T405R
Abstract: Chomerics* T405 BERGQUIST softface T410R intel 82495 Bergquist BP-108 intel 80486sx Intel 82495 Cache Controller 651b thermal printer 2 inch
Text: Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide
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0486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
669-33AB
669-40AB
T405R
Chomerics* T405
BERGQUIST softface
T410R
intel 82495
Bergquist BP-108
intel 80486sx
Intel 82495 Cache Controller
651b
thermal printer 2 inch
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T405R
Abstract: Bergquist BP-108 T410R Chomerics* T405 658-35AB T405 T410 T411 T412 i960CF
Text: WTS001_p1-25 6/14/07 10:53 AM Page 2 Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefield’s recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink
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WTS001
p1-25
220486SX
I860XR
I960CA,
I960CF
AM486DX2,
AM486DX4
669-32AG
669-32AG
T405R
Bergquist BP-108
T410R
Chomerics* T405
658-35AB
T405
T410
T411
T412
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bt 1696
Abstract: 12x12 bga thermal resistance 35x35 bga BGA 23X23 BGA 27X27 pitch TsoP 20 Package XILINX xilinx CS144 thermal resistance CF1144 BGA thermal resistance 6x8 smt a1 transistor
Text: Xilinx Advanced Packaging Electronic packages are the interconnect housings for semiconductor devices. They provide electrical interconnections between the IC and the board, and they efficiently remove the heat generated by the device. Device feature sizes are
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fcBGA PACKAGE thermal resistance
Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America
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A3232
Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Text: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN
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Untitled
Abstract: No abstract text available
Text: ESMT M24L216128SA Revision History : Revision 1.0 May. 11, 2007 - Original Elite Semiconductor Memory Technology Inc. Publication Date : May. 2007 Revision : 1.0 1/10 ESMT PSRAM M24L216128SA 128K x 16 Pseudo Static RAM Features • Wide voltage range: 2.70V–3.30V
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M24L216128SA
55-ns)
70-ns)
48-ball
M24L216128SA
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AMD reflow soldering profile BGA
Abstract: Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6
Text: 5/11/99 Version 2.3 1999 Advanced Micro Devices, Inc. Advanced Micro Devices reserves the right to make changes in its products without notice in order to improve design or performance characteristics. This publication neither states nor implies any warranty of any kind, including but not limited to implied warrants of
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22247F
AMD reflow soldering profile BGA
Theta JC of FBGA
AM29LV800B thermal resistance
solder paste 63sn alpha metal
fbga thermal resistance
fbga 12 x 12 thermal resistance
smd codes marking A21
AMD thermal design retention mechanism
FR4 substrate fiberglass
AMD K6
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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NAND Flash Programmer with TSOP-48 adapter
Abstract: INTEL Core i7 860 schematic diagram inverter lcd monitor fujitsu MB506 ULTRA HIGH FREQUENCY PRESCALER fujitsu LVDS vga MB89625R VHDL code simple calculator of lcd display JTag Emulator MB90F497 Millbrook BGA TBA 129-5
Text: Master Product Selector Guide February 2001 Fujitsu Microelectronics, Inc. Contents Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Application Specific ICs ASICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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Phoenix BIOS manual f.34
Abstract: dSMC Intel Processor Identification and the CPUID intel date code format bga t95 cyrix 486 ibm 6X86MX Cyrix 6x86mx MII Processor basic architecture of Pentium Processors IDT CROSS
Text: Preliminary Information PROCESSOR Data Sheet for WinChip 2 version B Preliminary Information April 1999 IDT WINCHIP 2BTM PROCESSOR DATA SHEET This is Version 0.9 of the IDT WinChip 2 version B Processor data sheet. The latest versions of this data sheet may be obtained from
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28F160
Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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8210H
Abstract: AMD Geode GX1 300 MHz geb8 amd GX1 300 MHz
Text: AMD Geode GX1 Processor Data Book October 2003 Publication ID: June 2002 - Revision 4.1 AMD Geode™ GX1 Processor Data Book 2003 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro
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PROCESSOR
Abstract: mp 9141 es dc-dc mp 9141 es CX5520 GXm-180B 2.9V 70C power module si 3101 schematic diagram Geode GXm Processor tag 8514 30054 gxm-266b
Text: Geode GXm Processor Integrated x86 Solution with MMX Support General Description The National Semiconductor Geode™ GXm processor is an advanced 32-bit x86 compatible processor offering high performance, fully accelerated 2D graphics, a 64-bit synchronous DRAM controller and a PCI bus controller,
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32-bit
64-bit
PROCESSOR
mp 9141 es dc-dc
mp 9141 es
CX5520
GXm-180B 2.9V 70C
power module si 3101 schematic diagram
Geode GXm Processor
tag 8514
30054
gxm-266b
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str m 6524
Abstract: AC97 CS5530A CS9211 MPU-401 GX1-300 Geode GX1 Processor Series intel PC MOTHERBOARD CIRCUIT diagram x86 family 6 model 7 stepping 3 DRAM and interfacing and refreshing in the IBM PC with 8086 MP str f 6524
Text: Geode GX1 Processor Series Low Power Integrated x86 Solution General Description The National Semiconductor Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect
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DVD PORTABLE POWER BOARD
Abstract: Y52 h 85c CRTC 6845 GX1-233B-85-1.8 GX1-300B-85-2.0 AC97 CS5530A CS9211 MPU-401 intel MOTHERBOARD pcb CIRCUIT diagram
Text: Geode GX1 Processor Series Low Power Integrated x86 Solution General Description The National Semiconductor Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect
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ziva
Abstract: msi ms 7778 pcb layout computer motherboard BTS 737 S3 CS5530A CS9211 MPU-401 80286 microprocessor paging mechanism GX1-300B 4 Signal s ZiVA
Text: Geode GX1 Processor Series Low Power Integrated x86 Solution General Description The National Semiconductor Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect
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Untitled
Abstract: No abstract text available
Text: Geode GX1 Processor Series Low Power Integrated x86 Solution General Description The National Semiconductor Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect
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.05 uf 400 volt capacitor
Abstract: GX1-300B BIOS pin assignment IBM 8213 motherboard TDA9851 AC97 CS5530 CS9211 MPU-401 BTS 4141 D
Text: Geode GX1 Processor Series Low Power Integrated x86 Solution General Description The National Semiconductor Geode™ GX1 processor series is a line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it’s the perfect
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crt controller 6845
Abstract: CU 212 AB800 C-CUBE MICROSYSTEMS MAS 10 RCD 6845 crt controller ega controller marking l33 80286 address decoder AM PT Family 0Fh Processor Electrical Data She
Text: Geode GXLV Processor Series Low Power Integrated x86 Solutions General Description The National Semiconductor Geode™ GXLV processor series is a new line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it is the perfect
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Abstract: No abstract text available
Text: Geode GXLV Processor Series Low Power Integrated x86 Solutions General Description The National Semiconductor Geode™ GXLV processor series is a new line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it is the perfect
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dSMC
Abstract: WinChip-2 Phoenix BIOS manual f.34 cyrix Cyrix 6x86mx AK-02 diode T35 12H P54C P55C TR12
Text: Preliminary Information PROCESSOR Data Sheet Preliminary Information April 1999 IDT WINCHIPTM 3 PROCESSOR DATA SHEET This is Version 0.9 of the IDT WinChip 3 Processor data sheet. The latest versions of this data sheet may be obtained from www.winchip.com
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crt controller 6845
Abstract: cga to vga circuits MAS 10 RCD 6845 crt controller LA 4597 30057 ziva 5 grammer english free Y52 h 85c floppy disk controller 6845
Text: Geode GXLV Processor Series Low Power Integrated x86 Solutions General Description The National Semiconductor Geode™ GXLV processor series is a new line of integrated processors specifically designed to power information appliances for entertainment, education, and business. Serving the needs of consumers and business professionals alike, it is the perfect
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Transistor morocco 9740
Abstract: Ablebond 8360 con hdr hrs ablebond 8086 interfacing with 8254 peripheral Date Code Formats diodes St Microelectronics formatter board Canon interfacing of 8237 with 8086 ST tOP MaRKinGS 388BGA
Text: RELIABILITY REPORT Q98001 SICL BUSINESS UNIT REPORT NUMBER : Q98001 QUALIFICATION TYPE : NEW DEVICE - NEW PACKAGE DEVICE : STPC Client SIP101 SALES TYPES : STPCD0166BTC3 - STPCD0175BTC3 TECHNICAL CODE : MDBT*CHDT1BR PROCESS : HCMOS6 - CROLLES FAB LOCATION
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Q98001
SIP101)
STPCD0166BTC3
STPCD0175BTC3
388BGA
Transistor morocco 9740
Ablebond 8360
con hdr hrs
ablebond
8086 interfacing with 8254 peripheral
Date Code Formats diodes St Microelectronics
formatter board Canon
interfacing of 8237 with 8086
ST tOP MaRKinGS
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