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    BGA300 Search Results

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    BGA300 Price and Stock

    Thomas & Betts BGA300-6-40

    3In Grnd Bush 6-4/0Wire Range Al |Abb Thomas & Betts BGA300-6-40
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark BGA300-6-40 Bulk 1
    • 1 $206.73
    • 10 $191.96
    • 100 $170.38
    • 1000 $170.38
    • 10000 $170.38
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    Onlinecomponents.com BGA300-6-40
    • 1 $144.73
    • 10 $128.19
    • 100 $119.26
    • 1000 $119.26
    • 10000 $119.26
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    Master Electronics BGA300-6-40
    • 1 $144.73
    • 10 $128.19
    • 100 $119.26
    • 1000 $119.26
    • 10000 $119.26
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    Thomas & Betts BGA300-14-20

    3In Grnd Bush 14-2/0Wire Range Al |Abb Thomas & Betts BGA300-14-20
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Newark BGA300-14-20 Bulk 5
    • 1 $206.73
    • 10 $191.96
    • 100 $170.38
    • 1000 $170.38
    • 10000 $170.38
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    Onlinecomponents.com BGA300-14-20
    • 1 $144.73
    • 10 $128.19
    • 100 $119.26
    • 1000 $119.26
    • 10000 $119.26
    		Buy Now
    Master Electronics BGA300-14-20
    • 1 $144.73
    • 10 $128.19
    • 100 $119.26
    • 1000 $119.26
    • 10000 $119.26
    		Buy Now

    T&B Fittings BGA300-6-40

    Grounding Bushing, 3", Aluminum, Galvanized, Wire Range 6 to 4/0 | T&B Fittings by ABB BGA300-6-40
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BGA300-6-40 Bulk 1
    • 1 $206.73
    • 10 $188.12
    • 100 $188.12
    • 1000 $188.12
    • 10000 $188.12
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    T&B Fittings BGA300-14-20

    Grounding Bushing, Aluminum, 3", Galvanized, Wire Range 14 to 2/0 | T&B Fittings by ABB BGA300-14-20
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS BGA300-14-20 Bulk 5
    • 1 -
    • 10 $186.55
    • 100 $180.6
    • 1000 $180.6
    • 10000 $180.6
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    ABB Group BGA300-14-20

    Thomas & Betts
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Sager BGA300-14-20 5
    • 1 -
    • 10 $189.31
    • 100 $181.74
    • 1000 $181.74
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    BGA300 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    SF-BGA300C-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA300C C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.76mm [0.030"] X Top View reference only 24.13mm [0.950"] 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]


    Original     		BGA300C FR4/G10 SF-BGA300C-B-11 PDF

    SF-BGA300B-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA300B C 22.86mm [0.900"] 0.71mm [0.028"] See BGA pattern code to the right for actual pattern layout Y 0.58mm [0.023"] X 22.86mm [0.900"] Top View reference only 1.27mm 2 0.36mm [0.014"] dia. 0.71mm [0.028"] 5.33mm 3.74mm [0.147"] [0.210"]


    Original     		BGA300B FR4/G10 SF-BGA300B-B-11 PDF

    SF-BGA300A-B-11

    Abstract: land pattern BGA 0,50
    Text: D Package Code: BGA300A C .0225" dia. tooling holes X2 non plated (optional) See BGA pattern code to the right for actual pattern layout Y 0.025" dia. pad X 24.13mm Top View (reference only) 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.635mm 5.33mm 3.74mm [0.147"]


    Original     		BGA300A 635mm 762mm FR4/G10 20X20 SF-BGA300A-B-11 land pattern BGA 0,50 PDF

    lm78l05

    Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611
    Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		LM78L05IBP AN-1112 LM78L05 zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611 PDF

    ic 555 timer 10 minute

    Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
    Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    TB 1226 BN

    Abstract: TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514
    Text: 412031.A01 FIT 3/12 3/20/03 3:02 PM Page 1 A Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A2 Tables and Specifications . . . . . . . . . . . . . . . . . . . . . . A3 Rigid Metal Conduit/Intermediate Metal Conduit Fittings . . . . . . . . . . . . . . . . . . . A4-A38


    Original     		A4-A38 A39-A40 A41-A49 A50-A51 A52-A53 A54-A56 A57-A65 TB 1226 BN TB GUA 5365 MATERIAL TB GUA 5365 MATERIAL NEOPRENE E-23018 tb 1229 bn sj 2258 emp 5523 ASTM A123 galvanized iron thermal conductivity UL514 PDF

    BGA-3000

    Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
    Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste


    Original     		PDF

    DIODE smd marking 22-16

    Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621
    Text: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height


    Original     		LM358, LMC6035, LM431, LM78L05, LMC555 OT23-5 DIODE smd marking 22-16 vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621 PDF

    603al

    Abstract: WW-C-581 TB cable lug catalogue bitumastic chase nipple EMT CONDUIT BITUMASTIC TRIB-125 141SL EMT CONDUIT A-A-50553
    Text: T&B Conduit Fittings General Information Thomas & Betts… The Complete Product Line Since the turn of the century, Thomas & Betts has been a recognized leader in electrical fittings. Industry standards such as Chase Nipples and Erickson® Couplings were


    Original     		PDF

    smd A9

    Abstract: SMD A8 smd a10 smd a7 AN-1112 IPC-SM-785 smd a5 SMD45 SMD M0 AN1112
    Text: National Semiconductor Application Note 1112 August 2000 内容 ・ アンダーフィル材料が不要 ・ I/O 当たりの最小フットプリントによりプリント回路基板（PCB） 上の占有面積の大幅節減 ・ 標準表面実装アセンブリ技術の活用


    Original     		M0-211-FXBGA J-STD-020, IPC-SM-785, AN-1112 2-17-16TEL. smd A9 SMD A8 smd a10 smd a7 AN-1112 IPC-SM-785 smd a5 SMD45 SMD M0 AN1112 PDF

    smd transistor marking A6

    Abstract: ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7
    Text: LM358BP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		LM358BP AN-1112 LM358 smd transistor marking A6 ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7 PDF

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin PDF

    BGA-3000

    Abstract: BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar
    Text: National Semiconductor Application Note 1112 May 1999 CONTENTS Package Construction lation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for micro-SMD 8 I/O Smallest Footprint


    Original     		AN-1112 BGA-3000 BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar PDF

    BGA-3000

    Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
    Text: CSP-UG Chip-Scale Upgrade Kit for BGA-3000 Series Rework System 1 The rapidly emerging Chip-Scale Package has been associated with many challenges in both the rework and prototyping environment. This particular package demands a specifically tailored rework solution while maintaining user-friendliness.


    Original     		BGA-3000 241mm) Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3 PDF

    FCI smd rj45 Connector

    Abstract: IXF1104 panasonic rx-d17 J18A harness MCP860 RXA25 stpa smd E25 SMD diode RGMII Intel MDIO mark b14 smd diode
    Text: Intel IXD1104 Demo Board Development Kit Manual August 2003 Document Number: 278809 Revision Number: 001 Revision Date: August 21, 2003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


    Original     		IXD1104 SN74LVTH162244 SSOP48) SN74LVTH162245 CON\MICTOR\43P) SN74HC11D EP1K50TC144-2 NC7SZ125M5 EPM7064AETC44 FCI smd rj45 Connector IXF1104 panasonic rx-d17 J18A harness MCP860 RXA25 stpa smd E25 SMD diode RGMII Intel MDIO mark b14 smd diode PDF

    BGA-3000

    Abstract: BGA-3500 Metcal CSP 3502 Metcal BGA-3591 CSP-3500 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop
    Text: BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench www.metcal.com P/N 7000-1251, Ver. A , 9/01 ii BGA-3500 Series Manual 5/01 TABLE OF CONTENTS PREFACE Specifications 2 System Part Numbers 3 Environmental Conditions


    Original     		BGA-3590 CSP-3500 BGA-3500 D-64521 BGA-3000 Metcal CSP 3502 Metcal BGA-3591 metcal bga-3000 METCAL MX-500 circuit BGA-3591 BGA-3592 reflow temperature bga laptop PDF

    8 PIN SMD IC 211

    Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
    Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages


    Original     		AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF