULE 1, 2, 4 MEG X 64 8, 16, 32 MEGABYTE, 3.3V, BURST EDO FEATURES • 168-pin, dual-in-line m em ory m od u e (DIM M )
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M714LD
MT8LD264
MT16LD464
168-pin,
024-cycle
048-cycle
168-Pin
1125I
tc 97101
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m995
Abstract: 8F4DJ-52
Text: PRELIMINARY MT4LC2M8F4 2 MEG x 8 BURST EDO DRAM p ilC R C D N BURST EDO DRAM 2 MEG x 8 FEATURES PIN ASSIGNMENT Top View • Burst order, interleave or linear, program med by executing W CBR cycle after initialization • Single power supply: +3.3V ±5% • All inputs and outputs are LVTTL com patible with 5V
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048-cycle
28-Pin
000xB
m995
8F4DJ-52
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Untitled
Abstract: No abstract text available
Text: ADVANCE jp il r p n M MT9LD272 B N , MT18LD472 B(N) 2, 4 MEG X 72 BURST EDO DRAM MODULES BURST EDO IDRAM MODULE 2, 4 MEG x 72 16,32 MEGABYTE, 3.3V,ECC, BURST EDO FEATURES • • • • • • • • • 168-pin, d ual-in-line m em ory m odule (D IM M )
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MT9LD272
MT18LD472
168-pin,
048-cycle
T18LD
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Untitled
Abstract: No abstract text available
Text: PRELIM INARY CY82C692 Pentium hyperCache™ Chipset Data-Path Controller with Integrated Cache Features • Supports ail 3.3V Pentium™-class processors, AMD K5, K6 and Cyrix M1 CPUs • Two-bit wraparound counter supporting Intel Burst or Linear burst sequence
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CY82C692
CY82C691
CY82C693
64-bit
CY82C691
128-KB)
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1MD45
Abstract: cy17 High-Zt11-12 CY10 CY82C691 CY82C692 CY82C693 DQ23P cy82
Text: PRELIM INARY CY82C692 W CYPRESS Pentium hyperCache™ Chipset Data-Path Controller with Integrated Cache Features • Supports ail 3.3V Pentium™-class processors, AMD K5, K6 and Cyrix M1 CPUs • Two-bit wraparound counter supporting Intel Burst or Linear burst sequence
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CY82C692
CY82C691
CY82C693
64-bit
128-KB)
55fiTbbE
1MD45
cy17
High-Zt11-12
CY10
CY82C692
DQ23P
cy82
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Untitled
Abstract: No abstract text available
Text: ADVANCED INFORMATION CY82C690 Pentium hyperCache™ Chipset Data-Path/Integrated Cache for h C -Z X Solution Features Two-bit wraparound counter supporting Intel Burst or Linear burst sequence Supports 3-1-1-1 Level 2 cache operation up to 66 MHz bus speed
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CY82C690
33YPentiumTM
CY82C691
CY82C693
64-bit
32-KB)
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY CY82C692 Pentium hyperCache™ Chipset Data-Path/Integrated Cache for h C -VX, h C -D X Solutions Features Two-bit wraparound counter supporting Intel Burst or Linear burst sequence Supports 3-1-1-1 Level 2 cache operation up to 66 MHz bus speed
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CY82C692
CY82C691
CY82C693
64-bit
128-KB)
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Untitled
Abstract: No abstract text available
Text: . TOSHIBA 11\ I I TC55V1325FF-8, TC55V1325FF -10, TC55V1325FF -12 TECHNICAL DATA SILICON G A TE CMOS TENTATIVE 32,768 W O R D x 32 BIT Synchronous Pipelined Burst SRAM DESCRIPTION The TC55V1325FF is a 1,048,576 bit synchronous pipelined burst SRAM that is organized as 32,768
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TC55V1325FF-8,
TC55V1325FF
32KX32
TC55V1325FFâ
002b117
TC55V1325FF-10.
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