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    BGA 84 Search Results

    BGA 84 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 84 Price and Stock

    Texas Instruments AWR1843ABGABLRQ1

    RF System on a Chip - SoC Single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator 161-FCCSP -40 to 125
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics AWR1843ABGABLRQ1 887
    • 1 $38.89
    • 10 $34.3
    • 100 $29.56
    • 1000 $24.79
    • 10000 $24.79
    		Buy Now

    Texas Instruments AWR1843ABGABLQ1

    RF System on a Chip - SoC Single-chip 76-GHz to 81-GHz automotive radar sensor integrating DSP, MCU and radar accelerator 161-FCCSP -40 to 125
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics AWR1843ABGABLQ1 422
    • 1 $27.9
    • 10 $27.44
    • 100 $27.44
    • 1000 $27.43
    • 10000 $27.43
    		Buy Now

    Renesas Electronics Corporation R9A07G084M04GBG#AC0

    Microprocessors - MPU RZ/N2L MPU BGA225 ETHER NON-SECURITY
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics R9A07G084M04GBG#AC0 251
    • 1 $18.5
    • 10 $17.01
    • 100 $16.3
    • 1000 $12.52
    • 10000 $12.52
    		Buy Now

    Texas Instruments IWR6843ABGABL

    RF System on a Chip - SoC Single-chip 60-GHz to 64-GHz intelligent mmWave sensor integrating processing capability 161-FCCSP -40 to 105
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics IWR6843ABGABL 246
    • 1 $37.5
    • 10 $34.59
    • 100 $29.74
    • 1000 $27.18
    • 10000 $27.18
    		Buy Now

    Renesas Electronics Corporation R9A07G084M08GBG#AC0

    Microprocessors - MPU RZ/N2L MPU BGA225 ETHER SECURITY
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics R9A07G084M08GBG#AC0 109
    • 1 $17.88
    • 10 $15.88
    • 100 $14.25
    • 1000 $13.03
    • 10000 $13.03
    		Buy Now
    Find more BGA 84 price and stock on Findchips.com

    BGA 84 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    gk 7031

    Abstract: No abstract text available
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A 5990-3892EN gk 7031

    W2639A

    Abstract: lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer W2638A
    Text: W2637A, W2638A and W2639A LPDDR BGA Probes for Logic Analyzers and Oscilloscopes Data sheet Introduction The W2637A, W2638A and W2639A LPDDR BGA probes provide signal accessibility and probing of embedded memory designs directly at the ball grid array BGA package.


    Original     		PDF W2637A, W2638A W2639A an120 5990-3892EN W2639A lpddr W2638A-101 W3635A N5425 9104a Oscilloscope Probe to PC E2678A specification of Logic Analyzer

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		PDF AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    Untitled

    Abstract: No abstract text available
    Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers


    Original     		PDF W3630A U4154A 5990-3179EN

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


    Original     		PDF EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet

    N5426A

    Abstract: N5451A PC Oscilloscope Probe W3630A W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630
    Text: W3630A Series DDR3 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W3630A series DDR3 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes. The Agilent W3630A series DDR3 BGA probes for logic analyzers and


    Original     		PDF W3630A 5990-3179EN N5426A N5451A PC Oscilloscope Probe W3635A DDR3 pin out quaddie ddr3 B4621A E2677A W3630

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Solder to BGA Header (Solder to Target PC Board) Connector Products 1700 Hicks Road • Rolling Meadows, IL 60008 USA Telephone: 847.392.3500 • Fax: 847.392.9404 email: mcpsales@methode.com • Web Page: www.methode.com


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MPC8560ADS-BGA Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information General Information Parameter Value Part Number MPC8560ADS-BGA Description ADS BOARD - 8560


    Original     		PDF MPC8560ADS-BGA EAR99

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    EP20K100E

    Abstract: t25 4 j5
    Text: Pin Information for the APEX EP20K100E Device Version 1.5 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin FineLine BGA FineLine BGA 356-Pin BGA 8 8 8 — 8 — 8 8 8 8 8 — 8 8


    Original     		PDF EP20K100E 144-Pin 208-Pin 240-Pin 324-Pin 356-Pin PT-EP20K100E-1 t25 4 j5

    XC95216-20PQG160I

    Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
    Text: XC95216 In-System Programmable CPLD R 5 Note: The 352-pin BGA packages are being discontinued for XC95216 devices. You cannot order these packages after May 14, 2008. Xilinx recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all designs as soon as possible. Recommended replacements are pin compatible, but


    Original     		PDF XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500

    DIN 13715

    Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
    Text: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA


    Original     		PDF N08L6182A 48-BGA N08L63W2A N04L63W2A 44-TSOP2, N04L63W1A DIN 13715 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    D1065

    Abstract: CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 D10650-40 heat sink D1085
    Text: Integrated Circuit Heat Sinks DELTEM COMPOSITE HEAT SINKS FOR PQFPs, CQFPs, AND BGAs Deltem™ D10650-40 Pin Fin Heat Sink for 100-Lead PQFPs, 169 BGA Standard P/N D10650-40 ̆ 84, 100 PQFP, 169 BGA Base Dimensions in. mm Height in. (mm) Weight lbs. (grams)


    Original     		PDF D10650-40 100-Lead D10650-40 D10850-40 i960KATM, Cx486SLC, D10850-40 486DX2 D20850-40 D1065 CX486slc D20850-40 Cyrix CX486slc 486DX2 DIMENSIONS pqfp 100 D10650 heat sink D1085

    AE23

    Abstract: AF23 EP20K60E
    Text: EP20K60E I/O Pins ver. 1.2 I/O & VREF Bank Pad Pin/Pad Function Number Orientation 144-Pin 208-Pin 240-Pin 144-Pin TQFP 1 PQFP (1) PQFP (1) FineLine BGA 324-Pin FineLine BGA 356-Pin BGA 8 8 8 8 – 8 8 8 8 8 – 8 – – – 8 8 – 8 8 8 8 8 – – 8


    Original     		PDF EP20K60E 144-Pin 208-Pin 240-Pin 144-Pin 324-Pin 356-Pin AE23 AF23

    T25 4 h5

    Abstract: AE23 AF23 EP20K60E 356-pin 215 bga BGA128
    Text: EP20K60E I/O Pins ver. 1.1 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 – Pad Number Orientation Pin/Pad Function 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 144-Pin 324-Pin 356-Pin FineLine BGA FineLine BGA BGA 1 2 3 4 5 6 7 8 9 10 11 12 13 – –


    Original     		PDF EP20K60E 144-Pin 208-Pin 240-Pin 324-Pin 356-Pin T25 4 h5 AE23 AF23 356-pin 215 bga BGA128

    E2677A

    Abstract: No abstract text available
    Text: W2635A and W2636A DDR3 BGA Probe Adapter for Infiniium Oscilloscopes Data Sheet Superior probing for DDR3 compliance test and debug The Agilent Technologies' W2635A and W2636A DDR3 BGA probe adapters provide signal access to the clock, strobe, data, address


    Original     		PDF W2635A W2636A W2635A JESD79-3C) 5989-7643EN E2677A

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 985-15x15 nnn-03-30 985-16X16-nnn-03-30 985-17X17-nnn-03-30 18X18-nnnâ 19X19--n 985-20X20-nm-03-30 985-21X21 -nnn-03-30

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and


    OCR Scan     		PDF 26x26 15X15