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    BERGQUIST COMPANY 2010 Search Results

    BERGQUIST COMPANY 2010 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CO-213UHFMX20-100 Amphenol Cables on Demand Amphenol CO-213UHFMX20-100 UHF (PL-259) Male to UHF (PL-259) Male (RG213) 50 Ohm Coaxial Cable Assembly (High-Power / Low-Loss) 100 ft Datasheet
    CO-213NTYPEX2-010 Amphenol Cables on Demand Amphenol CO-213NTYPEX2-010 Type N Male to Type N Male (RG213) 50 Ohm Coaxial Cable Assembly (High-Power / Low-Loss) 10ft Datasheet
    CO-058RASMAX2-010 Amphenol Cables on Demand Amphenol CO-058RASMAX2-010 SMA Right Angle Male to SMA Right Angle Male (RG58) 50 Ohm Coaxial Cable Assembly 10ft Datasheet
    201-000795 Texas Instruments 32 Channel Current-Input 20-bit ADC 64-NFBGA 0 to 70 Visit Texas Instruments
    DO2010-152MLC Coilcraft Inc General Purpose Inductor, 1.5uH, 20%, 1 Element, Ferrite-Core, SMD, 0808, ROHS COMPLIANT Visit Coilcraft Inc

    BERGQUIST COMPANY 2010 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    wacker P12

    Abstract: graphite foil PG-3504 keratherm graphite foil thermal interface resistance htc electrolube 1000-1 POWER MODULE TIC4000 thermal grease p12 uscan
    Text: Application Note AN-10-001 Revision: Issue Date: 2010-03-30 Prepared by: Dieter Esau Key Words: Thermal paste THERMAL PASTE APPLICATION Designated use of thermal interface material TIM . 1


    Original     		PDF AN-10-001 wacker P12 graphite foil PG-3504 keratherm graphite foil thermal interface resistance htc electrolube 1000-1 POWER MODULE TIC4000 thermal grease p12 uscan

    XPGWHT-L1-0000-00G53

    Abstract: CREEXPSTAR101MH 1210 LED linear led 2501-2-00-44-00-00-07-0 batery 66-LGA 252AA LTM8040 P9001
    Text: MeshConnect LED Daughter Card Demo April 2010 LED Daughter Card Demo Assembly & Set-Up Sequence Purpose of Demo: To demonstrate use of MeshConnect modules, together with Cree LED and Linear LED Driver. Hardware Required: • • • • • One Computer used only for programming evaluation boards


    Original     		PDF XPGWHTL1000000G53 CREEXPSTAR101MH 2297BG LJLS1041GF LJLS1081GF IRLR8729PBF LTM8040 XPGWHT-L1-0000-00G53 1210 LED linear led 2501-2-00-44-00-00-07-0 batery 66-LGA 252AA P9001

    TPS40304

    Abstract: No abstract text available
    Text: User's Guide SLUU412 – March 2010 CSD163CEVM-591 The CSD163CEVM-591 evaluation module EVM is a synchronous buck converter providing a fixed 1.2V output at up to 25A from a 12-V input bus. The EVM is designed to start-up from a single supply; so, no additional bias voltage is required for start-up. The module uses the TPS40304 high performance,


    Original     		PDF SLUU412 CSD163CEVM-591 CSD163CEVM-591 TPS40304

    Untitled

    Abstract: No abstract text available
    Text: GE Data Sheet EHHD006A0B Hammerhead* Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Features RoHS Compliant Applications • Compliant to RoHS II EU “Directive 2011/65/EU -Z versions • Compliant to REACH Directive (EC) No 1907/2006


    Original     		PDF EHHD006A0B 18-75Vdc 12Vdc, 2011/65/EU pr24/48V 18-75Vdc) CC109167755 EHHD006A0B641-HZ 24/48V

    EHHD020

    Abstract: CC109161477 feature v fets bergquist ge din IEC Teil 2-20
    Text: GE Data Sheet EHHD020A0FHammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Features RoHS Compliant Applications • Compliant to RoHS II EU “Directive 2011/65/EU -Z versions • Compliant to REACH Directive (EC) No 1907/2006


    Original     		PDF 18-75Vdc EHHD020A0FHammerheadTM 2011/65/EU EHHD020A0F CC109161477 CC109171427 CC109161964 CC109171435 CC109161972 EHHD020 feature v fets bergquist ge din IEC Teil 2-20

    din IEC Teil 2-20

    Abstract: ehhd015a EHHD015A0A EHHD015A0A41Z
    Text: GE Data Sheet EHHD015A0A Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 5Vdc, 15.0A, 75W Output Features • Compliant to RoHS II EU “Directive 2011/65/EU -Z versions • Compliant to REACH Directive (EC) No 1907/2006  Flat and high efficiency curve


    Original     		PDF 18-75Vdc EHHD015A0A 2011/65/EU EHHD015A0A64-18HZ 24/48V 18-75Vdc) EHHD015A0A41-SZ din IEC Teil 2-20 ehhd015a EHHD015A0A41Z

    EHHD006A0B

    Abstract: EHHD006A0B641-HZ ehhd006
    Text: GE Data Sheet EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Features RoHS Compliant Applications • Compliant to RoHS II EU “Directive 2011/65/EU -Z versions • Compliant to REACH Directive (EC) No 1907/2006


    Original     		PDF 18-75Vdc 12Vdc, EHHD006A0B 2011/65/EU CC109159364 CC109167755 CC109171443 CC109167763 EHHD006A0B641-HZ ehhd006

    Untitled

    Abstract: No abstract text available
    Text: GE G Datasheet D t EHHD010 E 0A0B HA AMMERH HEAD* Se eries; DC-DC Con nverter Power Mo odules 18-75Vdc 1 In nput; 12Vdc, 10A, 120 0W Outputt Featu ures Application A ns • Distributed d Power Archite ectures • Wireless Networks N  Enterprise Networks inclu


    Original     		PDF EHHD010 18-75Vdc 12Vdc,

    Loctite 3873

    Abstract: T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X
    Text: Thermal Management for FPGAs Thermal Management for FPGAs AN-358-3.0 Application Note This application note provides guidance on thermal management of Altera devices and helps you determine the thermal performance for your application. The factors you must consider in evaluating heat dissipation include evaluating the


    Original     		PDF AN-358-3 Loctite 3873 T-PCM905C Loctite 3873 rework TPCM585 T-pcm585 datasheet of Z40-12.7B heat sink TPCM905C of Z40-12.7B heat sink Theta JC of FBGA JESD51-X

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MPC8323EEC Rev. 4, 09/2010 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications This document provides an overview of the MPC8323E PowerQUICC II Pro processor features. The MPC8323E is a


    Original     		PDF MPC8323EEC MPC8323E MPC8323E

    ADSL Modem circuit diagram SYMPHONY

    Abstract: MPC8323e MPC8321 MPC8260 MPC8321E MPC8323 SHA-256
    Text: Freescale Semiconductor Technical Data Document Number: MPC8323EEC Rev. 3, 02/2010 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications This document provides an overview of the MPC8323E PowerQUICC™ II Pro processor features. The MPC8323E


    Original     		PDF MPC8323EEC MPC8323E MPC8323E ADSL Modem circuit diagram SYMPHONY MPC8321 MPC8260 MPC8321E MPC8323 SHA-256

    Aavid cold plate

    Abstract: MPC8347EA MPC8349EA MPC860T PC16550D MPC8260 MPC8343E MPC8343EA
    Text: Freescale Semiconductor Technical Data Document Number: MPC8343EAEC Rev. 10, 10/2010 MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8343EA PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The


    Original     		PDF MPC8343EAEC MPC8343EA MPC8349EA Aavid cold plate MPC8347EA MPC860T PC16550D MPC8260 MPC8343E

    MPC8321

    Abstract: MPC8323e MPC8260 MPC8321E MPC8323 SHA-256
    Text: Freescale Semiconductor Technical Data Document Number: MPC8323EEC Rev. 4, 09/2010 MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications This document provides an overview of the MPC8323E PowerQUICC II Pro processor features. The MPC8323E is a


    Original     		PDF MPC8323EEC MPC8323E MPC8323E MPC8321 MPC8260 MPC8321E MPC8323 SHA-256

    MPC8347EA

    Abstract: MPC8349A MPC8349EA MPC8260 MPC8349E MPC860T PC16550D I2C12
    Text: Freescale Semiconductor Technical Data Document Number: MPC8349EAEC Rev. 12, 10/2010 MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349EA PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The


    Original     		PDF MPC8349EAEC MPC8349EA MPC8347EA MPC8349A MPC8260 MPC8349E MPC860T PC16550D I2C12

    RLTI-1108

    Abstract: UCC29950 CCM
    Text: Using the UCC29950EVM-631 User's Guide Literature Number: SLUUB69A March 2015 – Revised March 2015 User's Guide SLUUB69A – March 2015 – Revised March 2015 Using the UCC29950EVM-631 300-W PFC/LLC Off-Line PSU Module 1 Introduction The UCC29950EVM-631 evaluation module is a 300-W nominal, two-stage off-line converter. The EVM


    Original     		PDF UCC29950EVM-631 SLUUB69A UCC29950EVM-631 UCC29950 RLTI-1108 UCC29950 CCM

    MPC8360E

    Abstract: RGMII version 1.2a specification AN3097 MPC8358 MPC8260 MPC8358E PC16550D RFC2684 MCC 25 processor family reference manual
    Text: Freescale Semiconductor Technical Data Document Number: MPC8358EEC Rev. 2, 03/2010 MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications This document provides an overview of the MPC8358E PowerQUICC II Pro processor revision 2.1 PBGA features,


    Original     		PDF MPC8358EEC MPC8358E MPC8360E RGMII version 1.2a specification AN3097 MPC8358 MPC8260 MPC8358E PC16550D RFC2684 MCC 25 processor family reference manual

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Document Number: MPC8347EAEC Rev. 10, 05/2010 MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8347EA PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The MPC8347EA contains a processor core built on Power


    Original     		PDF MPC8347EAEC MPC8347EA MPC8349EA

    MPC8347EA

    Abstract: MPC8260 MPC8347E MPC8349EA MPC860T PC16550D MPC8347 remote control plane transmitter circuit diagram AJF MARKING
    Text: Freescale Semiconductor Technical Data Document Number: MPC8347EAEC Rev. 11, 10/2010 MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8347EA PowerQUICC II Pro is a next generation PowerQUICC II integrated host processor. The


    Original     		PDF MPC8347EAEC MPC8347EA MPC8349EA MPC8260 MPC8347E MPC860T PC16550D MPC8347 remote control plane transmitter circuit diagram AJF MARKING

    sanyo ccb specification

    Abstract: No abstract text available
    Text: Freescale Semiconductor Document Number: MPC8560EC Rev. 5, 05/2010 Technical Data MPC8560 Integrated Processor Hardware Specifications The MPC8560 integrates a processor core built on Power Architecture technology with system logic required for networking, telecommunications, and wireless infrastructure


    Original     		PDF MPC8560EC MPC8560 sanyo ccb specification

    MPC8377

    Abstract: MPC8378 MPC8378 powerQUICC 2 Pro MPC8260 MPC8349E MPC8377E MPC8378E PC16450 PC16550 SHA-256
    Text: Freescale Semiconductor Technical Data Document Number: MPC8379EEC Rev. 4, 11/2010 MPC8379E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8379E PowerQUICC II Pro processor features, including a block diagram showing the major functional components. The


    Original     		PDF MPC8379EEC MPC8379E 1588All MPC8377 MPC8378 MPC8378 powerQUICC 2 Pro MPC8260 MPC8349E MPC8377E MPC8378E PC16450 PC16550 SHA-256

    MPC8378

    Abstract: MPC8377 e300c4 mpc837
    Text: Freescale Semiconductor Technical Data Document Number: MPC8379EEC Rev. 3, 03/2010 MPC8379E PowerQUICC II Pro Processor Hardware Specifications This document provides an overview of the MPC8379E PowerQUICC II Pro processor features, including a block diagram showing the major functional components. The


    Original     		PDF MPC8379EEC MPC8379E MPC8378 MPC8377 e300c4 mpc837

    rohm diode dpak soldering

    Abstract: PCIM 186 Motorola smps HALF BRIDGE tAN philips smd electrolytic 5Bp smd transistor data Toko 10mm Film dielectric trimmers Philips philips mepcopal mepcopal capacitor so16 thinfilm resistor
    Text: AN OVERVIEW OF SURFACE MOUNT TECHNOLOGY SMT FOR POWER SUPPLY APPLICATIONS Written by: Sam Davis, PCIM Dave Hollander, Motorola Semiconductor Reprinted from HFPC, May, 1993 Proceedings Reprinted with permission from Intertec International, Inc. An Overview of Surface Mount Technology (SMT)


    OCR Scan     		PDF AR523/D rohm diode dpak soldering PCIM 186 Motorola smps HALF BRIDGE tAN philips smd electrolytic 5Bp smd transistor data Toko 10mm Film dielectric trimmers Philips philips mepcopal mepcopal capacitor so16 thinfilm resistor

    B20100C

    Abstract: 201OOCT MBRB201OOCT
    Text: MOTOROLA Order this document by MBRB201OOCT/D SEMICONDUCTOR TECHNICAL DATA Designer’s Data Sheet SWITCHMODE™ Pow er R e c tifie r MBRB201OOCT D2PAK Surface Mount Power Package Motorola Preferred Device The D2PAK Power Rectifier employs the use of the Schottky Barrier principle


    OCR Scan     		PDF MBRB201OOCT/D O-220 MBRB201OOCT MBRB20100CT/D B20100C 201OOCT MBRB201OOCT