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    BGA SOLDER BALL 0.6MM Search Results

    BGA SOLDER BALL 0.6MM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    BGA SOLDER BALL 0.6MM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    entek Cu-56

    Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		PDF Cu-56 5989-0491EN AV02-0770EN entek Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability

    BGA PROFILING

    Abstract: pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte
    Text: Surface Laminar Circuit SLC Ball Grid Array (BGA) Lead-free Surface Mount Assembly Application Note 5363 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-HT surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array


    Original     		PDF J-STD-020. AV02-0767EN BGA PROFILING pcb warpage* in smt reflow thick bga die size BGA PACKAGE thermal profile bga thermal cycling reliability fine BGA thermal profile Avago cross JEDEC SMT reflow profile am-5534 BGA cte

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    SF-BGA128C-B-62

    Abstract: No abstract text available
    Text: 10mm [0.394"] Top View 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 equiva27 SF-BGA128C-B-62

    SF-BGA144J-B-62

    Abstract: No abstract text available
    Text: Top View 10mm [0.394"] 0.6mm [0.024"] Ordering Information: 0.6mm [0.024"] Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 10mm [0.394"] -62F* *RoHS Compliant 0.8mm typ. Detail A 8.8mm square [0.346"] Side View 0.89mm [0.035"] 2.48mm [0.098"]


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA144J-B-62

    bga 484 0.8mm pitch

    Abstract: SF-BGA484E-B-62
    Text: 18mm [0.709"] Top View Ordering Information: Solder Ball Alloy 0.6mm [0.024"] Part Number Suffix Sn63Pb37 0.6mm [0.024"] -62 Sn96.5Ag3.0Cu0.5 *RoHS Compliant -62F* 18mm [0.709"] 0.8mm typ. Detail A 0.89mm [0.035"] 2.83mm [0.112"] 16.8mm square [0.661"] Side View


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA484E-B-62 bga 484 0.8mm pitch

    SF-BGA136C-B-62

    Abstract: No abstract text available
    Text: 14mm [0.551"] Top View 0.6mm [0.024"] 0.8mm typ. 0.6mm [0.024"] 10mm [0.394"] 8.8mm [0.346"] Ordering Information: Solder Ball Alloy 12.8mm [0.504"] Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 -62F* Side View 2 Detail A *RoHS Compliant 2.83mm [0.112"]


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 SF-BGA136C-B-62

    SF-BGA240N-B-62F

    Abstract: No abstract text available
    Text: 18mm [0.709"] Top View RoHS COMPLIANT 0.6mm [0.024"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm [0.661"] 0.89mm [0.035"] Detail A Side View 16.8mm [0.661"] 0.89mm [0.035"] 0.89mm [0.035"] Detail A 2.83mm [0.112"] 2 2.48mm [0.098"] 1 3 0.36mm± 0.05mm [0.014"± 0.002"]


    Original     		PDF 254mm/0 203mm 254mm0 FR4/G10 SF-BGA240N-B-62F

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    7086

    Abstract: BGA Solder Ball 0.6mm 0.35mm BGA SG-BGA-7086 BGA Solder Ball 0.35mm
    Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Top View Compression plate distributes forces evenly Easily removable swivel socket lid


    Original     		PDF 475mm. 525mm 725mm 025mm SG-BGA-7086 125mm. 7086 BGA Solder Ball 0.6mm 0.35mm BGA BGA Solder Ball 0.35mm

    BGA Solder Ball 0.6mm

    Abstract: SF-BGA240N-B-61F
    Text: 0.6mm [0.024"] 18mm [0.709"] 0.6mm [0.024"] 18mm [0.709"] 0.8mm typ. 16.8mm square [0.661"] Top View 0.2mm dia. [0.008"] 2 1 3.87mm ± 0.254mm [0.152"±0.010"] 0.8mm typ. 3 Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non


    Original     		PDF 254mm FR4/G10 22x22 SF-BGA240N-B-61F BGA Solder Ball 0.6mm

    SF-BGA304A-B-05

    Abstract: No abstract text available
    Text: Top View 38.73mm [1.525"] 2.5mm [0.098"] 27.94mm [1.100"] 3.27mm [0.129"] 2.5mm [0.098"] 2.54mm [0.100"] 2.89mm [0.114"] 33.72mm [1.328"] 38.73mm [1.525"] 27.94mm [1.100"] 1.27mm typ. [0.050"] 5.08mm [0.200"] 0-80 Threaded Insert Ø 0.6mm typ. [Ø 0.024"]


    Original     		PDF FR4/G10 Sn63Pb37 SF-BGA304A-B-05

    EA-190-H125-T710

    Abstract: EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710
    Text: Aavid Clip Attach E for Series Aavid Clip Attach E-Series BGAs AAVID CLIP ATTACH E-SERIES Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to mount plastic frame along with flexible wire springs. The wire springs are resistant to breakage and allow


    Original     		PDF UL94V-0 EA-190-H125-T710 EA-425-H125-T710 EA-190-H095-T710 EA-190-H195-T710 EA-190-H145-T710 EA-190-H175-T710 EA-400-H245-T710 EA-400-H145-T710 EA-400-H175-T710 EA-400-H095-T710

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    NET2272REV1A-LF

    Abstract: ph12 diode usb to rj45 extenders ADSP-BF537BBCZ 27.4x27.4 tmc* usb R11u 749010010 PH12 footprint PF48F2000P0ZBQ0S
    Text: Hardware User Manual TCM-BF537 V1.1 Including BGA and Border Pad Versions PRELIMINARY www.tinyboards.com Maximum Power at Minimum Size Bluetechnix www.tinyboards.com Maximum Power at Minimum Size Contact Bluetechnix Mechatronische Systeme GmbH Waidhausenstr. 3/19


    Original     		PDF TCM-BF537 NET2272REV1A-LF ph12 diode usb to rj45 extenders ADSP-BF537BBCZ 27.4x27.4 tmc* usb R11u 749010010 PH12 footprint PF48F2000P0ZBQ0S

    Untitled

    Abstract: No abstract text available
    Text: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •


    Original     		PDF 119-pin 165-pin MT55L256L18P1

    MS-026

    Abstract: MT55L256L32F MT55L256L36F MT55L256V32F MT55L256V36F MT55L512L18F MT55L512V18F micron 100 ball BGA
    Text: 8Mb: 512K x 18, 256K x 32/36 FLOW-THROUGH ZBT SRAM MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 8Mb ZBT SRAM 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • •


    Original     		PDF MT55L512L18F, MT55L512V18F, MT55L256L32F, MT55L256V32F, MT55L256L36F, MT55L256V36F 100-Pin addres01 119-Pin 165-pin MS-026 MT55L256L32F MT55L256L36F MT55L256V32F MT55L256V36F MT55L512L18F MT55L512V18F micron 100 ball BGA

    MS-026

    Abstract: MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256L18P1 MT55L256V18P1
    Text: 4Mb: 256K x 18, 128K x 32/36 PIPELINED ZBT SRAM 4Mb ZBT SRAM MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •


    Original     		PDF MT55L256L18P1, MT55L256V18P1, MT55L128L32P1, MT55L128V32P1, MT55L128L36P1, MT55L128V36P1 100-Pin 119-pin 165-pin MT55L256L18P1 MS-026 MT55L128L32P1 MT55L128L36P1 MT55L128V32P1 MT55L128V36P1 MT55L256V18P1

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY 4Mb: 256K x 18, 128K x 32/36 3.3V I/O PIPELINED, DCD SYNCBURST SRAM 4Mb SYNCBURST SRAM MT58L256L18D1, MT58L128L32D1, MT58L128L36D1 3.3V VDD, 3.3V I/O, Pipelined, DoubleCycle Deselect FEATURES 100-Pin TQFP1 • Fast clock and OE# access times


    Original     		PDF MT58L256L18D1, MT58L128L32D1, MT58L128L36D1 100-Pin 119-Pin 165-pin MT58L256L18D1

    MS-026

    Abstract: MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512L18P MT55L512V18P
    Text: 8Mb: 512K x 18, 256K x 32/36 PIPELINED ZBT SRAM 8Mb ZBT SRAM MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • • • •


    Original     		PDF MT55L512L18P, MT55L512V18P, MT55L256L32P, MT55L256V32P, MT55L256L36P, MT55L256V36P 100-Pin 119-Pin 165-pin MT55L512L18P MS-026 MT55L256L32P MT55L256L36P MT55L256V32P MT55L256V36P MT55L512V18P

    Untitled

    Abstract: No abstract text available
    Text: 4Mb: 256K x 18, 128K x 32/36 FLOW-THROUGH ZBT SRAM 4Mb ZBT SRAM MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 3.3V VDD, 3.3V or 2.5V I/O FEATURES • • • • • • • • • • • • • • • • •


    Original     		PDF MT55L256L18F1, MT55L128L32F1, MT55L128L36F1; MT55L256V18F1, MT55L128V32F1, MT55L128V36F1 100-Pin August/7/00 165-pin MT55L256L18F1