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    BAX BOARD Search Results

    BAX BOARD Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MYC0409-NA-EVM Murata Manufacturing Co Ltd 72W, Charge Pump Module, non-isolated DC/DC Converter, Evaluation board Visit Murata Manufacturing Co Ltd
    SCR410T-K03-PCB Murata Manufacturing Co Ltd 1-Axis Gyro Sensor on Evaluation Board Visit Murata Manufacturing Co Ltd
    SCC433T-K03-PCB Murata Manufacturing Co Ltd 2-Axis Gyro, 3-axis Accelerometer combination sensor on Evaluation Board Visit Murata Manufacturing Co Ltd
    LBUA5QJ2AB-828EVB Murata Manufacturing Co Ltd QORVO UWB MODULE EVALUATION KIT Visit Murata Manufacturing Co Ltd
    SSCCOMMBOARDV4P1C Renesas Electronics Corporation SSC Communication Board Visit Renesas Electronics Corporation

    BAX BOARD Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PDC401B2

    Abstract: 78L05 524 PDC401 MXD2125E 16f873 MEMSIC inclinometer operation "Crystal Oscillator" 4mhz MXD2125 16f873 datasheet
    Text: Operating Specification of Inclinometer Demo Box July/29, 03 Note: This Demo can measure the angles in vertical plane only. 1, Real-time Angle Measuring Mode: Snap the switch to “ON", the system is turned on, You can measure the angle now. If you want to freeze the current display, press


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    PDF July/29, July/08, 100mm PDC401B2 78L05 524 PDC401 MXD2125E 16f873 MEMSIC inclinometer operation "Crystal Oscillator" 4mhz MXD2125 16f873 datasheet

    Reduced-Latency-DRAM

    Abstract: HYB18RL25616AC HYB18RL25632AC
    Text: HYB18RL25632AC HYB18RL25616AC Graphics & Speciality DRAMs 256 Mbit DDR Reduced Latency DRAM Version 1.60 July 2003 HYB18RL25616/32AC 256 Mbit DDR Reduced Latency DRAM Edition Jun. 2002 This edition was realized using the software system FrameMaker. Published by Infineon Technologies,


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    PDF HYB18RL25632AC HYB18RL25616AC HYB18RL25616/32AC 300MHz 250MHz 200MHz Reduced-Latency-DRAM HYB18RL25616AC HYB18RL25632AC

    HYB18RL25616AC

    Abstract: HYB18RL25632AC Boundary Scan JTAG Logic RLDRAM
    Text: HYB18RL25632AC HYB18RL25616AC Graphics & Speciality DRAMs 256 Mbit DDR Reduced Latency DRAM Version 1.42 Nov. 2002 HYB18RL25616/32AC 256 Mbit DDR Reduced Latency DRAM Edition Jun. 2002 This edition was realized using the software system FrameMakerâ. Published by Infineon Technologies,


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    PDF HYB18RL25632AC HYB18RL25616AC HYB18RL25616/32AC 300MHz 250MHz 200MHz HYB18RL25616AC HYB18RL25632AC Boundary Scan JTAG Logic RLDRAM

    MT49H16M18C

    Abstract: No abstract text available
    Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O


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    PDF 288Mb 288Mb clo68-3900 MT49H16M18C

    smd dk qk

    Abstract: SMD MARKING CODE ACY smd marking codes BA5 smd marking codes BA2 RLDRAM MT49H16M18C
    Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O


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    PDF 288Mb 288Mb clo68-3900 MT49H16M18C smd dk qk SMD MARKING CODE ACY smd marking codes BA5 smd marking codes BA2 RLDRAM

    smd marking codes BA5

    Abstract: MT49H16M18C
    Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O


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    PDF 288Mb 288Mb MT49H16M18C smd marking codes BA5

    SMD d1c

    Abstract: SMD MARKING CODE ACY qkx capacitor smd codes marking A21 MT49H16M18C
    Text: ADVANCE‡ 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, SIO, RLDRAM II 288Mb SIO REDUCED LATENCY RLDRAM II MT49H16M18C MT49H32M9C FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization - 16 Meg x 18, 32 Meg x 9 Separate I/O


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    PDF 288Mb 288Mb clo68-3900 MT49H16M18C SMD d1c SMD MARKING CODE ACY qkx capacitor smd codes marking A21

    MT49H16M18

    Abstract: No abstract text available
    Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization


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    PDF 288Mb 288Mb output0006, MT49H8M36 MT49H16M18

    marking code a02 SMD Transistor

    Abstract: transistor SMD DK MT49H16M18 smd transistor marking d1c Diode A3X transistor smd marking BA RE marking BAX smd cod plastic BA5 marking code A22 SMD MARKING CODE
    Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization


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    PDF 288Mb MT49H8M36 MT49H16M18 MT49H32M9 144-Ball 288Mb MT49H8M36 marking code a02 SMD Transistor transistor SMD DK MT49H16M18 smd transistor marking d1c Diode A3X transistor smd marking BA RE marking BAX smd cod plastic BA5 marking code A22 SMD MARKING CODE

    MT49H16M18

    Abstract: No abstract text available
    Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization


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    PDF 288Mb 288Mb output0006, MT49H8M36 MT49H16M18

    MARKING H1 AMP

    Abstract: MT49H16M18
    Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball FBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization


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    PDF 288Mb 288Mb output0006, MT49H8M36 MARKING H1 AMP MT49H16M18

    plastic BA7 marking code

    Abstract: No abstract text available
    Text: ADVANCE‡ 8 MEG x 36, 16 MEG x 18, 32 MEG x 9 2.5V VEXT, 1.8V VDD, HSTL, RLDRAM II 288Mb CIO REDUCED LATENCY RLDRAM II MT49H8M36 MT49H16M18 MT49H32M9 FEATURES Figure 1 144-Ball µBGA • 288Mb • 400 MHz DDR operation (800 Mb/s/pin data rate) • Organization


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    PDF 288Mb 288Mb output0006, MT49H8M36 plastic BA7 marking code

    acx 505

    Abstract: HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC
    Text: HYB18RL28818AC HYB18RL28836AC Graphics & Speciality DRAMs 288 Mbit DDR Reduced Latency DRAM Version 1.60 July 2003 HYB18RL28818/36AC 288 Mbit DDR Reduced Latency DRAM Edition July 2003 This edition was realized using the software system FrameMaker. Published by Infineon Technologies,


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    PDF HYB18RL28818AC HYB18RL28836AC HYB18RL28818/36AC 300MHz 200MHz 400MHz acx 505 HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC

    K2-dk

    Abstract: HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC
    Text: HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC Graphics & Speciality DRAMs 288 Mbit DDR Reduced Latency DRAM Version 1.5 Apr. 2003 HYB18RL28809/18/36AC 288 Mbit DDR Reduced Latency DRAM Edition Apr. 2003 This edition was realized using the software system FrameMakerâ.


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    PDF HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC HYB18RL28809/18/36AC charact200MHz 400MHz 300MHz 200MHz K2-dk HYB18RL28809AC HYB18RL28818AC HYB18RL28836AC

    Untitled

    Abstract: No abstract text available
    Text: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • LPC Interface Flash – SST49LF020: 256K x8 2 Mbit • Conforms to Intel LPC Interface Specification 1.0 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks


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    PDF SST49LF020 SST49LF0202Mb SST49LF020: 32-tsop-WH-7 32-LEAD SST49LF040 S71175-05-000

    FFBC0100H

    Abstract: SST49LF020
    Text: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • Standard LPC Interface – Conforms to Intel LPC Interface Specification 1.0 • Organized as 256K x8 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks


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    PDF SST49LF020 SST49LF0202Mb MO-142 32-LEAD 32-tsop-WH-7 S71175-02-000 FFBC0100H SST49LF020

    Low Pin Count LPC Interface Specification 1.0

    Abstract: No abstract text available
    Text: 2 Mbit LPC Flash SST49LF020 SST49LF0202Mb LPC Flash Advance Information FEATURES: • Standard LPC Interface – Conforms to Intel LPC Interface Specification 1.0 • Organized as 256K x8 • Flexible Erase Capability – Uniform 4 KByte sectors – Uniform 16 KByte overlay blocks


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    PDF SST49LF020 SST49LF0202Mb MO-142 32-tsop-WH-7 32-LEAD S71175-04-000 Low Pin Count LPC Interface Specification 1.0

    555H

    Abstract: SST34HF162C SST34HF164C
    Text: 16 Mbit Dual-Bank Flash + 2/4 Mbit SRAM ComboMemory SST34HF162C / SST34HF164C SST34HF162C16Mb Dual-Bank Flash + 2/4 Mb SRAM MCP ComboMemory Preliminary Specifications FEATURES: • Flash Organization: 1M x16 – 16 Mbit: 12 Mbit + 4 Mbit • Concurrent Operation


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    PDF SST34HF162C SST34HF164C SST34HF162C16Mb Block-Era-10x12-500mic-2 48-BALL S71269-01-000 555H SST34HF164C

    555H

    Abstract: SST34HF162C SST34HF164C
    Text: 16 Mbit Dual-Bank Flash + 2/4 Mbit SRAM ComboMemory SST34HF162C / SST34HF164C SST34HF162C16Mb Dual-Bank Flash + 2/4 Mb SRAM MCP ComboMemory EOL Data Sheet FEATURES: • Flash Organization: 1M x16 – 16 Mbit: 12 Mbit + 4 Mbit • Concurrent Operation – Read from or Write to SRAM while


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    PDF SST34HF162C SST34HF164C SST34HF162C16Mb S71269 SST34HF1641J S71336 S71269-02-EOL 555H SST34HF164C

    Untitled

    Abstract: No abstract text available
    Text: AMP Aerospace/R uggedized Printed C ircuit Board Connectors Catalog 296350 issued 9-97 Extended M ini-Bax Pin Header Assem blies Style I H o u sing M a t e r ia l— L iq u ic c ry s ta l p o ly m e r C o n tact M a te r ia l an d F in is h — B ra ss p er Q Q -B -6 2 B p a tari 0 0 0 0 5 0


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    Untitled

    Abstract: No abstract text available
    Text: LOOSE PIN INTERCONNECTS Pin receptacles are individual component lead sockets primarily used for the plugging and unplugging of components on pc boards. Pin receptacles are made by press-fitting a pre-tooled “multi-finger” contact into a precision machined shell. These receptacles will accept round pins ranging in diameter


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    Untitled

    Abstract: No abstract text available
    Text: 2,5mm Density, Crimp Type 2~Piece Connectors P52, CPM-A11 Series Connectors !OUTLINE P52 Series is 2-piece, type high density connector with the contact space of 2.5mm, having a clamp and polarization device built in. FEATURES_


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    PDF CPM-A11 UL-94V-0 UL-94V-0) P52-04-30-114P) 5s005 P52M83-04) P52C84)

    Untitled

    Abstract: No abstract text available
    Text: PC Edgecard Connectors Edgecard Connector One Piece An economical one-piece edgecard connector with non-removable contacts. Shell configurations can be ordered with or without an integral mounting flange and the insulator material is of thermo­ plastic, rated UL 94V-0.


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    PDF Electric-3108N 121639-3099N 121639-3109N

    27S45

    Abstract: AM27S45
    Text: Am27S45/Am27S47 a 16,384-Bit 2048x8 Bipolar Registered PROM with Programmable INITIALIZE Input DISTINCTIVE CHARACTERISTICS "S A " version offers superior performance with 25 ns setup time and 10 ns ciock-to-output delay* Slim, 24-pin, 300-mil lateral center package occupies


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    PDF Am27S45/Am27S47 384-Bit 2048x8) 24-pin, 300-mil Am27S45 Am27S47 progra03186 27S45SA* 27S47SA* 27S45