Untitled
Abstract: No abstract text available
Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e y ∅w M C T R P N M L K J H G F E D C B A shape optional 4x y1 C ∅v M C A B b e e2 1/2 e
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BGA256:
OT811-1
MS-034
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BGA256 17 X 17
Abstract: BGA256 MS-034 BGA-256 sot811 BGA256 17
Text: PDF: 2003 Apr 17 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M T R P N M L K J H G F E D C B A shape
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BGA256:
OT811-1
MS-034
BGA256 17 X 17
BGA256
MS-034
BGA-256
sot811
BGA256 17
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PB-BGA256J-Z-01
Abstract: SF-BGA256J-B-01 SF-BGA232A-B-01
Text: U.S. PATENT 6,351,392 78.64mm [3.096"] 2.54mmtyp. [0.100"] 19.23mm [0.757"] 50.8mm [2.000"] Top View 1 * This height variable depends on the screw position. * 2 9.97mm [0.393"] 12.6mm [0.496"] 6mm [0.236"] Side View For Probing BGA256J use SF-BGA256J-B-01
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54mmtyp.
BGA256J
SF-BGA256J-B-01
BGA232A
SF-BGA232A-B-01
FR4/G10
16x16
PB-BGA256J-Z-01
SF-BGA256J-B-01
SF-BGA232A-B-01
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BGA256
Abstract: sot466 BGA256 17 X 17
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 D D1 ball A1 index A2 A A1 E1 E detail X k k A ZD b e ∅w M y v A ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT466-1
BGA256
sot466
BGA256 17 X 17
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P-BGA256-17x17-1
Abstract: P-BGA-256-1 PRBG0256FB-A
Text: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FB-A D B D1 Previous Code 256F7X-D MASS[Typ.] 0.8g A A ZD b S AB e ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Index mark S D E A A1 e
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P-BGA256-17x17-1
PRBG0256FB-A
256F7X-D
P-BGA-256-1
PRBG0256FB-A
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P-BGA256-27x27-1
Abstract: PRBG0256DA-A
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DA-A Previous Code 256F7X-A D A b A ZD A1 S AB e Y W V U T R P N M L E1 K J H G F E D C B A y S 1pin corner S ZE E e B D1 MASS[Typ.] 2.1g 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA256-27x27-1
PRBG0256DA-A
256F7X-A
PRBG0256DA-A
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BGA256
Abstract: BGA256 17 X 17
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA256:
OT466-1
BGA256
BGA256 17 X 17
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT811-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA256
OT811-1
OT811-1
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PRBG0256DD-A
Abstract: 2.5G P-BGA-256-2
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DD-A D MASS[Typ.] 2.5g A A D1 B Previous Code 256F7X-F ZD b S AB e ZE Y W V U T R P N M L K J H G F E D C B A E1 E e A1 y S S 1pin corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA256-27x27-1
PRBG0256DD-A
256F7X-F
PRBG0256DD-A
2.5G
P-BGA-256-2
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BP-256
Abstract: P-BGA256-27x27-1 PRBG0256DE-A
Text: JEITA Package Code P-BGA256-27x27-1.27 RENESAS Code PRBG0256DE-A Previous Code BP-256 MASS[Typ.] 3.0g D A E B x4 v y1 S y A1 A S S SD e e Y W V U T Reference Symbol R P SE N M L Dimension in Millimeters Min Nom D 27.0 E 27.0 v K Max 0.20 w J H A G A1 F 2.5
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P-BGA256-27x27-1
PRBG0256DE-A
BP-256
BP-256
PRBG0256DE-A
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Untitled
Abstract: No abstract text available
Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x
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BGA256:
OT471-1
MS-034
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D 2395
Abstract: BGA256 17 X 17 BGA256 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L
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BGA256:
OT471-1
MS-034
D 2395
BGA256 17 X 17
BGA256
MS-034
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sm 0038
Abstract: SF-BGA256B-B-11
Text: D Package Code: BGA256B C 19.05mm [0.750"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.64mm [0.025"] X 19.05mm [0.750"] Top View reference only 2 1.27 mm [0.050"] 0.64mm [0.025"] 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA256B
FR4/G10
SF-BGA256B-B-11
sm 0038
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BGA256
Abstract: P-BGA-256-2
Text: P-BGA256-2727-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-BGA256-2727-1
BGA256
P-BGA-256-2
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16x16 bga
Abstract: 16X16 SF-BGA256G-B-11
Text: C Package Code: BGA256G D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA256G
FR4/G10
16X16
SF-BGA256G-B-11
16x16 bga
16X16
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BGA256
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA256:
OT471-1
BGA256
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SF-BGA256C-B-11
Abstract: BGA 23 x 23 array
Text: D C Package Code: BGA256C See BGA pattern code to the right for actual pattern layout Y 27.94mm [1.100"] 0.64mm [0.025"] 0.89mm [0.035"] X Top View reference only 27.94mm [1.100"] 1.27mm [0.050"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA256C
FR4/G10
SF-BGA256C-B-11
BGA 23 x 23 array
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Untitled
Abstract: No abstract text available
Text: P-BGA256-2727-1.27 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 2.22 TYP. 2/Oct. 28, 1996
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P-BGA256-2727-1
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P-BGA256-17x17-1
Abstract: 17X17 PRBG0256FA-A
Text: JEITA Package Code P-BGA256-17x17-1.00 RENESAS Code PRBG0256FA-A D B D1 Previous Code 256F7X-C MASS[Typ.] 0.7g A b A S AB ZD e y S Index mark S ZE T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 D E A A1 e
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P-BGA256-17x17-1
PRBG0256FA-A
256F7X-C
17X17
PRBG0256FA-A
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SF-BGA256A-B-11
Abstract: No abstract text available
Text: D Package Code: BGA256A C 24.13mm [0.950"] 0.64mm [0.025"] See BGA pattern code to the right for actual pattern layout Y 0.89mm [0.035"] 1.27 mm [0.050"] X Top View reference only 24.13mm [0.950"] 2 0.36mm [0.014"] dia. 0.64mm [0.025"] 5.33mm 3.74mm [0.147"]
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BGA256A
FR4/G10
SF-BGA256A-B-11
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16x16 bga
Abstract: 16X16 SF-BGA256E-B-11
Text: C Package Code: BGA256E D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 15.00mm [0.591"] X Top View (reference only) 1.00mm pitch typ. 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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BGA256E
FR4/G10
16X16
SF-BGA256E-B-11
16x16 bga
16X16
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA256
OT471-1
OT471-1
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sot471
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT471-1
sot471
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BGA256
Abstract: No abstract text available
Text: P-BGA256-1717-1.00AZ Uniti nn Jul.2003
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OCR Scan
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PDF
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P-BGA256-1717-1
BGA256
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