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    BGA 81 BALL Search Results

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    BGA 81 BALL Datasheets Context Search

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    BlueCore 3 csr

    Abstract: CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


    Original     		PDF 81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d BC01bv BlueCore 3 csr CSR BLUECORE SPI BlueCore 4 BSC COMPUTER SCIENCE digital logic design Notes BlueCore 4 csr BlueCore 5 csr CSR BLUECORE application BLUECORE uart module CSR BLUECORE module csr rf

    BlueCore 3 csr

    Abstract: BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application
    Text: Product Data Sheet Device Features BlueCore 01b TM Compliant to Bluetooth specification V1.1 TM Small footprint in 8mm x 8mm 81-ball BGA Single Chip Bluetooth Device Product Data Sheet For: USB V1.1 compliant BC01b-URT UART only version (BGA Packaging) Qualified Bluetooth firmware included


    Original     		PDF 81-ball BC01b-URT BC01bv-URT BlueCore01b bco1b-ds-003d bc01b-ds-003a bc01b-ds-003b bc01b-ds-003c bc01b-ds-003d bc01bv BlueCore 3 csr BSC COMPUTER SCIENCE digital logic design Notes CSR BLUECORE SPI CSR BLUECORE application note BlueCore 4 BlueCore 5 BlueCore 01b CSR BLUECORE SPI APPLICATION BC01B-USB-TR CSR BLUECORE application

    SF-BGA81A-B-41

    Abstract: No abstract text available
    Text: 10.00mm [0.394"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 10.00mm [0.394"] Top View 8.00mm [0.315"] Ø 0.20mm [0.008"] ±0.0005" 1.68mm [0.066"] 2 3.76mm [0.148"] 1 Side View 3 Description: Giga-snaP BGA SMT Foot 81 position male terminal pins to solder balls


    Original     		PDF FR4/G10 SF-BGA81A-B-41

    BGA and QFP Altera Package mounting profile

    Abstract: BGA PROFILING JEP113-B infrared heating gun guidelines JEP113 Reliability Data Plastic Packages QFP J-STD-020A J-STD-033 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE
    Text: Reflow Soldering Guidelines for Surface-Mount Devices June 2002, ver. 4 Application Note 81 7 Introduction Altera’s surface-mount packages include quad flat pack QFP , plastic J-lead chip carriers (PLCC), and ball-grid array (BGA), including FineLine


    Original     		PDF

    IPC-SM-780

    Abstract: IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF oC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-786 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE moisture sensitive handling and packaging BGA and QFP Altera Package mounting Solder paste floor life

    IPC-SM-780

    Abstract: IPC-SM-780 solder paste OVEN RQFP IPC-SM-786
    Text: Reflow Soldering Guidelines June 1996, ver. 1 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , J-lead chip carrier (JLCC and PLCC), ball-grid array (BGA), and small-outline integrated circuit (SOIC) devices, as well as QFP development sockets.


    Original     		PDF varyinI/IPC-SM-786) IPC-TM-650) JESD22-A112) IPC-SM-780 IPC-SM-780 solder paste OVEN RQFP IPC-SM-786

    Untitled

    Abstract: No abstract text available
    Text: Ball Grid Array BGA MAXIMUM BALL COUNT ± 0.20 D&E BASIC D1 & E1 BASIC e BASIC S REF b T1 T sb aa 16 36 36 49 64 81 100 144 4.0 X 4.0 4.0 X 4.0 5.0 x 5.0 6.0 x 6.0 7.0 x 7.0 8.0 x 8.0 9.0 x 9.0 10.0 x 10.0 2.40 x 2.40 2.50 x 2.50 4.00 x 4.00 4.80 x 4.80


    Original     		PDF

    IPC-SM-785

    Abstract: 84501 GR-1217-CORE 74221 84500 74213 Telcordia 74390 8453 back to board connector
    Text: BOARD-TO-BOARD CONNECTORS MEG-ARRAY HIGH SPEED MEZZANINE CONNECTORS FEATURES RoHS Compliant Lead-Free Ball Grid Array (BGA) termination for process friendly attachment .050" x .050" BGA interface pitch optimizes routing and electrical performance Stack Heights available from 4mm to


    Original     		PDF GR-1217-CORE NPS-25298-2 IPC-SM-785 84501 74221 84500 74213 Telcordia 74390 8453 back to board connector

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


    Original     		PDF

    bc 352 b

    Abstract: BU-61860 BU-61740B3
    Text: www.ddc-web.com Micro-ACE * µ-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .815 X .815 inches Smallest Complete 1553 Terminal 128-Ball Plastic BGA Package 0.120 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 bc 352 b BU-61860 BU-61740B3

    STANAG 3838

    Abstract: BU-61740B3
    Text: www.ddc-web.com TM µ-ACE Micro-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .80 X .80 inches Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 STANAG 3838 BU-61740B3

    BU-6474XB

    Abstract: BU-64840R3 BU-64860B3
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3

    STANAG 3838

    Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
    Text: Micro-ACE, Micro-ACE TE and PCI Micro-ACE TE www.ddc-web.com MODEL: FEATURES .8 X .8 inches, 1 mm Ball Grid Array • World's Smallest 1553 Terminal • Fully Compatible with Enhanced Mini-ACE Software and


    Original     		PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601

    BU6184

    Abstract: vram 64k BU-6186 BU-61840B3 BU-6184
    Text: www.ddc-web.com TM µ-ACE Micro-ACE MODEL: BU-61740B3/61840B3/61860B3 FEATURES • • • • • .80 X .80 inches Industry's Smallest 1553 Terminal 128-Ball Plastic BGA Package 0.140 inch Max Height Enhanced Mini-ACE Architecture Multiple Configurations:


    Original     		PDF BU-61740B3/61840B3/61860B3 128-Ball 553A/B A5976 1-800-DDC-5757 BU6184 vram 64k BU-6186 BU-61840B3 BU-6184

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    Untitled

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .


    Original     		PDF 100-Pin 100-Ball 120-Pin 128-Pin 133-Pin 144-Ball 160-Pin 176-Pin

    10123982-001LF

    Abstract: 84512-102 74221-101LF
    Text: BOARD TO BOARD CONNECTORS MEG-Array MEZZANINE Connector system HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by


    Original     		PDF 10123982-291LF 74221-091LF 74221-191LF 74221-291LF 74388-091LF 74388-191LF 74388-291LF 74390-091LF 74390-191LF 74390-291LF 10123982-001LF 84512-102 74221-101LF

    SF-BGA81A-B-42

    Abstract: No abstract text available
    Text: Patent Pending Ordering Information: Solder Ball Alloy Part Number Suffix Top View Sn63Pb37 Sn96.5Ag3.0Cu0.5 10.00mm [0.394"] -42 1.00mm [0.039"] -42F* 1.00mm typ. *RoHS Compliant 1.00mm [0.039"] 10.00mm [0.394"] 1.33mm [0.052"] 2.36mm [0.093"] Side View Detail A


    Original     		PDF Sn63Pb37 Alloy172, 254mm/0 203mm SF-BGA81A-B-42

    BOX21151

    Abstract: SF-BGA81C-B-62
    Text: 9mm [0.354"] Top View 1.3mm [0.051"] 1.3mm [0.051"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 -62 Sn96.5Ag3.0Cu0.5 9mm [0.354"] 0.8mm typ. -62F* *RoHS Compliant Detail A 6.4mm square [0.252"] 0.89mm [0.035"] 2.83mm [0.112"] Side View


    Original     		PDF Sn63Pb37 254mm/0 203mm 254mm0 FR4/G10 SF-BGA81C-B-62 BOX21151

    NPS-25298-2

    Abstract: 84516-102LF IPC-SM-785 84500-102LF 74213-202LF 84512-102LF 84530-102LF 84501-201 GS-20-033 CDC-MEGARAY-08
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY CONNECTOR SYSTEM DESCRIPTION The MEG-Array® connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights 4mm to 14mm and multiple sizes (81 signals to 528 signals)


    Original     		PDF 10Gb/s 84535-101LF 84535-201LF 74217-001LF 74217-101LF 74217-201LF 55755-001LF 55755-101LF 55755-201LF 84501-001LF NPS-25298-2 84516-102LF IPC-SM-785 84500-102LF 74213-202LF 84512-102LF 84530-102LF 84501-201 GS-20-033 CDC-MEGARAY-08

    84516-102LF

    Abstract: 84500-102LF 84520-102 74390 74217 84501-201 84512-202 GR-1217-CORE 55755-001LF 84512-102LF
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY CONNECTOR SYSTEM DESCRIPTION The MEG-Array® connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights 4mm to 14mm and multiple sizes (81 signals to 528 signals)


    Original     		PDF 10Gb/s as01LF 84535-101LF 84535-201LF 74217-001LF 74217-101LF 74217-201LF 55755-001LF 55755-101LF 55755-201LF 84516-102LF 84500-102LF 84520-102 74390 74217 84501-201 84512-202 GR-1217-CORE 55755-001LF 84512-102LF

    Untitled

    Abstract: No abstract text available
    Text: BOARD TO BOARD CONNECTORS MEG-ARRAY MEZZANINE CONNECTOR SYSTEM HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the


    Original     		PDF 55715-001LF 55715-101LF 55715-201LF 84513-001LF 84513-101LF 84513-201LF 84517-001LF 84517-101LF 84517-201LF 55724-001LF

    footprint 8M1-A

    Abstract: 196-pin bga footprint
    Text: BGA Footprints Arranged by Pitch and Ball Count See www.bgasockets.com for updates or call for latest Footprints supplement. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com


    Original     		PDF

    Lead Free reflow soldering profile BGA

    Abstract: Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181
    Text: Freescale Semiconductor Engineering Bulletin EB635 Rev. 2, 4/2005 Lead-Free BGA Solder Joint Assembly Evaluation To support a cleaner environment, meet market demands, and comply with international commercial standards and requirements, many integrated circuit devices are migrating to ball-grid array


    Original     		PDF EB635 Lead Free reflow soldering profile BGA Solder Paste, Indium, Type 3 reflow soldering profile BGA "BGA Rework Practices", 5SN3 BGA PROFILING EB635 Soldering guidelines Indalloy 181