Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    BGA EMMC Search Results

    BGA EMMC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    BGA EMMC Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    DDR3L lpddr2

    Abstract: IMX6DQ6SDLSRM
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 2.1, 05/2013 MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


    Original
    PDF

    sony cmos sensor imx 172

    Abstract: sony CMOS sensor imx 135 sony IMX 132 sony IMX 122 sony IMX 135 MLB150 sony cmos sensor imx 174 sony IMX 132 CMOS MIPI dsi transmitter sony cmos sensor imx 179
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 1, 11/2012 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


    Original
    PDF

    MCIMX6S7CVM08AB

    Abstract: sony IMX 132 sony cmos sensor imx 175 sony cmos sensor imx 179 sony cmos sensor imx 174 sony IMX 138 tdm ip10 sony IMX 145 sony CMOS sensor imx 135 PCIE_rext
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLIEC Rev. 1, 11/2012 MCIMX6SxCxxxxxB MCIMX6UxCxxxxxB i.MX 6Solo/6DualLite Applications Processors for Industrial Products Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


    Original
    PDF

    Samsung eMMC 4.41

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX6SDLAEC Rev. 2.1, 05/2013 MCIMX6SxAxxxxxB MCIMX6UxAxxxxxB i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors Package Information Plastic Package BGA Case 2240 21 x 21 mm, 0.8 mm pitch


    Original
    PDF

    Toshiba NAND BGA 224

    Abstract: Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB
    Text: Preliminary THGBM3G5D1FBAIE TOSHIBA e-MMC Module 4GB THGBM3G5D1FBAIE INTRODUCTION THGBM3G5D1FBAIE is 4-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original
    P-TFBGA169-1216-0 Toshiba NAND BGA 224 Toshiba emmc Toshiba BGA 224 toshiba emmc 4.41 4GB eMMC toshiba THGBM THGBM3G emmc jedec THGBM3G5 THGB PDF

    Toshiba emmc

    Abstract: THGBM eMMC data retention Toshiba NAND BGA 224 P-TFBGA153-1113-0 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G
    Text: Preliminary THGBM3G4D1FBAIG TOSHIBA e-MMC Module 2GB THGBM3G4D1FBAIG INTRODUCTION THGBM3G4D1FBAIG is 2-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip assembled as Multi Chip Module.


    Original
    P-TFBGA153-1113-0 Toshiba emmc THGBM eMMC data retention Toshiba NAND BGA 224 THGBM3G4D1FBAIG BGA 221 eMMC toshiba Toshiba emmc performance THGBM3G PDF

    emmc controller

    Abstract: Sandisk iNAND micron emmc eMMC Sandisk eMMC Sandisk iNAND eMMC 8GB eMMC SLC emmc code emmc sector size Sandisk NAND Flash memory controller ecc
    Text: Micron e-MMC Embedded Memory Simplifies High-Capacity Storage for Mobile and Embedded Systems Summary This white paper addresses the various functions NAND designers face today. It also discusses the ways that e-MMC embedded memory can provide the necessary NAND Flash functions in an easy-to-use BGA


    Original
    PDF

    toshiba emmc

    Abstract: 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC
    Text: THGBM1GxDxEBAIx TOSHIBA e-MMC Module 1GB / 2GB / 4GB / 8GB / 16GB / 32GB THGBM1GxDxEBAIx Series INTRODUCTION THGBM1GxDxEBAIx series are 1-GB , 2-GB , 4-GB , 8-GB , 16-GB and 32-GB densities of e-MMC Module products housed in 153/169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device s and controller chip


    Original
    16-GB 32-GB toshiba emmc 153 ball eMMC memory toshiba 16GB Nand flash emmc THGBM MMC04G toshiba 8GB Nand flash bga 4GB eMMC toshiba THGBM1G5D2EBAI7 toshiba 8GB Nand flash emmc "Manufacturer ID" eMMC PDF

    emmc 4.4 standard jedec

    Abstract: GLS85VM1008A-M-I-LFWE-ND200 Specification eMMC 4.0 emmc bga eMMC data retention BGA EMMC
    Text: GLS85VM1008A / 1016A / 1032A Industrial Temp eMMC NANDrive Fact Sheet 01.000 March 2013 Features • Industry Standard Embedded MultiMediaCard eMMC Host Interface - JEDEC/MMC Standard Version 4.4 JESD84-A44 compliant - Backward compatible with eMMC 4.3


    Original
    GLS85VM1008A JESD84-A44 52MHz 180mA GLS85VM1032A) 150mA GLS85VM1016A) 120mA GLS85VM1008A) S71425-F emmc 4.4 standard jedec GLS85VM1008A-M-I-LFWE-ND200 Specification eMMC 4.0 emmc bga eMMC data retention BGA EMMC PDF

    CYUSB202X

    Abstract: No abstract text available
    Text: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off


    Original
    CYUSB202X SDR50 DDR50 CYUSB202X PDF

    CLKIN32

    Abstract: No abstract text available
    Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■


    Original
    CYUSB302x SDR50 DDR50 CLKIN32 PDF

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


    Original
    32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239 PDF

    samsung ddr3 ram MTBF

    Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd
    Text: PRODUCT SELECTION GUIDE LCD, Memory and Storage | 1H 2012 + Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original
    BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 KLMAG2GE4A-A001 k4B2G1646 KLMAG KLM8G2FE3B-B001 K4B2G0446 klm8g k4x2g323pd PDF

    samsung eMMC 4.5

    Abstract: eMMC samsung* lpddr2 lpddr2 SAMSUNG emmc emmc 4.5 emmc samsung SAMSUNG moviNAND lpddr2 mcp samsung lpddr2
    Text: Samsung Mobile Memory Taking Mobility to New Storage Horizons Mobile DRAM | Multi-Chip Packages | eMMC Samsung Mobile Memory Mobile DRAM The future of Mobile DRAM Performance and battery life are the key metrics upon which mobile electronics are measured. Samsung Mobile


    Original
    BRO-09-DRAM-001 samsung eMMC 4.5 eMMC samsung* lpddr2 lpddr2 SAMSUNG emmc emmc 4.5 emmc samsung SAMSUNG moviNAND lpddr2 mcp samsung lpddr2 PDF

    eMMC 4.4

    Abstract: emmc I.MX28 MCIMX287DVM4B freescale PMU iMX28EVK ARM926EJ-STM MCIMX283DVM4B ARM926EJ-S usb connection
    Text: Fact Sheet Consumer and Industrial Markets i.MX28 Family of Applications Processors Intelligent integration, unmatched: i.MX283, i.MX286, i.MX287 Overview i.MX28 Family The i.MX28 family of multimedia applications processors is the latest extension of Connectivity


    Original
    MX283, MX286, MX287 MCIMX286DVM4B MCIMX286CVM4B MCIMX283DVM4B MCIMX283CVM4B ARM926EJ-S IMX28CONINDFS com/imx28 eMMC 4.4 emmc I.MX28 MCIMX287DVM4B freescale PMU iMX28EVK ARM926EJ-STM MCIMX283DVM4B usb connection PDF

    emmc 4.4 standard jedec

    Abstract: emmc boot eMMC eMMC 5.0 emmc "boot mode" emmc sector size emmc controller emmc cmd18 emmc pin emmc operation
    Text: AN2539 Application note How to boot an embedded system from an eMMC equipped with a Microsoft FAT file system Overview This application note describes a set of solutions used to boot an embedded device from an Embedded MultiMediaCard eMMC™ equipped with a Microsoft File Allocation Table (FAT)


    Original
    AN2539 emmc 4.4 standard jedec emmc boot eMMC eMMC 5.0 emmc "boot mode" emmc sector size emmc controller emmc cmd18 emmc pin emmc operation PDF

    toshiba onenand

    Abstract: toshiba emmc 4.4 Toshiba 512 NAND MLC FLASH BGA movinand emmc MICRON oneNAND micron emmc Toshiba emmc movinand micron emmc 4.3 fuse n20
    Text: Freescale Semiconductor Application Note Document Number: AN3684 Rev. 0, 06/2009 i.MX25 Boot Options by Multimedia and Applications Division Freescale Semiconductor, Inc. Austin, TX This document describes the boot options for the i.MX25 device. For more in-depth details about how the boot


    Original
    AN3684 MCIMX25RM) toshiba onenand toshiba emmc 4.4 Toshiba 512 NAND MLC FLASH BGA movinand emmc MICRON oneNAND micron emmc Toshiba emmc movinand micron emmc 4.3 fuse n20 PDF

    K9HDG08U1A

    Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe
    Text: Product Selection Guide LCD, Memory and Storage - 1H 2011 Samsung Semiconductor, Inc Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, SRAM products are found in computers—from ultra-mobile notebooks


    Original
    BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e Ltn140at SAMSUNG HD502HJ hd204ui klm2g1dehe PDF

    "Manufacturer ID" eMMC

    Abstract: emmc EXT_CSD emmc "boot mode" eMMC emmc pin EXT_CSD samsung emmc boot efuse emmc boot Samsung oneNand Mux
    Text: Freescale Semiconductor Application Note Document Number: AN3996 Rev. 0, 04/2010 i.MX35 Boot Options by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the different booting options available for the i.MX35 processor. The i.MX35 offers


    Original
    AN3996 "Manufacturer ID" eMMC emmc EXT_CSD emmc "boot mode" eMMC emmc pin EXT_CSD samsung emmc boot efuse emmc boot Samsung oneNand Mux PDF

    K4X2G323PD8GD8

    Abstract: K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03
    Text: PRODUCT SELECTION GUIDE Displays, Memory and Storage 2H 2012 Samsung Semiconductor, Inc. Samsung continues to lead the industry with the broadest portfolio of memory products and technology. Its DRAM, flash, mobile, and graphics memory are found in computers—from


    Original
    BR-12-ALL-001 K4X2G323PD8GD8 K9HFGY8S5A-HCK0 K4H511638JLCCC samsung eMMC 5.0 KLMBG4GE2A-A001 K9K8G08U0D-SIB0 K4X51163PK-FGD8 KLMAG2GE4A k4h561638n-lccc K4G10325FG-HC03 PDF

    KLM8G2FE3B

    Abstract: klm8g samsung eMMC 4.5 TLC nand samsung tlc nand flash KLM4G 153 ball eMMC memory SAMSUNG emmc klm8g2 Samsung KLMBG4GE2A
    Text: Samsung eMMC Managed NAND Flash memory solution supports mobile applications FBGA QDP Package BROCHURE Efficiency, reduced costs and quicker time to market Expand device development with capable memory solutions Simplify mass storage designs Conventional NAND Flash memory can be challenging to


    Original
    PDF

    sony IMX 161

    Abstract: STMP3780 toshiba 16GB Nand flash emmc Cortex-A8 MIPI Toshiba emmc i.mx258 MC9S08GP32 sony cmos sensor imx 17 OV56 Sony IMX283
    Text: TM August 2013 TM 2 Your Interface to the World i.MX families offer the most versatile platforms for multimedia and display applications, bringing personality and interactivity to a whole new world of products Auto Smart Devices TM Industrial Medical 3 New!


    Original
    PDF

    APPLE AUTHENTICATION COPROCESSOR 2.0C

    Abstract: AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module emmc spi bridge iMX233 Apple Authentication
    Text: August, 2010 i.MX2x Portfolio Overview CON-F0960 Shailendra Miglani Senior Field Applications Engineer, Freescale India TM Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, mobileGT, PowerQUICC, StarCore, and Symphony are trademarks of Freescale Semiconductor, Inc.,


    Original
    CON-F0960 MX233 APPLE AUTHENTICATION COPROCESSOR 2.0C AR6102 AUTHENTICATION COPROCESSOR 2.0C emmc roadmap i.MX53 emmc nokia x6 camera module emmc spi bridge iMX233 Apple Authentication PDF

    PMM-C

    Abstract: micro sd card CYWB0163BB
    Text: CYWB0163BB/CYWB0164BB West Bridge Bay USB and Mass Storage Controller Features • Best-in-class sideloading performance >30 MBps based on Cypress's proprietary SLIM® II technology, enabling direct path from Hi-Speed USB 2.0 to mass storage devices


    Original
    CYWB0163BB/CYWB0164BB PMM-C micro sd card CYWB0163BB PDF