ASTM d1238
Abstract: astm D150 ASTM d792 ASTM D495 D1238 transistor D648 D1525 ASTM d1238 TEST METHOD ASTM D570
Text: PRODUCT INFORMATION Mineral Reinforced Grade KOCETAL TC704 Kocetal TC704 is Mineral reinforced grade for good dimensional stability. Property Test Method Units Value ASTM D1238 ASTM D792 ASTM D570 g/10min % 17~21 1.55 0.2 ASTM D1525 ASTM D648 ℃ 166 4.6kg/cm2 0.45MPa
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TC704
TC704
D1238
g/10min
D1525
45MPa
81MPa
D63olume
ASTM d1238
astm D150
ASTM d792
ASTM
D495
D1238
transistor D648
D1525
ASTM d1238 TEST METHOD
ASTM D570
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Untitled
Abstract: No abstract text available
Text: Liqui-Bond SA 2000 Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits TEST METHOD Visual 200,000 200,000 ASTM D2196 2.4 2.4 ASTM D792 6 6 — ASTM D2240 Shelf Life @ 10°C months PROPERTY AS CURED - PHYSICAL Hardness (Shore A)
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D2196
D2240
D100ersâ
LBSA2000
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Untitled
Abstract: No abstract text available
Text: Liqui-Bond SA 1800 One-Part Thermally Conductive, One-Part, Liquid Silicone Adhesive Features and Benefits 125,000 125,000 ASTM D2196 2.8 2.8 ASTM D792 6 6 — PROPERTY AS CURED - PHYSICAL Hardness (Shore A) 80 80 ASTM D2240 -76 to 392 -60 to 200 —
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D2196
D1002
LBSA1800
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electronegativity
Abstract: No abstract text available
Text: TECHNICAL INFORMATION: TEFLON FLUOROCARBON RESIN Table 1 Typical Properties* of Teflon® Fluorocarbon Resins ASTM Standard Mechanical Properties: Specific Gravity Tensile Strength Elongation Flexural Modulus Folding Endurance Impact Strength Hardness Coefficient of Friction
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D2176
D2240
D1894
electronegativity
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AN2100
Abstract: D256
Text: Engineering Properties Ryton R-4 Covers Polyphenylene Sulfide Resins Ryton® R-4 PPS is a 40% fiberglass reinforced polyphenylene sulfide compound that provides outstanding chemical resistance and mechanical properties even at elevated temperatures. Nominal Engineering Properties
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180/A
180/U
AN2100
AN2100
D256
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Untitled
Abstract: No abstract text available
Text: GT20 High Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs
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20psi
400psi)
D5470
D2240
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Untitled
Abstract: No abstract text available
Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE
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Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible
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HT-04503
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Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible
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MP-06503
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Untitled
Abstract: No abstract text available
Text: GT30 High Thermal Conductivity Glassfiber Reinforcement Features Natural tack Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Simplified processing and reduced operating costs
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20psi
400psi)
D5470
D2240
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Untitled
Abstract: No abstract text available
Text: GT15 Thermal Conductivity Glassfiber Reinforcement Features Smooth surface & low thermal contact resistance Exceptional thermal performance at lower application pressures 20psi~400psi Usable over a wide temperture range Electrically isolating Complies with UL standards
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20psi
400psi)
D5470
D2240
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bergquist
Abstract: bergquist silpad
Text: Sil-Pad Tubes Silicone-Based,Thermally Conductive Tubes Features and Benefits TYPICAL PROPERTIES OF SIL-PAD TUBE 400 PROPERTY Color • Thermal conductivity: SPT 400 – 0.9 W/m-K SPT 1000 – 1.2 W/m-K • For clip-mounted plastic power packages IMPERIAL VALUE
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D2240
D1458
bergquist
bergquist silpad
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comparative tracking index ceramic
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible
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HT-07006
comparative tracking index ceramic
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UL796
Abstract: No abstract text available
Text: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications
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HPL-03015
UL796
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ASTM D2240, D412
Abstract: ASTM D2240 ASTM D412 MIL-A-46146 loctite 5145 D412 ASTM D412 for rubber D2240 MIL-46106 E1225
Text: Technical Data Sheet Product 5145 Worldwide Version, October 1995 PRODUCT DESCRIPTION LOCTITE Product 5145 is a non-corrosive, paste consistency, high strength, RTV silicone. When cured the elastomer resists weathering, moisture and ozone, and retains its flexibility up to 200°C. Meets requirements of
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MIL-A-46146B
ASTM D2240, D412
ASTM D2240
ASTM D412
MIL-A-46146
loctite 5145
D412
ASTM D412 for rubber
D2240
MIL-46106
E1225
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astm D150
Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™
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D5470
IPC-TM-650
astm D150
D412
ASTM D412
ASTM D5470
ASTM D2240, D412
ASTM D2240
T-Flex 200
Outgassing
CVCM
ASTM
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ASTM d882
Abstract: ASTM A 527 m astm D150 J D882 602-50 ASTM d792 d1922 LEXAN 175 polycarbonate film D882 D882 SPECIFICATION
Text: GE Advanced Materials Specialty Film & Sheet LEXAN* FR25A Film Product Datasheet Description LEXAN FR25A flam e-retardant film Is an opaque, th ln -gau ge polycarbonate film with a velvet finish on one side and a polish finish on the other, and a UL94 V-0 listing to meet the stringent requirem ents In a wide range of electrical, electronic and transportation applications. LEXAN FR25A
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FR25A
FR25Aflame-retardantfilm
FR700
ASTM d882
ASTM A 527 m
astm D150
J D882
602-50
ASTM d792
d1922
LEXAN 175 polycarbonate film
D882
D882 SPECIFICATION
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Untitled
Abstract: No abstract text available
Text: GATT Series S i U l FEATURES Chamfered entry prevents pin stubbing High reliability tuning fork contact IR, vapor and wave solder compatible Selective plating options available Mates with PEG, MPEG, DPEG, LPEG, TPEG Series headers INSULATOR BODY Single Row
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UL94V-0)
IS09001
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Untitled
Abstract: No abstract text available
Text: PGM Series F E A T U R E S • ■ . . Excellent for high density applications Low profile minimizes "height off board" IR, vapor phase and wave solder compatible Stabilizing fins hold part level on board Mates with Crane's ATM sockets; JNM jumpers DUAL ROW 4 to 60 positions
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B4T4422
00D04bfi
IS09001
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Untitled
Abstract: No abstract text available
Text: rîïï i T V M ¡ â e h l i n FEATURES For use w ith Small O utline JED EC SO J) packages Socket profile allow s ultra low packaging High tem perature m aterial resists distortion Leads are tin plated after stam ping fo r high reliability Open fram e a llo w s solder join t inspection
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UL94V-0)
E120111
00D04bfi
IS09001
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Untitled
Abstract: No abstract text available
Text: 'I M Ü ilJ i u i U l i s ï Straight FEATURES . • • ■ ■ Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Chamfered entry prevents pin stubbing Mates with Crane's PGM, IPGM, MPGM Series headers
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E120111
00D04bfi
IS09001
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1285b
Abstract: MIL-STD-11898
Text: FEATURES . • • * ■ SiNGLt ROW 1 to 32 positions Excellent for high density applications Minimizes PC Board stacking height IR, vapor phase and wave solder compatible Insulator standoffs reduce rework due to flux residue Mates with Crane's PGM, DPGM, LPGM, MPGM Series headers
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E120111
IS09001
1285b
MIL-STD-11898
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square pin headers
Abstract: 1285b
Text: MPEG Series r PU § » H ri/*’ IL ij Right Angle, Dual Insulator FEATURES • ■ • • . Dual insulator design adds mechanical stability MATE-RITE TIP prevents scraping of mating socket Insulator standoffs reduce rework due to flux residue Rounded tails improve solder action
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IS09001
square pin headers
1285b
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MIL-STD-109
Abstract: MIL-STD-11898 UL746B MIL-STD-45662A D995 MIL-STD-1285B
Text: £ u ¡ÏMGS a ri XU Straight, Dual Insulator' 1 FEATURES SINGLE ROW (3 to 60 positions MPFH • Excellent for low profile board stacking • Smaller centers allow higher density packaging ■ IR, ■ Custom applications available. call us! • Mates with Crane's
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E120111
IS09001
00D04bfi
MIL-STD-109
MIL-STD-11898
UL746B
MIL-STD-45662A
D995
MIL-STD-1285B
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