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    BGA 388 Search Results

    BGA 388 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
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    BGA 388 Price and Stock

    LSI Corporation APP1001APBGA388-DB

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics APP1001APBGA388-DB 76
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    ZF Micro Solutions, Inc. ZFX86BGA388-C-NZ

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics ZFX86BGA388-C-NZ 24
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    LSI Corporation L-APP1001APBGA388

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    Bristol Electronics L-APP1001APBGA388 17
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    ZF Micro Solutions, Inc. ZFX86BGA388E100

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Bristol Electronics ZFX86BGA388E100 6
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    Others ZFX86BGA388-I-NZ

    INSTOCK
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    Chip 1 Exchange ZFX86BGA388-I-NZ 8
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    Find more BGA 388 price and stock on Findchips.com

    BGA 388 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    BGA388 NXP Semiconductors Footprint for reflow soldering Original PDF

    BGA 388 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    PCT-GF30

    Abstract: precidip C5440 SMD ic catalogue C17200 C54400 60352-5 footprint pga 84 BGA 23X23 0.8 540-88-044
    Text: PGA / BGA / PLCC SOCKETS PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount


    Original     		PDF

    514-PP-NNNMXX-XXX148

    Abstract: IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1
    Text: pga/bga/plcc ソケット pga/bga/plccソケット クイックセレクタ図表 PGA/BGA/PLCCソケット WWW.PRECIDIP.COM TEL +41 32 421 04 00 ピッチ SALES@PRECIDIP.COM 2.54mm PGA 千鳥型 ソケット 半田テール 1. 27mm BGA 1. 27mm PLCC 173 1mm


    Original     		PDF AC100Vrms/DC150V E18-084-17-400 540PLCC UL94V-0 600Vrms 514-PP-NNNMXX-XXX148 IEC60325 558-10-NNNPXX-XXX102 CuSn4Pb4Zn4 540-88-044 16x16 bga PT4642 558-10-NNNPXX-XXX103 540-88-032-24-000-1

    337 BGA

    Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –


    Original     		PDF EP20K200C 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin 337 BGA U212-25 AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet

    35x35 bga

    Abstract: C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877
    Text: PGA / BGA / PLCC SOCKETS QUICK SELECTOR CHART PGA / BGA / PLCC WWW.PRECIDIP.COM TEL +41 32 421 04 00 GRID SALES@PRECIDIP.COM 2.54 mm PGA INTERSTITIAL SOCKETS Solder tail 1.27 mm 1.27 mm BGA 1 mm PLCC SEE PAGE 156 161 165 173 Surface mount 156 161 165 166 169


    Original     		PDF PREC68 35x35 bga C17200 C54400 540-88-084-17-400 CuSn4Pb4Zn4 MO-052 footprint 157 BGA socket 51877

    tray bga

    Abstract: BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray
    Text: TRAY CONTAINER UNIT : mm 3x8=24 135°C MAX A' 35.35 NEC 38.00 76.0 BGA 35×35ESP 29.95 135.9 PPE A 35.35 38.00 24.50 266.0 315.0 322.6 35.35 35.00 (5.57) (6.35) 7.62 SECTION A-A' Applied Package 313-pin Plastic BGA (35×35) 352-pin Plastic BGA (35×35)


    Original     		PDF 35ESP 313-pin 352-pin 388-pin 396-pin 420-pin 456-pin 480-pin 484-pin 544-pin tray bga BGA package tray jedec bga tray bga 388 35-609 materials for BGA tray datasheet bga 609-PIN 933p bga 13.5 package tray

    DIN 13715

    Abstract: 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP
    Text: Ultra-Low Power SRAMs Density Mb Organization Voltage Range Speed (ns) Features Package N08L6182A Part Number 8 512 Kb x 16 1.65 - 2.2 70 Dual CE 48-BGA N08L63W2A 8 512 Kb x 16 2.3 - 3.6 70 Dual CE 48-BGA N04L63W2A 4 256 Kb x 16 2.3 - 3.6 55 Dual CE 44-TSOP2, 48-BGA


    Original     		PDF N08L6182A 48-BGA N08L63W2A N04L63W2A 44-TSOP2, N04L63W1A DIN 13715 12197-507-XTD AMIS41683CANN1G N08L6182AB27I FS7145-02G-XTD valve positioners 11640-843-XTP vending machine fuji SEOUL 5630 LED DATASHEET 19699-002-XTP

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 582-11-388-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 388-13-005 26 X 26


    Original     		PDF C17200) 64-56A 64-22A/31A 65-17A

    Untitled

    Abstract: No abstract text available
    Text: Product Number: 587-10-388-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 388-13-005 26 X 26 # Of Pins Mill-Max Part Number 388 587-10-388-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737


    Original     		PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A

    AH35

    Abstract: AA10 AM11 AN10 AN11 EP20K1000C 817 g24 b34 844 AB30 af31
    Text: EP20K1000C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


    Original     		PDF EP20K1000C 652-Pin 672-Pin 020-Pin AH35 AA10 AM11 AN10 AN11 817 g24 b34 844 AB30 af31

    AA10

    Abstract: AE10 AF10 AG10 AJ10 AK10 EP20K600C AF31
    Text: EP20K600C I/O Pin-Outs ver. 1.0 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 1,020-Pin FineLine BGA 1 1 – – 1 1 1 – – 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8


    Original     		PDF EP20K600C 652-Pin 672-Pin 020-Pin AA10 AE10 AF10 AG10 AJ10 AK10 AF31

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		PDF CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148

    Untitled

    Abstract: No abstract text available
    Text: Package Diagrams Index of Package Diagrams 100-Pin TQFP . 100-Ball BGA . 120-Pin PQFP .


    Original     		PDF 100-Pin 100-Ball 120-Pin 128-Pin 133-Pin 144-Ball 160-Pin 176-Pin

    Recommended land pattern smd-0.5

    Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
    Text: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout


    Original     		PDF TN1074 Recommended land pattern smd-0.5 "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256

    ispMACH M4A3

    Abstract: ISPGDX160A ispGAL22V10
    Text: 208-Ball fpBGA 256-Ball fpBGA 100-Ball caBGA 144-Ball fpBGA 49-Ball caBGA Fine Pitch BGA 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch 23.00 x 23.00 mm 1.0 mm pitch BGA 27.00 x 27.00 mm


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin ispMACH M4A3 ISPGDX160A ispGAL22V10

    B8530

    Abstract: OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640 672-pin
    Text: EPXA4 I/O Pins ver. 1.21 I/O & VREF Pad Number Bank Orientation Pin/Pad Function 1,020-Pin FineLine BGA 672-Pin FineLine BGA B1 1 PIPESTAT0 N10 H6 B1 2 PIPESTAT1 N9 H7 B1 3 PIPESTAT2 M9 L10 B1 4 TRACECLK N8 L9 B1 5 TRACESYNC M8 J6 B1 6 TRACEPKT0 L8 M8 B1 7


    Original     		PDF 020-Pin 672-Pin TRACEPKT10 TRACEPKT11 B8530 OAH29 B13101 AG10 AJ10 B10-276 B8472 B1370 B3640

    transistor SMD w26

    Abstract: t2d 04 panasonic 74HC595 SMD AA7 smd diode smd diode u1j DIODE SMD b14 smd transistor ab2 SMD H24 smd diode af3 smd w20
    Text: BGA Demo Board with FPGAs for SMII-to-MII Conversion Developer Manual January 2001 As of January 15, 2001, this document replaces the Level One document LXD9782 — BGA Demo Board with FPGAs for SMII-to-MII Conversion. Order Number: 249051-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF LXD9782 144QFP EPF10K10ATC144-1 U14-29 20SOP SN74LVTH244ADWR EPF10K30ABC356-1 MPC949FA SG-8200-DC-25 00M-PC transistor SMD w26 t2d 04 panasonic 74HC595 SMD AA7 smd diode smd diode u1j DIODE SMD b14 smd transistor ab2 SMD H24 smd diode af3 smd w20

    99043

    Abstract: bga 388 140C JESD22 ASE BGA
    Text: Cypress Semiconductor Qualification Report QTP# 99043 VERSION 1.0 May, 1999 388 Ld BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan


    Original     		PDF 388Ld 30C/60 CY37512P352-BG 99043 bga 388 140C JESD22 ASE BGA

    AA23

    Abstract: AC25 EP20K160E
    Text: EP20K160E I/O Pins ver. 1.4 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8


    Original     		PDF EP20K160E 144-Pin 208-Pin 240-Pin 356-Pin 484-Pin AA23 AC25

    AA23

    Abstract: AC25 EP20K160E
    Text: EP20K160E I/O Pins ver. 1.3 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8


    Original     		PDF EP20K160E 144-Pin 208-Pin 240-Pin 356-Pin 484-Pin AA23 AC25

    AA10

    Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
    Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA


    Original     		PDF EP20K200E 208-Pin 240-Pin 484-Pin 356-Pin 652-Pin 672-Pin AA10 AA23 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet

    F33 1067

    Abstract: 1010 817 f15 AA10 AM11 AN10 EP20K1500C 837 B34 AM3 940
    Text: EP20K1500C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 1,020-Pin FineLine BGA 1 1 1 – 1 1 1 – – 1 1 1 1 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 8 8 8 8 – – 8 8 8 8 – 1 2 3 4 5 6


    Original     		PDF EP20K1500C 652-Pin 020-Pin F33 1067 1010 817 f15 AA10 AM11 AN10 837 B34 AM3 940

    337 BGA

    Abstract: 547 B34 an17 c33 AM11 AM13 AN10 AN11 EP20K400C
    Text: EP20K400C I/O Pin-Outs ver. 1.0 I/O & VREF Bank Pad Number Orientation Pin/Pad Function 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – – 8 8 1 2 3 4 5 6 7 8 9 10


    Original     		PDF EP20K400C 652-Pin 672-Pin 337 BGA 547 B34 an17 c33 AM11 AM13 AN10 AN11

    Untitled

    Abstract: No abstract text available
    Text: INTERCONNECTION SPECIALISTS BGA BALL GRID ARRAY SOCKETS AND ADAPTERS A ndon’s new BGA Socket and Adapter System can efficiently replace sem icon ductors w ithout any risk o f d am agin g the expensive PCB which has m an y other expensive com ponents already assem bled.


    OCR Scan     		PDF