ASTM-D-257
Abstract: E59150 ASTM-D-149 ASTM-D257 ASTMD149 SIL-PAD ASTM-D5470 D1458 ASTMD5470 D374
Text: Bergquist Sil-Pad KA-l0 is the highest perfom1ance insulator that utilizes Bergquist's dielectric material T-FilmTM. KA-l0 combines T-Film with a very compliant, high thermal performance silicone rubber. The result ~ a product with good cut-through properties and
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QTM-500
Abstract: 5519S 5519
Text: Technical Data February 2012 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These products consist
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5519S
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QTM-500
5519
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Untitled
Abstract: No abstract text available
Text: Technical Data Sheet TG100 September-2009 PRODUCT DESCRIPTION TG100™ provides the following product characteristics: Technology Appearance Application Typical Assembly Applications Operating Temperature Silicone grease Grey Thermal management CPUs, GPUs, MCUs, ASICs, DC-DC
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TG100â
September-2009
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TRANSISTOR REPLACEMENT GUIDE d882
Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,
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Abstract: No abstract text available
Text: Technical Data December 2013 3M Thermally Conductive Silicone Interface Pads 5519 and 5519S Product Description 3M™ Thermally Conductive Silicone Interface Pads 5519 and 5519S are designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. These
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5519S
5519S
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