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    SF-BGA329A-B-11

    Abstract: No abstract text available
    Text: D C Package Code: BGA329A 29.21mm [1.150"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] 0.48mm [0.019"] X Top View reference only 29.21mm [1.150"] 2 1.27 mm [0.050"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] 0.64mm


    Original     		PDF BGA329A FR4/G10 36cription: SF-BGA329A-B-11

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X