SOT23-5 JEDEC standard
Abstract: POD-SOT23 SOT235 MO-178 sot 23- POD 527AH
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 5 Lead CASE 527AH−01 ISSUE O D DATE 19 DEC 2008 SYMBOL E1 MIN NOM A 0.90 1.45 A1 0.00 0.15 A2 0.90 b 0.30 0.50 c 0.08 0.22 E 1.15 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC 0.95 BSC e e L 0.45 0.30 L1 PIN #1 IDENTIFICATION
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OT-23,
527AH-01
MO-178.
98AON34320E
527AH
SOT23-5 JEDEC standard
POD-SOT23
SOT235
MO-178
sot 23- POD
527AH
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POD-SOT23
Abstract: 527AK MO-178 L2 SOT23-8
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−23, 8 Lead CASE 527AK−01 ISSUE A DATE 18 MAR 2009 SYMBOL E1 e E b PIN #1 IDENTIFICATION NOM MAX A 0.90 1.45 A1 0.00 0.15 A2 0.90 A3 0.60 0.80 b 0.28 0.38 c 0.08 0.22 1.10 1.30 D 2.90 BSC E 2.80 BSC E1 1.60 BSC
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OT-23,
527AK-01
MO-178.
98AON34327E
527AK
POD-SOT23
527AK
MO-178
L2 SOT23-8
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SO16WB
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SO−16 WB CASE 751G−03 ISSUE C DATE 30 APR 2004 1 SCALE 1:1 A D 9 h X 45 _ E H 0.25 8X M B M 16 q 1 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC
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SO-16
751G-03
SO16WB
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MS-013
Abstract: SOIC24
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−24, 300 mils CASE 751BK−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 2.35 E e PIN#1 IDENTIFICATION MAX 2.65 A1 0.10 0.30 A2 2.05 2.55 b 0.31 0.51 c 0.20 0.33 D 15.20 15.40 E 10.11 10.51 E1 7.34 7.60 1.27 BSC
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SOIC-24,
751BK-01
MS-013.
98AON34291E
751BK
MS-013
SOIC24
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soic14 150
Abstract: SOIC14
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−14, 150 mils CASE 751BF−01 ISSUE O E1 DATE 19 DEC 2008 SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 E MAX c 0.19 D 8.55 8.65 8.75 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 0.25 1.27 BSC e PIN#1 IDENTIFICATION
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SOIC-14,
751BF-01
MS-012.
98AON34274E
751BF
soic14 150
SOIC14
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751BD
Abstract: 751BD-01
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O E1 DATE 19 DEC 2008 E SYMBOL MIN A 1.35 1.75 A1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 D 4.80 5.00 E 5.80 6.20 E1 3.80 4.00 MAX 1.27 BSC e PIN # 1 IDENTIFICATION NOM h 0.25 0.50
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751BD-01
MS-012.
98AON34272E
751BD
751BD
751BD-01
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PDIP-18
Abstract: P-DIP-18 MS-001 PDIP18
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS PDIP−18, 300 mils CASE 646AG−01 ISSUE O DATE 13 MAR 2009 MIN SYMBOL PIN #1 ID E1 D NOM A 5.33 A1 0.38 A2 3.23 3.48 b 0.36 0.56 b1 1.14 1.78 c 0.20 0.36 D 22.22 23.24 E 7.62 8.13 E1 6.10 e 6.60 2.54 BSC 9.78 eB
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PDIP-18,
646AG-01
MS-001.
98AON34517E
646AG
PDIP-18
P-DIP-18
MS-001
PDIP18
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EDR-7320
Abstract: SOIC8-208 SOIK8-031-01 eiaj edr-7320 751BE-01 soik8
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−8, 208 mils CASE 751BE−01 ISSUE O DATE 19 DEC 2008 SYMBOL MIN NOM A E1 E MAX 2.03 A1 0.05 0.25 b 0.36 0.48 c 0.19 0.25 D 5.13 5.33 E 7.75 8.26 E1 5.13 5.38 e 1.27 BSC L 0.51 0.76 θ 0º 8º PIN#1 IDENTIFICATION
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751BE-01
EDR-7320.
98AON34273E
751BE
EDR-7320
SOIC8-208
SOIK8-031-01
eiaj edr-7320
751BE-01
soik8
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Untitled
Abstract: No abstract text available
Text: 4 PART NO. 3 1 2 REVISIONS CA-XXSCA2-XF-22 LTR DESCRIPTION A INITIAL RELEASE SEE DO 4793 .039±.006 0.98±0.15 B DIM.'A' ±0.30 [.012] 0.08 S D DIM. 'B' Z S SEE DO 4879 CP DATE APPROVED 3-21-02 L.F. 6-14-02 A.J. X S 0.08 [.003] D DIM. 'D' BSC DIM. 'E' X 0.10 [.004]
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CA-XXSCA2-XF-22
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MTR28515TF
Abstract: QML-38534 mtr28515
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R006-96. 95-10-18 K.A. Cottonaim B Correct oaraarach 1.4, output currents. 97-10-22 K.A. Cottonaim C Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53
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5962-R006-96.
MTR28515TF/883
MTR28515TF
QML-38534
mtr28515
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AT 980202
Abstract: QML-38534 980202 MTR28512T883 MTR28512TF DSCC 93073
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Chanaes in accordance with NOR 5962-R005-96. 95-10-18 K.A. Cottonaim B Figure 1, dimension table, symbol q: inches column, change 1.950 BSC to 1.950 maximum and millimeters column, 49.53 BSC to 49.53 maximum. Table I, delete note 4 from output current test (Iq u t ) ancl
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5962-R005-96.
MTR28512TF/883
AT 980202
QML-38534
980202
MTR28512T883
MTR28512TF
DSCC 93073
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l282
Abstract: L-282
Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n t i n u e d DCN REV DESCRIPTION 17288 03 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: (UNLES OTHERWISE SPECIFIED; 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.
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L28-2
l282
L-282
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28 LEADLESS CHIP CARRIER DWG
Abstract: MS-009-AE
Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER DCN REV DESCRIPTION 17 295 05 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN A .060 .075 A1 .050 .065 B1 R9 L 20-1
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L20-1
28 LEADLESS CHIP CARRIER DWG
MS-009-AE
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Untitled
Abstract: No abstract text available
Text: REV 00 DCN DESCRIPTION 20289 ORIGINAL ISSUE ——I |—— bl DATE APPROVED ——Ie |—— S1 - mwwffl b — ► li^ — £11 L1 _\w S —• — SEATING PLANE NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.
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PSC-2095
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Untitled
Abstract: No abstract text available
Text: DCN 17289 REV 03 DESCRIPTION UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: UNLES OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. SYMBOL A1 B1 B2 B3 .D/E. D1/E1 D2/E2 D3/E3 e1 L1 L2 L3 ND/NE N MIN
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7X-XXXSXX-X20X
Abstract: ERN REL 37 FOOTPRINT PCB d0120 6E-17 e646
Text: , E .3 1 8 [8 .0 8 ] STANDARD PCB F REVISIONS FOOTPRINT REV LAYOUT ECN, ERN NO. PRODUCT DRAWING (EAR B 12937) DATE APPRD. A P R 2 8 /0 6 K.L. 242 [6 .1 5 ] DIMFNSIONS [ @ _§ B ± .0 0 5 C ± .0 0 5 [0 .1 3 ] [0 .1 3 ] D BSC. SIZE A ± .0 1 5 [0 .3 8 ]
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APR28/06
I-0-10
STRA08
7X-XXXSXX-X20X
7X-XXXSXX-X20X
ERN REL 37
FOOTPRINT PCB
d0120
6E-17
e646
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Untitled
Abstract: No abstract text available
Text: THIS DRAWING IS UNPUBLISHED. O. COPYRIGHT 20 RELEASED FDR PUBLICATION 20 LOC A L L RIGHTS RESERVED. BY - REVISIONS DIST DS LTR D1 DESCRIPTION REVISED ECR-12-012238 DATE DWN APVD 1 9 / E IC T / '12 SJ HG D D KEY e e part TABLE - / lb BSC A -10, 0 B S C
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ECR-12-012238)
j0-368504-l/0-368150-l
D0779
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Untitled
Abstract: No abstract text available
Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP C ARRIER C o 11 1i 1111 e d DCN REV 17294 02 DESCRIPTION UPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 NOTES: (UNLES OTHERWI SE 1. A LL DI MENSI ONS ARE 2. BSC - BASI C LEAD BETWEEN CENTERS. IN INCHES.
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L22-1
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Untitled
Abstract: No abstract text available
Text: LTR A A1 B B1 c CH1 D D1 D2 E E1 E2 e1 MIN MAX .160 .190 .034 .026 .032 .017 .023 .005 .010 .035 .045 .978 .998 .940 .960 .910 .930 .978 .998 .940 .960 .910 .930 .050 BSC SIGNATURE >— B1 NOTES: A PIN-1 2. ALL DIMENSIONS SHOWN ARE IN INCHES. DATE 3r DOC. CONTROL:
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E16-1
Abstract: MO-092AC
Text: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION UPDATED TO DATE STANDARDIZE APPROVED 4- 6-90 DWG Thomas - i T E1 D e- NOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS. 3. SYMBOL ”N” REPRESENTS THE NUMBER OF LEAD!:
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E16-1
E20-1
E24-1
E28-1
E28-2
PSC-21
E16-1
MO-092AC
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MO-092AC
Abstract: E16-1
Text: PACKAGE DIAGRAM O U T L I N E S CERPACK REV DCN 04 17576 DESCRIPTION U P D A TE D DATE TO S T A N D A R D IZ E DWG APPROVED 4-6-90 Thomas - i T E1 D eNOTES: UNLESS OTHERWISE SPECIEIED 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.
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E16-1
E20-1
E24-1
E28-1
E28-2
MO-092AC
E16-1
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Untitled
Abstract: No abstract text available
Text: LTR A A1 A2 B B1 c D D1 D2 E E1 E2 L1 N e1 CH1 SIGNATURE A2 — 1 A1 • MIN MAX .165 .180 .090 .120 .020 .026 .033 .013 .021 .009 .012 .485 .495 .450 .456 .390 .430 .485 .495 .450 .456 .390 .430 .060 28 .050 BSC .042 .048 L1 DATE 3! DOC. CONTROL: ENGR. MGR:
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MS-004-OB
Abstract: No abstract text available
Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n tin u e d DON REV 17287 03 DESCRIPTION ÜPDATE DATE TO S T A N D A R D I Z E APPROVAL DRAWI NG A A1 E E D3 NOTES: 1. (UNLES OTHERWI SE A L L DI MENSI ONS 2. A RE BSC - BA SI C LEAD BETWEEN CENTERS. IN INCHES.
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Untitled
Abstract: No abstract text available
Text: PACKAGE DIAGRAM O U T L I N E S SIDEBRAZE C o r 1 1 in u e d REV DCN 05 7554 DESCRIPTION 06 22248 UPDATED CHA N GED b1 MIN DWG JO APPROVED 4/2/90 DI MENSI ON SEATING RLANE b1 _( U DATE TO S T A N D A R D I Z E L1 1. 2. 3. A RE A L L Dl BSC - DWG # jpecified:
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C24-1
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