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    BGA PCB FOOTPRINT Search Results

    BGA PCB FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    L77TWB5W5SEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L77TWA3W3SMP2V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Socket, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell, 0.38m (15 in) Power, P=9.52mm (0.375in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWP3W3PEP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (40A) Contacts Only, Pin/Socket, Right Angle PCB Thru Hole European Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWB5W5PMP3V4RRM6 Amphenol Communications Solutions Dsub, Machined Hybrid, 5W5, Power (40A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=21.46mm (0.845in), 4-40 Threaded Rear Nut, With Bracket&Boardlock Visit Amphenol Communications Solutions
    L777TWA3W3PMP2V4F Amphenol Communications Solutions Dsub, Machined Hybrid, 3W3, Power (20A) Contacts Only, Pin, Right Angle PCB Thru Hole Mil (U.S.) Footprint, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Power, P=9.52mm (0.375in), 4-40 Front Screwlock, With Bracket Without Boardlock Visit Amphenol Communications Solutions

    BGA PCB FOOTPRINT Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    reflow temperature rohs bga

    Abstract: 0.65mm pitch BGA
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 157 BGA socket
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    bga PCB footprint

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


    Original     		CAT16-PREVIEW06 PDF

    Untitled

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    Untitled

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    Untitled

    Abstract: No abstract text available
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N FDZ7064N PDF

    7064N

    Abstract: FDZ7064N
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N 7064N FDZ7064N PDF

    7064N

    Abstract: FDZ7064N
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N 7064N FDZ7064N PDF

    7064N

    Abstract: FDZ7064N
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N 7064N FDZ7064N PDF

    Untitled

    Abstract: No abstract text available
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N FDZ7064N PDF

    Untitled

    Abstract: No abstract text available
    Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging


    Original     		FDZ7064N FDZ7064N PDF

    FDZ206P

    Abstract: No abstract text available
    Text: FDZ206P P-Channel 2.5V Specified PowerTrench  BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and rDS on . This BGA MOSFET embodies a


    Original     		FDZ206P FDZ206P PDF

    Untitled

    Abstract: No abstract text available
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		63Sn/37Pb BGA-TECH04 PDF

    coin test box

    Abstract: bga socket C17200
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		63Sn/37Pb, coin test box bga socket C17200 PDF

    Untitled

    Abstract: No abstract text available
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: INTERCONNECTION SPECIALISTS BGA BALL GRID ARRAY SOCKETS AND ADAPTERS A ndon’s new BGA Socket and Adapter System can efficiently replace sem icon ductors w ithout any risk o f d am agin g the expensive PCB which has m an y other expensive com ponents already assem bled.


    OCR Scan     		PDF

    bga 100 PACKAGE footprint

    Abstract: DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3
    Text: Application Note 3118 Replacing a PowerCap Module with a Reflowable BGA Module www.maxim-ic.com INTRODUCTION In order to facilitate conversion of an existing PCB design utilizing a NV SRAM PowerCap Module to the equivalent NV SRAM Single-Piece Reflowable BGA Module, there are a few simple steps required to first verify


    Original     		DS1230YP-70 256kb DS2030Y-70ons/comments/suggestions bga 100 PACKAGE footprint DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3 PDF