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    QFP PACKAGE thermal resistance

    Abstract: 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL
    Text: Packaging of Atmel Data Conversion Circuits Introduction This document aims at highlighting the main issues in thermal management for fast and dense devices such as the Atmel Data Conversion products ADCs and DMUX . It especially deals with packaging, electrical and thermal considerations in order to put


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    TS83xxxxx/ AT84xxx TS81102G0 QFP PACKAGE thermal resistance 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL PDF