Untitled
Abstract: No abstract text available
Text: 4-Ball Wafer Level Chip Scale Package [WLCSP] CB-4-2 Dimensions shown in millimeters A1 BALL CORNER 0.660 0.600 0.540 0.860 0.820 SQ 0.780 SEATING PLANE 0.40 2 1 A 0.280 0.260 0.240 B BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.230 0.200 0.170 BOTTOM VIEW (BALL SIDE UP)
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Original
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01507-A
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PDF
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WLCSP
Abstract: CB91 Ball cb 91
Text: a 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-1 Dimensions shown in millimeters 0.65 0.59 0.53 BALL 1 IDENTIFIER SEATING PLANE 3 2 A 0.35 0.32 0.29 1.750 1.690 1.630 B C 0.50 BSC BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.28 0.24 0.20 1 BOTTOM VIEW (BALL SIDE UP)
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Original
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091306-B
WLCSP
CB91
Ball
cb 91
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PDF
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WLCSP
Abstract: Ball CB92
Text: 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-2 Dimensions shown in millimeters A1 BALL CORNER 0.655 0.600 0.545 1.490 1.460 SQ 1.430 SEATING PLANE 3 2 A 0.350 0.320 0.290 B C 0.50 BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.385 0.360 0.335 0.270 0.240 0.210
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Original
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101507-C
WLCSP
Ball
CB92
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PDF
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Untitled
Abstract: No abstract text available
Text: 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-1 Dimensions shown in millimeters 1.34 1.14 0.94 0.44 0.36 0.28 0.67 0.57 0.47 0.50 BALL PITCH BALL 1 IDENTIFIER 2 SEATING PLANE 1 0.32 NOM A 2.38 2.18 1.98 B 0.59 TOP VIEW (BALL SIDE DOWN) 0.24 MAX COPLANARITY
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Original
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21707-A
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PDF
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trackball
Abstract: trackball ch DT225 track ball usb trackball trackball ch in
Text: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL USB INPUT: OUTPUT: MECHANICAL 5V @ 25mA max USB1.1 BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 2.25” Continuous 12g 460g 5 Million 2.38in (60.45mm)
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Original
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DT2257X20V00-Blk
DT225
trackball
trackball ch
track ball
usb trackball
trackball ch in
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PDF
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CB301
Abstract: No abstract text available
Text: 30-Ball Wafer Level Chip Scale Package [WLCSP] CB-30-1 a Dimensions shown in millimeters 0.65 0.59 0.53 2.56 2.50 2.44 SEATING PLANE 5 4 3 2 1 A BALL A1 CORNER B 0.36 0.32 0.28 3.06 3.00 2.94 C D E 0.50 BALL PITCH TOP VIEW (BALL SIDE DOWN) 0.28 0.24 0.20
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Original
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30-Ball
CB-30-1)
92106-A
CB301
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PDF
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trackball ch
Abstract: DT225 trackball trackball dt225 DT225 Gray Desktop trackball ch in 460g DT2253X20V00
Text: 5.07in 128.78mm 5.51in (139.95mm) SPECIFICATIONS ELECTRICAL PS/2 INPUT: OUTPUT: MECHANICAL BALL DIAMETER: BALL ROTATION: TRACKING FORCE: WEIGHT LIFE CYCLE (BALL ROTATIONS): RoHS compliant 5V @ 25mA max CMOS/TTL 2.25” Continuous 12g 460g 5 Million 2.38in
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Original
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DT2253X20V00
DT225
trackball ch
trackball
trackball dt225
DT225 Gray Desktop
trackball ch in
460g
DT2253X20V00
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PDF
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of push to on switch
Abstract: No abstract text available
Text: Multi Function Switches/EVQWJN Jog Ball Type: EVQWJN • Features ■ Usage Example ● External dimensions : 10.7 mm҂9.3 mm, Height: 6.0 mm, <Ball rotary operation> Ball : 360 ° endless rotation + Push operation : φ5.5 mm : 1 million operations each direction
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Original
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pulses/360
AN48840B)
AN48840B
of push to on switch
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PDF
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es61
Abstract: IC 7801 AN48840B JOG SWITCH ball switch
Text: Multi Function Switches/EVQWJN Jog Ball Type: EVQWJN • Features ■ Usage Example ● External dimensions : 10.7 mm҂9.3 mm, Height: 6.0 mm, <Ball rotary operation> Ball : 360 ° endless rotation + Push operation : φ5.5 mm : 1 million operations each direction
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Original
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pulses/360
AN48840B)
AN48840B
es61
IC 7801
AN48840B
JOG SWITCH
ball switch
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27C 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE HPBGA Rev 1, 6/10 0.20 (4X) 27.00 A1 BALL PAD CORNER 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL A
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Original
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27x27C
5m-1994.
MS-034/A
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PDF
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112ball
Abstract: 112-ball 080307-A MO-225 DSA0044716
Text: a 112-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-112-1 Dimensions shown in millimeters A1 BALL CORNER 8.10 8.00 SQ 7.90 11 10 9 8 7 6 5 4 3 2 1 A BALL A1 PAD CORNER B C D E F G 6.50 BSC SQ H J K L 0.65 BSC BOTTOM VIEW TOP VIEW DETAIL A DETAIL A
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Original
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112-Ball
BC-112-1)
MO-225
80307-A
112ball
080307-A
MO-225
DSA0044716
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PDF
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V356
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Package PBGA V356.27x27B 0.20 (4X) 27.00 24.00 A1 BALL PAD CORNER A 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) +0.35 -0.05 B 4X 10.00 NO. OF LAYERS DIM “A” DIM “B” NOTES 4 2.33±0.21
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Original
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27x27B
5M-1994.
20x20.
MS-034/A
V356
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PDF
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196-BALL
Abstract: No abstract text available
Text: 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-2 Dimensions shown in millimeters 15.20 15.00 SQ 14.80 A1 BALL PAD CORNER 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P BALL A1 INDICATOR 13.00 BSC SQ 1.00 BSC TOP VIEW BOTTOM VIEW
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Original
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196-Ball
BC-196-2)
MO-192-AAE-1
20907-A
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PDF
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Solder Balls
Abstract: V356
Text: Plastic Packages for Integrated Circuits Heatsink Plastic Ball Grid Array Package HPBGA 27.00 A1 BALL PAD CORNER 0.20 (4X) V356.27x27C A 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) 24.00 +0.35 -0.05 4X 10.00 B NO. OF LAYERS DIM “A” DIM “B”
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Original
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27x27C
5M-1994.
20x20.
MS-034/A
Solder Balls
V356
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PDF
|
|
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011008-B
Abstract: CB82
Text: 8-Ball Wafer Level Chip Scale Package [WLCSP] CB-8-2 Dimensions shown in millimeters a 0.650 0.595 0.540 1.460 1.420 SQ 1.380 SEATING PLANE 3 2 1 0.340 0.320 0.300 BALL 1 IDENTIFIER A B 0.50 BALL PITCH 0.380 0.355 0.330 COPLANARITY 0.075 0.270 0.240 0.210
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Original
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011008-B
011008-B
CB82
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PDF
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Untitled
Abstract: No abstract text available
Text: 196-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-196-3 Dimensions shown in millimeters 15.20 15.00 SQ 14.80 A1 BALL PAD CORNER 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P BALL A1 INDICATOR 13.00 BSC SQ 1.00 BSC TOP VIEW BOTTOM VIEW
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Original
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196-Ball
BC-196-3)
MO-192-AAE-1
20907-A
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PDF
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27B 356 BALL PLASTIC BALL GRID ARRAY PACKAGE PBGA Rev 2, 10/10 0.20 (4X) 27.00 A1 BALL PAD CORNER A 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL B 20 18 16 14 12 10 8 6 4 2
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Original
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27x27B
5M-1994.
MS-034/A
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PDF
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MO-205
Abstract: TAPE AND REEL BGA 54-BALL
Text: Revised May 2001 BGA Tape and Reel Specifications Tape and Reel Quantities Package Code GX Package Description Package Drawing Number Tape and Reel Container Quantity 54-Ball Fine-Pitch Ball Grid Array FBGA , JEDEC MO-205, 5.5mm Wide BGA54A 2500 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
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Original
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BGA54A
96-Ball
MO-205,
BGA96A
114-Ball
54-Ball
BGA114A
MO-205
TAPE AND REEL BGA
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PDF
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Ball
Abstract: 25-BALL
Text: 25-Ball Wafer Level Chip Scale Package [WLCSP] CB-25 a Dimensions shown in millimeters 0.650 0.590 0.530 2.825 2.765 2.705 SEATING PLANE 5 4 3 2 1 A BALL 1 IDENTIFIER 2.605 2.545 2.485 0.50 BALL PITCH B 0.360 0.320 0.280 C D E 0.240 0.220 0.200 BOTTOM VIEW
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Original
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25-Ball
CB-25)
81607-A
Ball
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PDF
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Untitled
Abstract: No abstract text available
Text: 5-Ball Wafer Level Chip Scale Package [WLCSP] CB-5-1 Dimensions shown in millimeters 0.94 0.90 0.86 0.37 0.36 0.35 0.50 REF SEATING PLANE 0.87 BALL 1 IDENTIFIER 1.33 1.29 1.25 2 1 A 0.23 0.18 0.14 0.50 0.21 TOP VIEW (BALL SIDE DOWN) 0.17 0.14 0.12 B C 0.50
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Original
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01607-A
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PDF
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CB141
Abstract: b 595 transistor CB-14-1
Text: 14-Ball Wafer Level Chip Scale Package [WLCSP] CB-14-1 Dimensions shown in millimeters a 0.650 0.595 0.540 1.50 1.46 1.42 0.25 BSC 0.25 BSC 3 SEATING PLANE 2 0.25 BSC 0.25 BSC 1 A BALL 1 IDENTIFIER 0.50 BSC B TOP VIEW (BALL SIDE DOWN) 0.340 0.320 0.300 0.380
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Original
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14-Ball
CB-14-1)
61208-A
CB141
b 595 transistor
CB-14-1
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PDF
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Untitled
Abstract: No abstract text available
Text: a 8-Ball Wafer Level Chip Scale Package [WLCSP] CB-8-1 Dimensions shown in millimeters 0.675 0.595 0.515 1.480 1.430 1.380 BALL 1 IDENTIFIER SEATING PLANE 3 2 1 A 0.340 0.320 0.300 1.825 1.775 1.725 B C 0.50 BALL PITCH 0.380 0.355 0.330 BOTTOM VIEW 0.27
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Original
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090706-B
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PDF
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CB253
Abstract: No abstract text available
Text: 25-Ball Wafer Level Chip Scale Package [WLCSP] CB-25-3 Dimensions shown in millimeters a 0.600 0.555 0.510 2.295 2.245 2.195 SEATING PLANE 5 4 3 2 1 A BALL 1 IDENTIFIER B 0.287 0.267 0.247 0.23 0.20 0.17 C D 0.40 REF TOP VIEW (BALL SIDE DOWN) 1.60 REF E
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Original
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25-Ball
CB-25-3)
81908-A
CB253
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PDF
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jedec bottom
Abstract: No abstract text available
Text: a BALL A1 PAD CORNER 84-Ball Chip Scale Package Ball Grid Array [CSP_BGA] BC-84-1 Dimensions shown in millimeters A1 CORNER INDEX AREA 6.10 6.00 SQ 5.90 10 9 8 7 6 5 4 3 2 1 A 4.50 BSC SQ 0.50 BSC 0.80 0.75 0.70 TOP VIEW *1.40 1.26 1.11 DETAIL A BOTTOM VIEW
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Original
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84-Ball
BC-84-1)
MO-195-BC
33106-A
jedec bottom
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PDF
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