SF-BGA304A-B-11
Abstract: BGA 23 x 23 array
Text: D Package Code: BGA304A C 27.94mm [1.100"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 27.94mm [1.100"] X 1.27mm [0.050"] Top View reference only 0.64mm [0.025"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA304A
SF-BGA304A-B-11
BGA 23 x 23 array
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LS-BGA304A-11
Abstract: No abstract text available
Text: BGA304A Tooling hole X2 0.64mm [0.025"] Ø 0.40mm (x2) [Ø 0.016"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] Ø 0.51mm [Ø 0.020"] pad 27.94mm [1.100"] Top View (reference only) X 0.64mm [0.025"] 1 5.33mm [0.210"] 0.64mm [0.025"]
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BGA304A
FR4/G10
LS-BGA304A-11
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FX-BGA304A-S-B-01
Abstract: hdlc transwitch pitch 0.3mm BGA Multi-Channel hdlc Controller
Text: 3.56mm [0.140"] typ. 3.56mm [0.140"] typ. Top View 33.53mm [1.320"] 1.27mm [0.050"] pitch typ. 33.53mm [1.320"] Side View 1 2.18mm [0.086"] 2 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. 17µm [1/2 oz.] Cu clad. SnPb plating.
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FR4/G10
BGA304A)
TXC-05132
FX-BGA304A-S-B-01
hdlc
transwitch
pitch 0.3mm BGA
Multi-Channel hdlc Controller
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BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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FP-X4KPG223-01
Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators
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XC2018,
XC2018
XC3020,
XC3064,
XC3042,
XC3090,
XC3090
FP-X4KPG223-01
reflow profile FOR LGA COMPONENTS
bga96
BGA165
BGA292
SO8A
CA-SO18A-Z-J-T-01
SF-QFE352SA-L-01
BGA480B
CA-PLCC44-D-P-T-01
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