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    AUS703 THERMAL Search Results

    AUS703 THERMAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    AUS703 THERMAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    U8439-1

    Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)


    Original     		PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772

    PSR4000 AUS308

    Abstract: prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 GHPL-830 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG
    Text: Ball Grid Array Ball Grid Array • INTRODUCTION Ball Grid Array BGA is the one of package type which using the SMT. BGA package has several advantages for it's electrical, mechanical and thermal characteristics and these characteristics can come from it's outstanding structure. By using the PCB board and solder ball array


    Original     		PDF HL832 HL832-HS HL832-NB MCL-E-679W MCL-E-679BR MCL-E-679FG GHPL-830 GEA-679N MR600 GHPL-830 PSR4000 AUS308 prepreg GHPL-830 taiyo AUS703 taiyo PSR4000 aus303 THP 100 PSR4000 AUS703 Hitachi MCL-E-679FG MGC HL832 MCL-E-679FG