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    BOND WIRE COPPER Search Results

    BOND WIRE COPPER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-NDCCGJ28GB-003M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-003M 3m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (9.8 ft) - 26 AWG (Low-Loss Version) Datasheet
    SF-NDCCGJ28GB-002M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-002M 2m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (6.6 ft) - 26 AWG (Low-Loss Version) Datasheet
    SF-NDCCGJ28GB-005M Amphenol Cables on Demand Amphenol SF-NDCCGJ28GB-005M 5m SFP28 Cable - Amphenol 25-Gigabit Ethernet SFP28 Direct Attach Copper Cable (16.4 ft) - 26 AWG Datasheet
    SF-NDAAFJ100G-002M Amphenol Cables on Demand Amphenol SF-NDAAFJ100G-002M 2m (6.6') 100GbE QSFP28 Cable - Amphenol 100-Gigabit Ethernet Passive Copper QSFP Cable (SFF-8665 802.3bj) - QSFP28 to QSFP28 (26-AWG Low-Loss) Datasheet
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet

    BOND WIRE COPPER Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: February 25, 2008 May 25, 2008 Alert Category: DCS/PCN-1093 Alert Type: Bond Wire Change Discrete Semiconductor PCN #: PCN-1093 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE


    Original     		DCS/PCN-1093 PCN-1093 BAV99-7-F BAV70-7-F MMBT3904-7-F MMBT3906-7-F 2N7002-7-F PDF

    Untitled

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE DCS/PCN-1105 Contact Date: Implementation Date: Alert Category: Alert Type: March 31, 2008 June 30, 2008 Analog Semiconductors Bond Wire Change PCN #: PCN #: 1105 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE


    Original     		DCS/PCN-1105 PCN-1105 AP1084K18L-U AP1084K25L AP1084K50L-U AP1084K15L AP1084K15L-13 AP1084K15L-U, AP1084K18L PDF

    702 sot23

    Abstract: 1N4448W13F BAV99-7-05-F sot 23 70.2 MMBT3906R BZT52C6V8 DVRN6056
    Text: PRODUCT CHANGE NOTICE DCS/PCN-1116 Contact Date: Implementation Date: Alert Category: Alert Type: September 16, 2008 December 15, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1116 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE


    Original     		DCS/PCN-1116 MMST3906-7-F MMST4124-7-F MMST4126-7-F MMST4401-7-F MMTT2222A-7-F SD107WS-13 SD107WS-7-F SDA004-7 SDA006-7 702 sot23 1N4448W13F BAV99-7-05-F sot 23 70.2 MMBT3906R BZT52C6V8 DVRN6056 PDF

    FMMT593TA

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE Initial DCS/PCN-1155 Rev00 Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: December 11, 2009 March 11, 2010 Discrete Semiconductor Bond Wire Change PCN #: 1155 Rev00 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT


    Original     		DCS/PCN-1155 Rev00 FMMT38CTA, FMMT38CTC FMMT593TA, FMMT593TC FZT849TA, FZT849TC FZT788BTA, FMMT593TA PDF

    23/DMP2215L-7

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE DCS/PCN-1111 Contact Date: Implementation Date: Alert Category: Alert Type: May 23, 2008 June 21, 2008 Discrete Semiconductor Bond Wire Change PCN #: PCN #: 1111 TITLE COPPER BOND WIRE IMPLEMENTATION IMPACT None DESCRIPTION OF CHANGE


    Original     		DCS/PCN-1111 2N7002A-7, DMN66D0LDW-7, DMN3150L-7, DMP2130LDM-7, DMP2215L-7, DMN3033LSN-7 PCN-1111 PCN-1111 2N7002A-7 23/DMP2215L-7 PDF

    ZXNB4200JA16TC

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: November 20, 2008 December 20, 2008 Analog Semiconductors Products DCS/PCN-1121 Alert Type: PCN #: Bond wire change PCN #: 1121 TITLE Copper bond wire implementation IMPACT None DESCRIPTION OF CHANGE


    Original     		DCS/PCN-1121 ZXNB4200JA16TC ZXNB4200JB16TC ZXNB2200JA16TC PCN-1121 ZXNB4200JA16TC PDF

    Untitled

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE Contact Date: Implementation Date: Alert Category: Alert Type: June 19, 2008* September 17, 2008* Analog Semiconductor Bond Wire Change DCS/PCN-1115 Rev 03 PCN #: PCN-1115, Rev 03 TITLE ANALOG COPPER BOND WIRE IMPLEMENTATION IMPACT None


    Original     		DCS/PCN-1115 PCN-1115, PCN-1115 O220-3L AP1117D50G-13 252-3L APX1117DG-U AP1117D50G-U PDF

    AWM 20267

    Abstract: AWG 28
    Text: 3M Round, Jacketed, Flat Cable .050″ 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond


    Original     		TS-0070-22 AWM 20267 AWG 28 PDF

    AWM 20267

    Abstract: TS-0070-C MARKING EU
    Text: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows


    Original     		TS-0070-C RIA-2217B-E AWM 20267 TS-0070-C MARKING EU PDF

    E118773

    Abstract: AWM 20267
    Text: 3M Round, Jacketed, Flat Cable .050" 28 AWG Stranded, Mass-Term, PVC/PVC 3759 Series • Round construction permits easier routing • 28 AWG wire on .050 inch centers permits mass termination to broad line of IDC connectors • Continuous bond and continuous split/bond allows


    Original     		RIA-2217B-E E118773 AWM 20267 PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE: June 1, 2011 PCN #: 2048 PCN Title: Conversion to Copper Bond Wire on Selected Analog Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		AP2301MPG-13 AP2311MPG-13 AP2301SG-13 AP2311SG-13 AP2301FGEG-7 AP2311FGEG-7 DIC-034 18/March/2011 PDF

    322051

    Abstract: 322128 322074 322010 tooling 322908 322087 m6ab 322086 322053 321671
    Text: Catalog 82042 Standard Terminals and Splices Revised 8-00 AMPLI-BOND Product Facts • ■ ■ ■ ■ Designed to accommodate wire gauges 8 AWG through 4/0 AWG The first large wire termi nal to feature vinyl insula tion bonded to the terminal sleeve Terminals for wire sizes


    Original     		MIL-T-7928, 322051 322128 322074 322010 tooling 322908 322087 m6ab 322086 322053 321671 PDF

    ZLDO1117G33TA

    Abstract: No abstract text available
    Text: DATE: 14th September, 2011 PCN #: 2026 PCN Title: Conversion to Copper Bond Wire on Selected Analog Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		ZLDO1117G12TA ZLDO1117G15TA ZLDO1117G18TA ZLDO1117G25TA ZLDO1117G33TA ZLDO1117G50TA ZLDO1117GTA ZLDO1117K12TC ZLDO1117K15TC ZLDO1117K18TC ZLDO1117G33TA PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE: 13th January, 2012 PCN #: 2072 PCN Title: Conversion to Copper Bond Wire on Selected Analog Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		AP2182AMPG-13 AP2182ASG-13 AP2182MPG-13 AP2182SG-13 AP2186MPG-13 AP2186SG-13 AP2191DFMG-7 AP2191DM8G-13 AP2191DMPG-13 AP2191DSG-13 PDF

    DDZ19

    Abstract: BZX84C11TS DMP2012SN DMN5L06DMK BZX84C16TS DDZX8V2C DDZ9V1CS DDZ9690S
    Text: DATE: 3rd May, 2011 PCN #: 2040 PCN Title: Conversion to Copper Bond Wire on Selected Discrete Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		DDZ10C-7 DDZ39F-7 DDZ9692-7 DDZ9716S-7 DDZX5V6B-13 DMP2012SN-7 DDZ10CS-7 DDZ43-7 DDZ9692S-7 DDZ9717-7 DDZ19 BZX84C11TS DMP2012SN DMN5L06DMK BZX84C16TS DDZX8V2C DDZ9V1CS DDZ9690S PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE: 28th November, 2012 PCN #: 2041 REV 02 PCN Title: Conversion to Copper Bond Wire on Selected Discrete Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		ZXMN2B14FHÂ ZXMN2F30FHÂ ZXMN2F34FHÂ ZXMN3A01FÂ ZXMN3A02N8Â ZXMN3A04DN8Â ZXMN3A06DN8Â ZXMN3A14FÂ ZXMN3B01FÂ ZXMN3B04N8Â PDF

    Untitled

    Abstract: No abstract text available
    Text: DATE: 12th February, 2014 PCN #: 2130 PCN Title: Qualification of Alternative Copper Bond Wire, BOM Change, A/T Site and Die Shrink Dear Customer: This is an announcement of change s to products that are currently being


    Original     		APX810-26SRG-7 APX803-26SAG-7 APX803-46SRG-7 APX809-31SAG-7 APX810-29SAG-7 APX803-29SAG-7 APX803D-29SAG-7 APX809-31SRG-7 APX810-29SRG-7 APX803-31SAG-7 PDF

    DMN63D8L

    Abstract: No abstract text available
    Text: DATE: 1st June, 2015 PCN #: 2156 PCN Title: Qualification of "Diodes Technology Cheng Du Company Limited" (CAT) as an Additional Assembly & Test Site for Discrete Products and Conversion to Copper Bond Wire on Select Discrete Products at


    Original     		1N4448Wâ BZT52C2V4â BZT52C51â BZT52C13â BZT52B4V7â D1213Aâ DIC-034 DMN63D8L PDF

    DMN4060SVT

    Abstract: DMP6180SK3 DMN4036LK3
    Text: DATE: 8 April, 2013 PCN #: 2108 PCN Title: Qualification of Additional Wafer Fabrication Sources and Conversion to Copper Bond Wire on Select Discrete Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		Diode8LSD-13 DMN6040SK3-13 DMN6066SSS-13 DMP2008UFG-13 DMN3024LK3-13* DMN3025LFG-7 DMHC3025LSD-13 DMN6040SFDE-7 DMN2015UFDE-7 DMC4040SSD-13 DMN4060SVT DMP6180SK3 DMN4036LK3 PDF

    BAT54CTA

    Abstract: MMDTA06 BZT52C3V9LP DDTB123YC DCX124EK DCX69 DCX68
    Text: DATE: 7th November, 2013 PCN #: 2113 – Rev01 PCN Title: Conversion to Copper Bond Wire and Qualification of Additional Wafer Source on Selected Discrete Products Dear Customer: This is an announcement of change s to products that are currently being


    Original     		Rev01 BAS70W-05-7-F ZLLS1000TA BAS20W-7-F BAS521-7 1N5711WS-7-F BAS70W-06-7-F ZLLS500TA BAS21W-7-F BAS521LP-7 BAT54CTA MMDTA06 BZT52C3V9LP DDTB123YC DCX124EK DCX69 DCX68 PDF

    Untitled

    Abstract: No abstract text available
    Text: A. System Overview PHYSICAL INFRASTRUCTURE SYSTEMS B. Copper Systems GridRunner Pedestal Bracket • Allows the wire basket sections to be supported on three sides of a single support bracket • Forms a mechanical electrical bond to the raised floor pedestal


    Original     		GRLC21X6PG GRLC21X4PG PDF

    Untitled

    Abstract: No abstract text available
    Text: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package TO-247AC Package Weight mg 5600 Product Group Type No. RURG1520 – RURG1560 RURG3020 – RURG3060 Component Material Die Doped Silicon* Die Attach Solder Alloy Wire Bond


    Original     		O-247AC RURG1520 RURG1560 RURG3020 RURG3060 2011/65/EU. PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY UPGA301A Nanosecond SCR SWITCH WATERTOWN DIVISION P RODUCT P REVIEW KEY FEATURES DESCRIPTION Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current


    Original     		UPGA301A UL94VO PDF

    Untitled

    Abstract: No abstract text available
    Text: Catalog 1307612 AMPU-BOND Insulated Terminals Product Facts • Designed to accommodate wire gauges 8 AWG through 4/0 AWG ■ The first large wire terminal to feature vinyl insulation bonded to the terminal sleeve ■ Terminals for wire sizes 8 AWG through 4/0 AWG


    OCR Scan     		MIL-T-7928, PDF