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    BGA PACKAGE 172 Search Results

    BGA PACKAGE 172 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    D6417750RBP240DV Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP240 Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    HD6417750RBP200V Renesas Electronics Corporation 32-bit Microcontrollers, BGA, / Visit Renesas Electronics Corporation
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    BGA PACKAGE 172 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    gk 7031

    Abstract: No abstract text available
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		W2637A, W2638A W2639A 5990-3892EN gk 7031 PDF

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer PDF

    Untitled

    Abstract: No abstract text available
    Text: MILL-MAX BGA ADAPTER / SOCKET SYSTEMS Mill-Max adapter and socket systems are gaining in popularity as applications for socketing BGA devices continue to grow. Typically used in ASIC and CPU development, these modules convert a BGA package to a pluggable device, thus allowing


    Original     		VRMS/150 PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF


    Original     		VL493T2863E-E7S/E6S 128MX72 VL493T2863E 128Mx8 25-bit 200-pin 200-pin, PDF

    DDR2-667

    Abstract: DDR2-800 PC2-5300 PC2-6400
    Text: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF


    Original     		VL493T2863E-E7S/E6S 128MX72 VL493T2863E 128Mx8 25-bit 200-pin 200-pin, DDR2-667 DDR2-800 PC2-5300 PC2-6400 PDF

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X PDF

    sony cmos sensor imx 172

    Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a


    Original     		VL393T2863E-E7M/E6M/D5M 128Mx72 240-PIN VL393T2863E 128Mx8 25-bit 240-pin 240-pin, 80TYP PDF

    H5PS2G83AFR-S6C

    Abstract: CAPACITOR CK 158 VN0810 DDR2-800 PC2-6400 DDR2 samsung pc2-6400 samsung dram H5PS2G83AFR
    Text: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a


    Original     		VL491T2863B-E7S 128Mx72 200-PIN VL491T2863B 128Mx8 200-pin 200-pin, VN-081009 H5PS2G83AFR-S6C CAPACITOR CK 158 VN0810 DDR2-800 PC2-6400 DDR2 samsung pc2-6400 samsung dram H5PS2G83AFR PDF

    240-PIN

    Abstract: DDR2-533 DDR2-667 DDR2-800 PC2-5300 PC2-6400
    Text: Product Specifications PART NO.: VL393T2863E-E7M/E6M/D5M REV: 1.1 General Information 1GB 128Mx72 DDR2 SDRAM VLP ECC REGISTERED DIMM 240-PIN Description The VL393T2863E is a 128Mx72 DDR2 SDRAM high density DIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a 25-bit registered buffer in BGA package, a


    Original     		VL393T2863E-E7M/E6M/D5M 128Mx72 240-PIN VL393T2863E 128Mx8 25-bit 240-pin 240-pin, 80TYP DDR2-533 DDR2-667 DDR2-800 PC2-5300 PC2-6400 PDF

    H5PS2G83AFR-S6C

    Abstract: No abstract text available
    Text: Product Specifications PART NO.: VL491T2863B-E7S REV: 1.3 General Information 1GB 128Mx72 DDR2 SDRAM ULP ECC UNBUFFERED SO-CDIMM 200-PIN Description The VL491T2863B is a 128Mx72 DDR2 SDRAM high density SO-CDIMM. This memory module consists of nine CMOS 128Mx8 bit with 8 banks DDR2 synchronous DRAMs in BGA packages, a zero delay PLL clock in BGA package, and a


    Original     		VL491T2863B-E7S 128Mx72 200-PIN VL491T2863B 128Mx8 200-pin 200-pin, VN-081009 H5PS2G83AFR-S6C PDF

    Untitled

    Abstract: No abstract text available
    Text: TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 1.1 www.ti.com CTZ/ZTZ BGA Package Bottom View The TMS320C6472 devices are designed for a package temperature range of 0°C to 85°C (commercial temperature range) or -40°C to 100°C (extended temperature range).


    Original     		TMS320C6472 SPRS612G TMS320C6472 500-MHz 625-MHz 737-Pin PDF

    actel cqfp 84

    Abstract: actel a1020b RT1425A actel a1010b actel 172 cqfp
    Text: Package Options: User I/Os per Package January 1999 1999 Actel Corporation 1 Commercial/Industrial Devices RQFP VQFP TQFP BGA CPGA CQFP 129 172 172 125 176 34 57 69 69 72 83 72 72 57 125 125 152 125 176 176 202 176 176 202 57 78 112 129 78 144 78 112 144


    Original     		A54SX16P A42MX09 A54SX08 A54SX16 A54SX32 A42MX16 A42MX24 A42MX36 A32100DX A40MX02 actel cqfp 84 actel a1020b RT1425A actel a1010b actel 172 cqfp PDF

    TS512MQR72V4T

    Abstract: No abstract text available
    Text: 240PIN DDR2 400 Registered DIMM 4096MB With 256Mx4 CL3 TS512MQR72V4T Description Placement The TS512MQR72V4T is a 512M x 72bits DDR2-400 Registered DIMM. The TS512MQR72V4T consists of 18 pcs st.512Mx4bits DDR2 SDRAMs in 56 ball BGA package, 2 pcs register in 96 ball uBGA package, 1 pcs


    Original     		240PIN 4096MB 256Mx4 TS512MQR72V4T TS512MQR72V4T 72bits DDR2-400 512Mx4bits 240-pin PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB PDF

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original     		P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G PDF

    CMOS-9HD

    Abstract: NEC stacked CSP 2000 L302 FPBGA NEC 2000 stacked
    Text: NEC Electronics Inc. CMOS-9HD 3.3-Volt, 0.35-Micron drawn CMOS Gate Array Preliminary Description January 1998 Figure 1. Tape BGA and Chip Size Package NEC's CMOS-9HD, density-enhanced, 0.35 µm gate array family delivers a complete, low-cost answer to modern-day


    Original     		35-Micron A12811EU3V0DS00 CMOS-9HD NEC stacked CSP 2000 L302 FPBGA NEC 2000 stacked PDF

    SF-BGA172A-B-11

    Abstract: No abstract text available
    Text: D Package Code: BGA172A C See BGA pattern code to the right for actual pattern layout Y 21.59mm [0.850"] X 15.24mm [0.600"] Top View reference only 1.27mm typ. [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"] [0.210"] Ø 0.64mm pad [Ø 0.025"] B 1


    Original     		BGA172A 18X13 SF-BGA172A-B-11 PDF

    DT1X

    Abstract: ADSP-21065LKCA-240 ADSP21000 ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 00 ADSP-21065LCS-240
    Text: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package


    Original     		ADSP-21065L ADSP-2106x 208-Lead 196-Ball 32-Bit 40-Bit DT1X ADSP-21065LKCA-240 ADSP21000 ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 00 ADSP-21065LCS-240 PDF

    ADSP21000

    Abstract: ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L DSP-66 TRD-G
    Text: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package


    Original     		ADSP-21065L ADSP-2106x 208-Lead 196-Ball 32-Bit 40-Bit ADSP21000 ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L DSP-66 TRD-G PDF

    ADSP-21000

    Abstract: ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 164
    Text: a DSP Microcomputer ADSP-21065L SDRAM Controller for Glueless Interface to Low Cost External Memory @ 66 MHz 64M Words External Address Range 12 Programmable I/O Pins and Two Timers with Event Capture Options Code-Compatible with ADSP-2106x Family 208-Lead MQFP or 196-Ball Mini-BGA Package


    Original     		ADSP-21065L ADSP-2106x 208-Lead 196-Ball 32-Bit 40-Bit MS-034AAE-1. ADSP-21000 ADSP-21060 ADSP-21062 ADSP-21065L 74 HTC 164 PDF

    TEA 1732

    Abstract: A09 N03
    Text: 1.6 PowerPC 603e Microprocessor Pinout Listings The following sections provide the pinout listings for the 603e CQFP and BGA packages. 1.6.1 Pinout Listing for the CQFP Package Table 10 provides the pinout listing for the 603e CQFP package. Table 10. Pinout Listing for the 240-pin CQFP Package


    OCR Scan     		240-pin 888888P 1234567I TEA 1732 A09 N03 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1.5 PowerPC 604 Microprocessor Pinout Listings The follow ing sections contain the pinout listings for the 604 C4-CQFP and BGA packages. 1.5.1 Pinout Listing for the C4-CQFP Package Table 9 provides the pinout listing for the 6 0 4 C 4 -C Q F P package. Table 9. Pinout Listing for the C4-CQFP Package


    OCR Scan     		A0-A31 DH0-31 PDF