2024-T3
Abstract: 55144 grilamid exl
Text: Technical Data July, 2009 3M Bonding Film 790 Product Description 3M™ Bonding Film 790 is a flexible, light colored, thermoplastic adhesive bonding film which exhibits good adhesion to a variety of substrates. The bonding film is removable from the release coated paper liner.
|
Original
|
PDF
|
225-3S-06
2024-T3
55144
grilamid exl
|
ASTM d882
Abstract: No abstract text available
Text: 3 Thermo-Bond Film 557 and 557 EG Technical Data Product Description August, 1996 3M TM Thermo-Bond Films 557 and 557 EG are flexible, light colored, thermoplastic adhesive bonding films which exhibit good adhesion to a variety of substrates, especially many plastics.
|
Original
|
PDF
|
220-7E-01
ASTM d882
|
Untitled
Abstract: No abstract text available
Text: Scotch-Weld TM Epoxy Adhesive DP420 Black • DP420 NS Black • DP420 Off-White • DP420 LH Technical Data March, 2012 Product Description 3M Scotch-Weld™ Epoxy Adhesives are high performance, two-part epoxy adhesives offering outstanding shear and peel adhesion, and very high levels of
|
Original
|
PDF
|
DP420
DP420
225-3S-06
|
Ablebond 8380
Abstract: Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
Text: Application Note Epoxy Die Attachment for GaAs Flip Chip Devices APN3001 A major concern in developing a process using epoxy as the attachment material for assembly is the exposure to temperatures and subsequent cooling during epoxy curing or the ability of the epoxy to withstand temperature cycling.
|
Original
|
PDF
|
APN3001
6/99A
Ablebond 8380
Ablestik 8380
Die Attach epoxy stamping
FR4 substrate height and thickness
FR4 substrate epoxy
FR4 substrate height and thickness 1.2
Ablebond
APN3001
|
galvanized steel thermal conductivity
Abstract: DP460 Oakite DP-460 Oakite 164 FPL LIGHTS c2802 scotch C-2802 epoxy adhesives
Text: 3 Scotch-Weld TM Epoxy Adhesives DP460 Off-White • DP460 NS Technical Data March, 2004 Product Description 3M Scotch-Weld™ Epoxy Adhesives DP460 Off-White and DP460 NS are high performance, two-part epoxy adhesives offering outstanding shear and peel
|
Original
|
PDF
|
DP460
1-1W-10,
galvanized steel thermal conductivity
Oakite
DP-460
Oakite 164
FPL LIGHTS
c2802
scotch
C-2802
epoxy adhesives
|
Ablebond
Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Text: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.
|
Original
|
PDF
|
|
DM6030HK
Abstract: AN3016 ic 10w power amplifier MMIC X-band amplifier DM4030LD MA08509D MAAP-008509-MCH000 MAAP-008509-PED000 MAAP-008509-SMB004 mmic AMPLIFIER x-band 10w
Text: Amplifier, Power, 10W 8.5—10.5 GHz MAAP-008509-PED000 Rev — Preliminary Information Features ♦ ♦ ♦ ♦ 10 Watt CW Saturated Output Power Level Eutectically Mounted to Heat Spreader Variable Drain Voltage 8-10V Operation GaAs MSAG Process Description
|
Original
|
PDF
|
MAAP-008509-PED000
MAAP-008509-PED000
10-mil
DM6030HK
AN3016
ic 10w power amplifier
MMIC X-band amplifier
DM4030LD
MA08509D
MAAP-008509-MCH000
MAAP-008509-SMB004
mmic AMPLIFIER x-band 10w
|
3M DP100
Abstract: c3179 Perkin Elmer TMA 7 DP100 DP-100NS TMA 900 epoxy adhesives
Text: 3 Scotch-Weld TM Epoxy Adhesives DP-100 Clear • DP-100 NS Translucent Technical Data Product Description December, 2009 3M Scotch-Weld™ Epoxy Adhesives DP-100 and DP-100NS are two-part adhesives offering fast cure and machinability. Available in larger containers like 3M™ Scotch-Weld™ Epoxy Adhesives 100 B/A
|
Original
|
PDF
|
DP-100
DP-100NS
225-3S-06
3M DP100
c3179
Perkin Elmer TMA 7
DP100
TMA 900
epoxy adhesives
|
Untitled
Abstract: No abstract text available
Text: 3 Bonding Film AF111 for Electronics Applications Technical Data Product Description March, 2004 3M Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials epoxy and phenolic .
|
Original
|
PDF
|
AF111
AF111
1-1W-10,
|
POLYOL
Abstract: No abstract text available
Text: 3 Scotch-Weld TM Urethane Adhesive DP605 NS Off-White • DP640 Brown Technical Data Product Description May, 2010 3M Scotch-Weld™ Urethane Adhesives DP605 NS Off-White and DP640 Brown are two-part, non-sag urethane adhesives. They feature tough, flexible bonds with
|
Original
|
PDF
|
DP605
DP640
225-3S-06
POLYOL
|
DM6030HK
Abstract: AN3016 DM4030LD MAAP-000074-PED000 MAAP-000074-PKG001 MAAP-000074-SMB001 MAAP-000074-SMB004 MAAPGM0074-DIE
Text: MAAP-000074-PED000 Amplifier, Power, 8W 2.0-8.0 GHz Rev — Preliminary Datasheet Features ♦ 8 Watt Saturated Output Power Level ♦ Eutectically mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000074-PED000
MAAP-000074-PED000
10-mil
DM6030HK
AN3016
DM4030LD
MAAP-000074-PKG001
MAAP-000074-SMB001
MAAP-000074-SMB004
MAAPGM0074-DIE
|
Die Attach epoxy stamping
Abstract: Ablebond 8380 APN3001
Text: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for
|
Original
|
PDF
|
APN3001:
Die Attach epoxy stamping
Ablebond 8380
APN3001
|
DM6030HK
Abstract: AN3016 DM4030LD MAAP-000076-PED000 MAAP-000076-PKG001 MAAP-000076-SMB001 MAAP-000076-SMB004 MAAPGM0076-DIE
Text: Amplifier, Power, 16W 1.3-2.5 GHz MAAP-000076-PED000 Rev — Preliminary Datasheet Features ♦ 16 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000076-PED000
MAAPGM0076-PED000
10-mil
DM6030HK
AN3016
DM4030LD
MAAP-000076-PED000
MAAP-000076-PKG001
MAAP-000076-SMB001
MAAP-000076-SMB004
MAAPGM0076-DIE
|
Ablecube
Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Text: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC
|
Original
|
PDF
|
8200C
8200C
RP-751
Ablecube
ATM-0018
Ablestik
ATM-0087
ablebond
ablebond technical
ATM-0089
ablebond ablestik
ablestik ablebond
|
|
Untitled
Abstract: No abstract text available
Text: MAAP-000076-PED000 Amplifier, Power, 6W 1.3—2.5 GHz M/A-COM Products Preliminary: Rev B Features ♦ 16 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000076-PED000
MAAPGM0076-PED000
10-mil
|
Untitled
Abstract: No abstract text available
Text: Amplifier, Power, 12W 2.0-6.0 GHz MAAP-000078-PED000 Rev A Preliminary Datasheet Features ♦ 12 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 8-10V Operation
|
Original
|
PDF
|
MAAP-000078-PED000
MAAPGM0078-PED000
10-mil
|
DM6030HK
Abstract: MAAP-000077-SMB004 AN3016 DM4030LD MAAP-000077-PED000 MAAP-000077-PKG001 MAAP-000077-SMB001 MAAPGM0077-DIE
Text: Amplifier, Power, 13W 0.7-2.5 GHz MAAP-000077-PED000 Rev — Preliminary Datasheet Features ♦ 13 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000077-PED000
MAAPGM0077-PED000
10-mil
DM6030HK
MAAP-000077-SMB004
AN3016
DM4030LD
MAAP-000077-PED000
MAAP-000077-PKG001
MAAP-000077-SMB001
MAAPGM0077-DIE
|
x-band power amplifier
Abstract: DM6030HK
Text: Amplifier, Power, 16W 1.3-2.5 GHz MAAP-000076-PED000 Rev A Preliminary Datasheet Features ♦ 16 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000076-PED000
MAAPGM0076-PED000
10-mil
x-band power amplifier
DM6030HK
|
DM6030HK
Abstract: No abstract text available
Text: MAAP-000074-PED000 Amplifier, Power, 8W 2.0-8.0 GHz Rev A Preliminary Datasheet Features ♦ 8 Watt Saturated Output Power Level ♦ Eutectically mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000074-PED000
MAAP-000074-PED000
10-mil
DM6030HK
|
DM6030HK
Abstract: MAAP-000079-PED000 DM4030LD MAAP-000079-PKG001 MAAP-000079-SMB001 AN3016 MAAP-000079-SMB004 MAAPGM0079-DIE diemat
Text: Amplifier, Power, 18W 7.5-10.5 GHz MAAP-000079-PED000 Rev — Preliminary Datasheet Features ♦ 18 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 8-10V Operation
|
Original
|
PDF
|
MAAP-000079-PED000
MAAP-000079-PED000
10-mil
DM6030HK
DM4030LD
MAAP-000079-PKG001
MAAP-000079-SMB001
AN3016
MAAP-000079-SMB004
MAAPGM0079-DIE
diemat
|
Untitled
Abstract: No abstract text available
Text: MAAP-000074-PED000 Amplifier, Power, 8W 2.0—8.0 GHz M/A-COM Products Preliminary: Rev B Features ♦ 8 Watt Saturated Output Power Level ♦ Eutectically mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000074-PED000
MAAP-000074-PED000
10-mil
|
DM6030HK
Abstract: MAAP-000078-PED000 crossover AN3016 DM4030LD MAAP-000078-PKG001 MAAP-000078-SMB001 MAAP-000078-SMB004 MAAPGM0078-DIE
Text: Amplifier, Power, 12W 2.0-6.0 GHz MAAP-000078-PED000 Rev — Preliminary Datasheet Features ♦ 12 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 8-10V Operation
|
Original
|
PDF
|
MAAP-000078-PED000
MAAPGM0078-PED000
10-mil
DM6030HK
MAAP-000078-PED000
crossover
AN3016
DM4030LD
MAAP-000078-PKG001
MAAP-000078-SMB001
MAAP-000078-SMB004
MAAPGM0078-DIE
|
Untitled
Abstract: No abstract text available
Text: Amplifier, Power, 13W 0.7-2.5 GHz MAAP-000077-PED000 Rev A Preliminary Datasheet Features ♦ 13 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 6-10V Operation
|
Original
|
PDF
|
MAAP-000077-PED000
MAAPGM0077-PED000
10-mil
|
Untitled
Abstract: No abstract text available
Text: MAAP-000078-PED000 Amplifier, Power, 12W 2.0—6.0 GHz M/A-COM Products Preliminary: Rev B Features ♦ 12 Watt Saturated Output Power Level ♦ Eutectically Mounted to Heat Spreader ♦ Next level integration is a Silver Epoxy-Based Process ♦ Variable Drain Voltage 8-10V Operation
|
Original
|
PDF
|
MAAP-000078-PED000
MAAPGM0078-PED000
10-mil
|