Untitled
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible
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MP-06503
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Hokuriku crystal
Abstract: No abstract text available
Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series Features Ultra-small package 5.0 mmx3.2 mm , 1.2 mm thick Power supply voltage 3.3V type High reliability is achieved by metal cap and AuSn vacuum sealing Most suitable for automatic mounting, reflow soldering
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KCO-500
KCO-500
6864MHz
000MHz
Hokuriku crystal
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Hokuriku crystal
Abstract: No abstract text available
Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series 䂓Features 䊶Ultra-small package 5.0 mm㬍3.2 mm , 1.2 mm thick 䊶Power supply voltage 3.3V type 䊶High reliability is achieved by metal cap and AuSn vacuum sealing
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KCO-500
KCO-500
6864MHz
000MHz
Hokuriku crystal
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AuSn eutectic
Abstract: AN3017 k-242 305O self-aligned AuSn solder
Text: Procedure for Multifunction Self-Aligned Gate MSAG AuSn Eutectic Solderability 1. AN3017 Rev — Introduction The following procedure is M/A-COM’s recommended instruction for eutecticly attaching die to pedestals 2. Materials/Supplies 2.1 The following are materials and supplies required to perform eutectic soldering.
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AN3017
AuSn eutectic
AN3017
k-242
305O
self-aligned
AuSn solder
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tanaka TS3332LD epoxy
Abstract: tanaka TS3332LD TS3332LD tanaka epoxy remix capacitors Die Attach epoxy stamping tanaka free circuit diagram of rf id Broadband Amplifiers Application Notes, appendix 3 Thermal Epoxy
Text: Epoxy Die Attach Considerations for HPA MMICs 1 Scope MMICs have been traditionally mounted on a RF circuit board, or directly to a plated metal carrier, using a wide range of conductive epoxies, or eutectic solder (e.g. AuGe, AuSn). Eutectic and epoxy has been used in both
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Untitled
Abstract: No abstract text available
Text: SMD Crystal Clock Oscillators Ultra-small SMD Type Crystal Clock Oscillators : KCO-500 Series Features Ultra-small package 5.0 mmx3.2 mm , 1.2 mm thick Power supply voltage 3.3V type High reliability is achieved by metal cap and AuSn vacuum sealing Most suitable for automatic mounting, reflow soldering
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KCO-500
KCO-500
6864MHz
000MHz
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laser diode submount
Abstract: AuSn solder submount CuW laser diode bar ausn submount AuSn
Text: Preliminary Data sheet 60W 806nm High Power Laser Diode Bar on Submount Features BS60C-806-01 • Telecom grade AuSn mounting technology The Bookham Technology BS60C-806-01 laser diode bar on submount series has been designed to provide the high output power and high reliability required for
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806nm
BS60C-806-01
BS60C-806-01
21CFR
laser diode submount
AuSn solder
submount CuW
laser diode bar
ausn submount
AuSn
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AuSn solder
Abstract: No abstract text available
Text: V i s h ay I n t e rt e c h n olog y, I n c . I INNOVAT AND TEC O L OGY AuSn Series N HN LASER DIODE SUBSTRATE MOUNTS O 19 62-2012 Resistors - Deposited Gold Tin Thin Film Patterned Substrates with Deposited Gold/Tin Pads Key Benefits • • • • • •
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VMN-PL0464-1202
AuSn solder
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Untitled
Abstract: No abstract text available
Text: V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Resistors - Vishay Electro-Films LED Submounts INTRODUCTION Vishay Electro-Films, with its complete in-house capability, offers a wide variety of solutions for
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9001/2000-registered
VMN-PL0400-1204
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Untitled
Abstract: No abstract text available
Text: Heat Sin nks, Stand doffs s & Sh hims s • DLI offe ers numero ous dielecttric options s to suit diifferent the ermal and electrical requirem ments! Each de evice is cu ustom tailored to the customer’’s specifica ations. Please use u the ch hecklist on the final page
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AS9100Â
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Untitled
Abstract: No abstract text available
Text: C02E10.pdf 03.9.2 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF
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C02E10
1000T12
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MIL-STD-883 method 2019
Abstract: No abstract text available
Text: C02E9.pdf 02.4.27 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage storageand andoperating, operating,rating, rating,soldering solderingand andmounting, mounting,handling handling)ininthis thisPDF
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C02E9
1000T12
MIL-STD-883 method 2019
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405nm LED
Abstract: C470-XB900-A C470-XB900-B xbt-m silicon carbide LED cree bonding wire cree Au Sn eutectic C405-XB900-A C405-XB900-B CXXX-XB900-X
Text: G•SiC Technology XBright Power Chip LED CXXX-XB900-X ® The Leader in Silicon Carbide Solid State Technology Features Applications • XBright™ Technology • General Lighting • Larger “Power Chip” Design • White LEDs • High Performance
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CXXX-XB900-X
405nm)
470nm)
OS1600
405nm LED
C470-XB900-A
C470-XB900-B
xbt-m
silicon carbide LED cree
bonding wire cree
Au Sn eutectic
C405-XB900-A
C405-XB900-B
CXXX-XB900-X
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AuSn solder
Abstract: No abstract text available
Text: TGA2501-TS 6 - 18 GHz 2.8 Watt Power Amplifier Key Features and Performance • • • • • • • Preliminary Measured Performance Bias Conditions: VD = 8 V ID = 1.2 A 34.5 dBm Midband Pout 24 dB Nominal Gain 10 dB Typical Input Return Loss 5 dB Typical Output Return Loss
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TGA2501-TS
18Ghz,
0007-inch
AuSn solder
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70T50
Abstract: No abstract text available
Text: M04E.pdf 05.9.6 !Note Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this PDF catalog to prevent smoking and/or burning, etc. This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
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flux-eutectic
Abstract: UP78 silicon carbide LED Alpha Metals
Text: XBright & XThin® Au/Sn Die Attachment Recommendations XBright and XThin LEDs are the latest generation of solid-state light emitting diodes available from Cree. XBright and XThin chips use a geometrically shaped Epi-down chip design combined with InGaN epitaxy and Cree’s proprietary
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CPR3AN01
flux-eutectic
UP78
silicon carbide LED
Alpha Metals
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PD10g
Abstract: No abstract text available
Text: PIN Photodiode 10Gbit/s Product Number: PD10GPM03201707 Features High Responsitivity High Sensitivity Flip-Chip Mountable Bondable Surface Sensitive General Description The PDPIN10G is a PIN diode on InP to be exposed from the surface AR-coating . It is suitable for 10Gbit/s
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10Gbit/s
PD10GPM03201707
PDPIN10G
10Gbit/s
1260nm
1565nm,
PD10GPM03201707
SM/7100-03
PD10g
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Untitled
Abstract: No abstract text available
Text: PIN Photodiode 4Gbit/s Product Number: PD4G0PM06001707 Features High Responsitivity High Sensitivity Flip-Chip Mountable Bondable Surface Sensitive General Description This product is a PIN diode on InP to be exposed from the surface AR-coating . It is suitable for up to 4Gbit/s
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PD4G0PM06001707
10Gbit/s
1260nm
1565nm,
PD4G0PM06001707
SM/7100-07
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Untitled
Abstract: No abstract text available
Text: Thin Film North America Review of Select Products - 2009 THIN FILM NA RESISTORS PRECISION DIVIDERS AND NETWORKS MATCHED PAIRS MP, MPM, MPD SC70, SOT23, SOT143 SERIES MATCHED NETWORKS ORN, NOMC, OSOP (SOIC 8, 14, 16, 20) SERIES CSO CUSTOMS MARKET TRENDS ¾ TRANSITIONING AWAY FROM CUSTOMS TO STANDARD OFF-THE-SHELF VALUES
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OT143)
OT-23,
OT-143
com/doc/61081
VMN-PT9187-0605
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Untitled
Abstract: No abstract text available
Text: TGA2502 13 - 15 GHz 4W Power Amplifier Key Features • • • • • • 0.5 um pHEMT Technology >25 dB Nominal Gain >36 dBm Nominal Psat 44 dBm Nominal IP3 @ 14 GHz Bias 7V @ 1.3A Idq, 2.1A under RF drive Chip Dimensions 2.5mm x 2.7mm x 0.1 mm Chip Dimensions 2.5 mm x 2.7 mm x 0.1 mm
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TGA2502
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C395-XB290-E400-B
Abstract: UV led 220 nm peak silicon carbide LED cree uv LED hysol OS4000 epoxy C395-XB290-E400-A C405-XB290-E400-A C405-XB290-E400-B C460-XB290-E1000-A C460-XB290-E1000-B
Text: G•SiC Technology XBright LEDs CXXX-XB290-EXXXX-X ® The Leader in Silicon Carbide Solid State Technology Features Applications • XBright™ • Outdoor LED Video Displays • High Performance – 16.0 mW 395nm Ultraviolet – 17.0 mW (405nm) Ultraviolet
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CXXX-XB290-EXXXX-X
395nm)
405nm)
460nm)
470nm)
505nm)
527nm)
C395-XB290-E400-B
UV led 220 nm peak
silicon carbide LED
cree uv LED
hysol OS4000 epoxy
C395-XB290-E400-A
C405-XB290-E400-A
C405-XB290-E400-B
C460-XB290-E1000-A
C460-XB290-E1000-B
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RUCYT101K00009GNTC
Abstract: tray 10x10mm RUCYT201K00014GNTC
Text: Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.
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K99E-13
RUCYT101K00009GNTC
tray 10x10mm
RUCYT201K00014GNTC
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TGA2502
Abstract: 9948465 21A 8 BALL
Text: TGA2502 13 - 15 GHz 4W Power Amplifier Key Features • • • • • • 0.5 um pHEMT Technology >25 dB Nominal Gain >36 dBm Nominal Psat 44 dBm Nominal IP3 @ 14 GHz Bias 7V @ 1.3A Idq, 2.1A under RF drive Chip Dimensions 2.5mm x 2.7mm x 0.1 mm Chip Dimensions 2.5 mm x 2.7 mm x 0.1 mm
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TGA2502
TGA2502
9948465
21A 8 BALL
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AuSn solder
Abstract: fsx51x die-attach FSX51 AuSn
Text: GaAs FET FHX35X/002 FSX51X/011 BONDING PROCEDURE FOR FET CHIPs Caution must be excercised to prevent static build up by proper grounding of all equipment and per sonnel. All operations must be performed in a clean, dust-free and dry environment. 1. Storage Condition: Store in a clean, dry nitrogen environment.
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FHX35X/002
FSX51X/011
FHX35X/002,
FSX51X/011.
AuSn solder
fsx51x
die-attach
FSX51
AuSn
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