ASTM-D-257
Abstract: E59150 ASTM-D-149 ASTM-D257 ASTMD149 SIL-PAD ASTM-D5470 D1458 ASTMD5470 D374
Text: Bergquist Sil-Pad KA-l0 is the highest perfom1ance insulator that utilizes Bergquist's dielectric material T-FilmTM. KA-l0 combines T-Film with a very compliant, high thermal performance silicone rubber. The result ~ a product with good cut-through properties and
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BERGQUIST LTI-04503
Abstract: BERGQUIST mp-06503 "10 watt led" LTI-04503 ASTM 5470 GAP FILLER TCP-1000 HT-04503 Aluminum Base LED PCB 10 watt L.E.D MP-06503
Text: Thermal Solutions For Long-Term Reliability Of Power LEDs Thermal Management For LEDApplications S O L U T I O N S G U I D E Bergquist Thermal Solutions Insure Color Consistency And Maximum Lifecycles For Your LEDs. Light Emitting Diodes LEDs have been around for years, primarily
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MK80AD
D-25421
BERGQUIST LTI-04503
BERGQUIST mp-06503
"10 watt led"
LTI-04503
ASTM 5470 GAP FILLER
TCP-1000
HT-04503
Aluminum Base LED PCB
10 watt L.E.D
MP-06503
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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IPC-4562
Abstract: BERGQUIST mp-06503 ZPMV UL746E RD2018 HT-04503 HT-09009 Bergquist - Thermal Clad HPL Dielectric CML11-006 ASTM 5470 GAP FILLER
Text: TCDG_Cover_09.09.qxp 9/8/2009 1:43 PM Page 3 Thermal Solutions For Surface Mount Power Applications ThermalClad S E L E C T I O N G U I D E TCDG_Cover_09.09.qxp 9/8/2009 September 2009 1:43 PM Page 4 Thermal Clad®: U.S. Patent 4,810,563 and others. All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
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"10 watt led"
Abstract: 10 watt led 10 watt L.E.D FR4 dielectric constant vs temperature parameters of FR4 substrate with dielectric BERGQUIST XB900 imst m/L.E.D Moving Display Board
Text: Modeling Results - Infinite Heat Sink Thermal Clad MP FR-4 Temperature °C Thermal Clad LTI Temperature (°C) Temperature (°C) > 63.654 > 63.7 > 63.7 53.991 54.025 54.025 44.327 44.35 44.35 34.664 34.675 34.675 < 25 < 25 < 25 FIGURE 6 PACKAGING CONCLUSION
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ISO9001
"10 watt led"
10 watt led
10 watt L.E.D
FR4 dielectric constant vs temperature
parameters of FR4 substrate with dielectric
BERGQUIST
XB900
imst
m/L.E.D Moving Display Board
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D150 transistor
Abstract: E59150 D149 D150 D2240 D257 D374 QPAD
Text: Q-Pad 3 Easy to Handle, Greaseless Thermal Interface Features and Benefits • Thermal impedance 2 0.35°C-in /W @50 psi Typical Properties of Q-Pad 3 Property Imperial Value Metric Value Test Method Black Black Visual Color Reinforcement Carrier Fiberglass
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D2240
D150 transistor
E59150
D149
D150
D2240
D257
D374
QPAD
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ASTM D2240, D412
Abstract: ASTM D412 D1458 D149 D150 D2240 D257 D374 D412 PPK10
Text: Poly-Pad K-10 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 0.60°C-in2/W @50 psi • Polyester based • For applications requiring non-silicone conformal coatings • Designed for silicone-sensitive applications
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D2240
D1458
ASTM D2240, D412
ASTM D412
D1458
D149
D150
D2240
D257
D374
D412
PPK10
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1500ST
Abstract: D1458 bergquist D149 D150 D2240 D257 D374 D412 ASTM D5470
Text: Sil-Pad 1500ST Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits • Thermal impedance: 0.23°C-in2/W @50 psi • Naturally tacky on both sides • Pad is repositionable • Excellent thermal performance
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1500ST
D2240
D1458
1500ST
D1458
bergquist
D149
D150
D2240
D257
D374
D412
ASTM D5470
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ASTM D2240, D412
Abstract: ASTM D412 ASTM D5470 d1458 D2240 D257 D374 D412 D149 D150
Text: Poly-Pad K-10 Polyester Based Thermally Conductive Insulation Material Features and Benefits • Thermal impedance 2 0.60°C-in /W @50 psi Typical Properties of Poly-Pad K-10 Property Imperial Value Metric Value Test Method Color Yellow Yellow Visual
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D2240
D1458
ASTM D2240, D412
ASTM D412
ASTM D5470
d1458
D2240
D257
D374
D412
D149
D150
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bergquist
Abstract: bergquist silpad
Text: Sil-Pad Tubes Silicone-Based,Thermally Conductive Tubes Features and Benefits TYPICAL PROPERTIES OF SIL-PAD TUBE 400 PROPERTY Color • Thermal conductivity: SPT 400 – 0.9 W/m-K SPT 1000 – 1.2 W/m-K • For clip-mounted plastic power packages IMPERIAL VALUE
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D2240
D1458
bergquist
bergquist silpad
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MIL-I-49456
Abstract: SIL-PAD E59150 MIL-M-38527 SIL-PAD K10 MIL-M-38527C ASTM D412 for rubber MIL-M-87111 ASTM D412 D150
Text: Sil-Pad K-10 ® The High Performance Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.41°C-in /W @50 psi Typical Properties of Sil-Pad K-10 Property Imperial Value Metric Value Test Method Beige Beige Visual Color Reinforcement Carrier
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D2240
D1458
MIL-I-49456
SIL-PAD
E59150
MIL-M-38527
SIL-PAD K10
MIL-M-38527C
ASTM D412 for rubber
MIL-M-87111
ASTM D412
D150
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ASTM D2240, D412
Abstract: SIL-PAD ASTM D412 SIL-PAD 1000 TO 247 ASTM D2240 D149 D149 diode astm D149 SIL-PAD to-247 astm D150
Text: Sil-Pad 900S High Performance Insulator for Low Pressure Applications Features and Benefits • Typical Properties of Sil-Pad 900S Property Thermal impedance 2 0.61°C-in /W @50 psi Imperial Value Metric Value Test Method Pink Pink Visual Color Reinforcement Carrier
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D2240
ASTM D2240, D412
SIL-PAD
ASTM D412
SIL-PAD 1000 TO 247
ASTM D2240
D149
D149 diode
astm D149
SIL-PAD to-247
astm D150
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ASTM D2240, D412
Abstract: D412 transistor D412 E59150 astm D150 ASTM D2240 ASTM D412 MIL-M-87111 d1458 transistor SIL-PAD
Text: Sil-Pad K-6 ® The Medium Performance Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.49°C-in /W @50 psi Typical Properties of Sil-Pad K-6 Property Imperial Value Metric Value Test Method Bluegreen Bluegreen Visual Color Reinforcement Carrier
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D2240
D1458
ASTM D2240, D412
D412 transistor
D412
E59150
astm D150
ASTM D2240
ASTM D412
MIL-M-87111
d1458 transistor
SIL-PAD
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Untitled
Abstract: No abstract text available
Text: Poly-Pad K-4 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits T YPICAL PROPERT IES OF POLY-PAD K-4 PROPERTY Color • Thermal impedance: 0.95°C-in 2/W @50 psi • Polyester based • For applications requiring non-silicone
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D1458
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Untitled
Abstract: No abstract text available
Text: Sil-Pad 1500ST Electrically Insulating,Thermally Conductive,Soft Tack Elastomeric Material Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 1500ST PROPERTY Color • Thermal impedance: 0.23°C-in 2/W @50 psi • Naturally tacky on both sides • Pad is repositionable
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1500ST
D2240
D1458
1500ST
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bergquist
Abstract: No abstract text available
Text: Sil-Pad 1500ST Electrically Insulating,Thermally Conductive, Soft Tack Elastomeric Material Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 1500ST PROPERTY Color • Thermal impedance: 0.23°C-in2/W @50 psi • Naturally tacky on both sides • Pad is repositionable
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1500ST
D2240
D1458
1500ST
bergquist
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bergquist
Abstract: D150 transistor D149 D150 D2240 D257 D374
Text: Q-Pad 3 Glass-Reinforced Grease Replacement Thermal Interface Features and Benefits • Thermal impedance: 0.35°C-in2/W @50 psi • Eliminates processing constraints typically associated with grease • Conforms to surface textures • Easy handling
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D2240
bergquist
D150 transistor
D149
D150
D2240
D257
D374
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E59150
Abstract: ASTM D412 for rubber SIL-PAD ASTM D2240 ASTM D2240, D412 D1458 D149 D150 D2240 D257
Text: Sil-Pad 400 The Original Sil-Pad Material Features and Benefits • Thermal impedance 2 1.13°C-in /W @50 psi Typical Properties of Sil-Pad 400 Property Imperial Value Metric Value Test Method Gray Gray Visual Color Reinforcement Carrier Fiberglass Fiberglass
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D2240
D1458
E59150
ASTM D412 for rubber
SIL-PAD
ASTM D2240
ASTM D2240, D412
D1458
D149
D150
D2240
D257
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E59150
Abstract: cure SIL-PAD D149 D150 D2240 D257 D374 MIL-M-38527C MIL-I-49456
Text: Sil-Pad 2000 High Performance, High Reliability Insulator Features and Benefits • Thermal impedance 2 0.33°C-in /W @50 psi Typical Properties of Sil-Pad 2000 Property Color Imperial Value Metric Value Test Method White White Visual Reinforcement Carrier
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D2240
E59150
cure
SIL-PAD
D149
D150
D2240
D257
D374
MIL-M-38527C
MIL-I-49456
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SIL-PAD density
Abstract: ADHESIVE GAP PAD ASTM d792 Sil-Pad C351 D149 D150 D2240 D257 D374
Text: Gap Pad VO Ultra Soft Highly Conformable, Thermally Conductive Material for Filling Air Gaps Features and Benefits Typical Properties of Gap Pad VO UltraSoft Property • Thermal conductivity 1.0 W/m-K Color • Highly conformable nature • Shock absorbing characteristics
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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ASTM D412
Abstract: d1458 D412 ASTM-D412 astm D150 ASTM D2240 SIL-PAD ASTM D2240, D412 conductivity meter circuit D149
Text: Sil-Pad K-4 ® The Original Kapton Based Insulator Features and Benefits • Thermal impedance 2 0.48°C-in /W @50 psi Typical Properties of Sil-Pad K-4 Property Imperial Value Metric Value Test Method Gray Gray Visual Color Reinforcement Carrier Kapton
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D2240
D1458
ASTM D412
d1458
D412
ASTM-D412
astm D150
ASTM D2240
SIL-PAD
ASTM D2240, D412
conductivity meter circuit
D149
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bergquist
Abstract: SIL-PAD density conductivity ASTM D575 bergquist ultra soft
Text: Gap Pad VO Ultra Soft Ultra Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO ULTRA SOFT PROPERTY Color • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus
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FR4 dielectric constant vs temperature
Abstract: FR4 substrate with dielectric constant 4
Text: THERMAL MANAGEMENT OF SURFACE MOUNT POWER DEVICES Prepared by Herb Fick Bergquist Reprinted with permission of POWERCONVERSION & INTELLIGENT MOTION August 1987 issue. 1987 Intertech Communications, Inc. All Rights Reserved. MOTOROLA Semiconductor Products Inc.
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AR302/D
FR4 dielectric constant vs temperature
FR4 substrate with dielectric constant 4
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