Magnetic latching reed switch
Abstract: No abstract text available
Text: MK6 Series MEDER electronic Reed Sensors for PCB Mounting DESCRIPTION APPLICATIONS • Telecommunications Telephone hook switch, keyboard applications • Domestic appliances Door switch for washing machines, dishwashers, microwave ovens, baking ovens, refrigerators
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Magnetic latching reed switch
Abstract: mk6 sensor
Text: MK6 Series MEDER electronic Reed Sensors for PCB Mounting DESCRIPTION APPLICATIONS • Telecommunications Telephone hook switch, keyboard applications • Domestic appliances Door switch for washing machines, dishwashers, microwave ovens, baking ovens, refrigerators
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GP1S296HCPSF
Abstract: No abstract text available
Text: GP1S296HCPSF GP1S296HCPSF Gap : 1.0mm, Slit : 0.2mm Phototransistor Output, Compact Transmissive Photointerrupter •Description ■Agency approvals/Compliance GP1S296HCPSF is a compact and low-profile, transmissive photointerrupter with photo-transistor output and detects an object between the emitter and
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GP1S296HCPSF
GP1S296HCPSF
2002/95/EC)
OP13015EN
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GP1S396HCPSF
Abstract: No abstract text available
Text: GP1S396HCPSF GP1S396HCPSF Gap : 1.2mm Slit : 0.12mm Phototransistor Output, Compact Transmissive Photointerrupter •Description ■Agency approvals/Compliance GP1S396HCPSF is a phototransistor output, transmissive photointerrupter with a industry’s smallest compact and low-profile package by the thin
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GP1S396HCPSF
GP1S396HCPSF
2002/95/EC)
OP13020EN
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GP1S195HCPSF
Abstract: No abstract text available
Text: GP1S195HCPSF GP1S195HCPSF Gap : 1.5mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter •Description ■Agency approvals/Compliance 1. Compliant with RoHS directive 2002/95/EC GP1S195HCPSF is a compact and low-profile, transmissive photointerrupter with photo-transistor
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GP1S195HCPSF
2002/95/EC)
GP1S195HCPSF
OP13029EN
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oki qfp tray
Abstract: Ultrasonic humidifier circuit 750H OKI Year Work Week "the package information document consisting of 8 chapters in total" Oki Moisture Oki Moisture level
Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE This document is Chapter 3 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 3. SEMICONDUCTOR PACKAGE HANDLING GUIDE
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G004
Abstract: ipc-sm-786A MIL-STD-81075 MIL-D-3464 IPC-4202 JESD22-A113 GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-786 research and development procedure in electronics industry P-21373
Text: MOISTURE CONTROL MEASURES for Epoxy Encapsulated Surface Mount Magnetic Components Extending Pulse’s Commitment to a Quality Partnership 1996, Pulse Engineering, Inc. G004 EXECUTIVE SUMMARY The Situation Over the past decade, the transition from through-hole to SMT production techniques has revealed quality
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GP2AP002S30F
Abstract: No abstract text available
Text: GP2AP002S30F GP2AP002S30F Proximity Sensor •Description ■Agency approvals/Compliance GP2AP002S30F provide a digital detection system integrated into one package the light emitting element and a light receiving element. So small package size, it is easy to mount on the
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GP2AP002S30F
GP2AP002S30F
2002/95/EC)
OP13036EN
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528UY2C A PRODUCT SPECIFICATION Model No.： ：FYLS-3528UY2C Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:Yellow ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528UY2C
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528PG2C A PRODUCT SPECIFICATION Model No.： ：FYLS-3528PG2C Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:Pure Green ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528PG2C
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-0402UBC A PRODUCT SPECIFICATION Model No. ：FYLS-0402UBC Features: •SMD Type ■Size mm :1.0*0.5*0.35 NEW ■Emitting Color:Blue ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-0402UBC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528UW2C A PRODUCT SPECIFICATION Model No.： ：FYLS-3528UW2C Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:White ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528UW2C
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-0402UAC A PRODUCT SPECIFICATION Model No. ：FYLS-0402UAC Features: •SMD Type ■Size mm :1.0*0.5*0.35 NEW ■Emitting Color:Amber ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-0402UAC
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HUmiseal 1B73
Abstract: Ultrasonic cleaner circuit diagram cree led tilex HUmiseal pledge furniture polish hydrocarbon polymeric SN62 PB36 ag2 Ultrasonic cleaner 1B73
Text: Cree XLamp® LED Soldering & Handling XLamp 4550 & XR Family LEDs This application note applies to XLamp 4550 & XR family XR-E, XR-C & XR LEDs, which have order codes in the following fomat: XL4550xx-xx-xxxx XR7090xx-xx-xxxx XRCxxx-xx-xxxx-xxxxxx XRExxx-xx-xxxx-xxxxxx
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XL4550xx-xx-xxxx
XR7090xx-xx-xxxx
CLD-AP16
HUmiseal 1B73
Ultrasonic cleaner circuit diagram
cree led
tilex
HUmiseal
pledge furniture polish
hydrocarbon polymeric
SN62 PB36 ag2
Ultrasonic cleaner
1B73
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528BLUYC A PRODUCT SPECIFICATION Model No. ：FYLS-3528BLUYC Features: •TOP LED Type ■Size mm :3.5*2.8*1.9 ■Emitting Color:Yellow ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-3528BLUYC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528UBC A PRODUCT SPECIFICATION Model No.： ：FYLS-3528UBC Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:Blue ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528UBC
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gp2ap054a00f
Abstract: dark light sensor using LDR
Text: GP2AP054A00F GP2AP054A00F Proximity/Gesture Sensor with Integrated Ambient Light Sensor •Agency approvals/Compliance ■Description GP2AP054A00F is Gesture and Proximity Sensor with Ambient Light Sensor. Ambient light sensor detects the brightness. Proximity sensor detects presence of object.
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GP2AP054A00F
GP2AP054A00F
2002/95/EC)
OP14042EN
dark light sensor using LDR
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Untitled
Abstract: No abstract text available
Text: fax id: 6001 1 Moisture-Sensitive Devices Handling Information Cypress Dry Bag Policy ommends that the bag stay sealed until the enclosed devices are ready for use. In order to insure against moisture damage, Cypress carries out dry bake and dry packing on all devices that are moisture
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528PGC A PRODUCT SPECIFICATION Model No.： ：FYLS-3528PGC Features: •TOP LED Type ■ Size mm :3.5*2.8*1.9 ■ Emitting Color:Pure Green ■ SMT package ■ Suitable for all SMT assembly and soldering method ■ Pb-free Reflow soldering application
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FYLS-3528PGC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-0402PGC A PRODUCT SPECIFICATION Model No. ：FYLS-0402PGC Features: •SMD Type ■Size mm :1.0*0.5*0.35 NEW ■Emitting Color:Pure Green ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-0402PGC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-3528LUYC A PRODUCT SPECIFICATION Model No. ：FYLS-3528LUYC Features: •TOP LED Type ■Size mm :3.5*2.8*1.9 ■Emitting Color:Yellow ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-3528LUYC
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Untitled
Abstract: No abstract text available
Text: Model. No. Rev. FYLS-0402URC A PRODUCT SPECIFICATION Model No. ：FYLS-0402URC Features: •SMD Type ■Size mm :1.0*0.5*0.35 NEW ■Emitting Color:Red ■SMT package ■Suitable for all SMT assembly and soldering method ■Pb-free Reflow soldering application
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FYLS-0402URC
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eiaj-c3
Abstract: GA1A1S201WP ED-06G070
Text: SPEC. No. ED-06G070 ISSUE October 12,2006 SHARP OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION “ DEVICE SPECIFICATION FOR OPIC LIGHT DETECTOR MODEL No. GA1A1S201WP Specified for Enclosed please find copies of the Specifications which consists of 14 pages including cover.
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ED-06G070
GA1A1S201WP
5to30Â
eiaj-c3
GA1A1S201WP
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GA1A1S100WP
Abstract: GA1A1S100 eiaj-c3 ga1a
Text: ED-07G020 ay 25,2007 H E R E S OPTO-ANALOG DEVICES DIVISION ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION f DEVICE SPECIFICATION FOR OPIC LIGHTDETECTOR MODEL No. GA1A1S100WP Specified for Enclosed please find copies of the Specifications which consists of 17 pages including cover.
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ED-07G020
GA1AIS100WP
GA1A1S100WP
000pcs
GA1A1S100WP
GA1A1S100
eiaj-c3
ga1a
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