reflow temperature rohs bga
Abstract: 0.65mm pitch BGA
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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BGA 731
Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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0.65mm pitch BGA
Abstract: ASTM-B-488 157 BGA socket
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)
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bga PCB footprint
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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BGA 731
Abstract: bga thermal cycling reliability material for ball grid array packaging
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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Untitled
Abstract: No abstract text available
Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board
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CAT16-PREVIEW06
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Untitled
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space This BGA MOSFET embodies a
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FDZ206P
FDZ206P
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FDZ206P
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
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FDZ206P
FDZ206P
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FDZ206P
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
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FDZ206P
FDZ206P
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FDZ206P
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
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FDZ206P
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Untitled
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS ON . This BGA MOSFET embodies a
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FDZ206P
FDZ206P
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Untitled
Abstract: No abstract text available
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
FDZ7064N
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7064N
Abstract: FDZ7064N
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
7064N
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7064N
Abstract: FDZ7064N
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
7064N
FDZ7064N
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7064N
Abstract: FDZ7064N
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
7064N
FDZ7064N
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Untitled
Abstract: No abstract text available
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
FDZ7064N
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Untitled
Abstract: No abstract text available
Text: FDZ7064N 30V N-Channel Logic Level PowerTrench BGA MOSFET General Description Features Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS ON . This BGA MOSFET embodies a breakthrough in packaging
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FDZ7064N
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FDZ206P
Abstract: No abstract text available
Text: FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET General Description Features Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and rDS on . This BGA MOSFET embodies a
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FDZ206P
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Untitled
Abstract: No abstract text available
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Website: www.bgasockets.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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63Sn/37Pb
BGA-TECH04
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coin test box
Abstract: bga socket C17200
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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63Sn/37Pb,
coin test box
bga socket
C17200
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Untitled
Abstract: No abstract text available
Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB
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bga 100 PACKAGE footprint
Abstract: DS1230YP-70 DS1245 DS1250 DS1330 DS1345 DS2030Y-70 DS3832C DS3835C-RR3
Text: Application Note 3118 Replacing a PowerCap Module with a Reflowable BGA Module www.maxim-ic.com INTRODUCTION In order to facilitate conversion of an existing PCB design utilizing a NV SRAM PowerCap Module to the equivalent NV SRAM Single-Piece Reflowable BGA Module, there are a few simple steps required to first verify
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DS1230YP-70
256kb
DS2030Y-70ons/comments/suggestions
bga 100 PACKAGE footprint
DS1230YP-70
DS1245
DS1250
DS1330
DS1345
DS2030Y-70
DS3832C
DS3835C-RR3
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Untitled
Abstract: No abstract text available
Text: INTERCONNECTION SPECIALISTS BGA BALL GRID ARRAY SOCKETS AND ADAPTERS A ndon’s new BGA Socket and Adapter System can efficiently replace sem icon ductors w ithout any risk o f d am agin g the expensive PCB which has m an y other expensive com ponents already assem bled.
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