ASIC ADVANTAGE Search Results

ASIC ADVANTAGE Result Highlights (3)

Part	Manufacturer	Description
DX9773-DLG2A01-A4	Renesas Electronics Corporation	D7Pro Decoder ASIC
DX8773-ELG2A01-A4	Renesas Electronics Corporation	D7Pro Encoder ASIC
DX7753-ULG2B01-A4	Renesas Electronics Corporation	D7Pro Transcoder ASIC

ASIC ADVANTAGE Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
fpga Abstract: ASIC xilinx silicon device XC4000 XC4000E XC4000EX XC5200 Text: XH3 The New Architecture Combines FPGA and ASIC Technologies W ith the new XH3 architecture, Xilinx has combined its FPGA advantages with eight years of HardWire ASIC experience to create the first FPGA-specific ASIC or “FpgASIC.” FpgASICs are true ASIC devices that are	Original	PDF
250 mhz IBM PowerPC Processor Abstract: IBM PCI Express serdes architecture ibm ASIC SRAM SA-12E IBM ASIC Products ibm ip IBM supports ccga 0.25-um standard cell library IBM ASIC Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications SA-12E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-12E ASIC is a standard  0.25-µm process technology cell and gate array ASIC, featuring a	Original	PDF	SA-12E SA14-2173-03 250 mhz IBM PowerPC Processor IBM PCI Express serdes architecture ibm ASIC SRAM IBM ASIC Products ibm ip IBM supports ccga 0.25-um standard cell library IBM ASIC
TEMIC PLD Abstract: airbag temic alarm clock design of digital VHDL vhdl DTMF echo cancellation in mobile phones using matlab airbag control unit using CAN PROTOCOL Daimler-Benz schematic weigh scale low cost mobile phone audio matlab AEG motor Text: ASIC THE COMPLETE ASIC SUPPLIER A company of AEG Daimler-Benz Industrie ASIC TEMIC: The complete ASIC supplier . . . . . . Sub microwatt to multi GHz RF devices Digital 622MHz cross connect matrix to fully integrated mixed analog & digital audio path for mobile phones	Original	PDF	622MHz 50cho TEMIC PLD airbag temic alarm clock design of digital VHDL vhdl DTMF echo cancellation in mobile phones using matlab airbag control unit using CAN PROTOCOL Daimler-Benz schematic weigh scale low cost mobile phone audio matlab AEG motor
Untitled Abstract: No abstract text available Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15µm structured ASIC • Platform for high-performance 1.5V/1.2V ASICs and FPGA-to-ASIC conversions • NRE and production cost savings • Significant time-to-market advantages	Original	PDF	210MHz 500MHz 332kbits 18kbit 330MHz
AMBA AHB bus protocol Abstract: ARM microcontroller project on can for vehicle AT91EB40 AT91EB40A AT91EB42 AT91EB55 AT91EB63 AT91M42800A AT91M55800A AT91X40 Text: ARM CORE ASIC PRODUCT DEVELOPMENT IS POSSIBLE BY THE MASSES, AND ARM CORE-BASED STANDARD PRODUCTS OFFER PROVEN PATHS TO ASIC SOLUTIONS. RE-USABLE/RE-CONFIGURABLE ARM PERIPHERAL IP IS A REALITY. ASIC SYSTEM SOFTWARE TEAMS CAN TAKE ADVANTAGE OF ARM STANDARD	Original	PDF	AT91EB40 AT91EB40A AT91EB42 AT91EB55 AT91EB63 AT91X40, AT91RO40008, AT91M42800A, AT91M55800A, AT91M63200 AMBA AHB bus protocol ARM microcontroller project on can for vehicle AT91EB40 AT91EB40A AT91EB42 AT91EB55 AT91EB63 AT91M42800A AT91M55800A AT91X40
XC3S1000-FT256 Abstract: XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15µm structured ASIC • Platform for high-performance 1.5V/1.2V ASICs and FPGA-to-ASIC conversions • NRE and production cost savings • Significant time-to-market advantages	Original	PDF	210MHz 500MHz 332kbits 18kbit 330MHz XC3S1000-FT256 XC3S1000-FG456 XC2VP30-FF896 XILINX/SPARTAN-3 XC3S200 XC2V3000-BG728 XC2VP4-FG456 XC3S200FT256 XC2V1000-FG456 XC2V3000-FG676 XC2VP20 fg676
PCB design for very fine pitch csp package Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead Text: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers	Original	PDF
verilog code for DFT Abstract: different vendors of cpld and fpga vhdl code for dFT 32 point verilog code for DFT multiplication active noise cancellation for FPGA Development of a methodology to reduce the order SIGNAL PATH designer write operation using ram in fpga Text: Epson FPGA to ASIC Conversion Introduction \| Feature \| Advantages/Benefits \| Design Flow/Interface \| Design Consideration Introduction Epson has a FPGA to ASIC flow tailored to your needs. Epson has ASIC to FPGA conversion methodology with complete support for industries leading FPGA families. Epson	Original	PDF
memory 6116 Abstract: ASIC 101 PCI33 X2P360 X2P560 X2P640 X2P720 X2P846 digital clock using logic gates Text: AMI Semiconductor XPressArray -II 0.15 m Structured ASIC XPressArray-II - Feature Sheet Key Features • Next-generation 0.15µm structured ASIC platform for highperformance 1.5V ASICs and FPGA-to-ASIC conversions • NRE and production cost savings • Significant time-to-market advantages	Original	PDF	210MHz 500MHz 258Kbits 18Kbit 330MHz M-20623-003 memory 6116 ASIC 101 PCI33 X2P360 X2P560 X2P640 X2P720 X2P846 digital clock using logic gates
LCA500K Abstract: LSI LOGIC Oak Frequency Control Transistors alternatives scan TTL johnson ring counter LCA50 logic diagram of johnson and ring counter Text: An ASIC Primer Table of Contents Preface - Preface .0-1 Chapter 1 - What is an ASIC? .1-1 Section 1 - Uses of ASICs .1-1	Original	PDF
SA-27E Abstract: IBM PCI Express serdes architecture Text: Standard cell/gate array ASIC for mainstream and cost-sensitive applications requiring fast time-to-market SA-27E ASIC Highlights Integration and performance deliver exceptional value. The IBM SA-27E ASIC is a dense,        • Gate delay: 33 picoseconds	Original	PDF	SA-27E SA14-2183-03 IBM PCI Express serdes architecture
Untitled Abstract: No abstract text available Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations	Original	PDF	210MHz PCI33, PCI66, X2P680 X2P846
ra1613 Abstract: FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27 Text: XPressArray-II 0.15mm Structured ASIC Data Sheet 1.0 Key Features • Next-generation 0.15mm hybrid structured ASIC • Initializable distributed memory at speeds up to 210MHz • Platform for high-performance 1.5V/1.2V ASICs and FPGAto-ASIC conversions • Configurable signal, core and I/O power supply pin locations	Original	PDF	210MHz PCI33, PCI66, ra1613 FB360 HSTL18 XC2V3000-BG728 XC3S1000-FT256 XC3S200-ft256 X2P376 X2P528 X2P680 BGA 728 35x35 1.27
8051 program code for the weighing scales Abstract: 8051 assembly program weighing scales assembly CODE program for weighing scales thermal printer 8051 microcontroller p120 2d motor dc motor interface with 8051 using uln2003 thermistor M53 weighing machine using 8051 WEIGHING SCALE 8051 ULN2003 PIN DIAGRAM configuration Text: SOC-4000/i Scale-On-Chip ASIC Technical Specification August 2002 Document order number: SOC-4000-0001-SP SOC-4000/i Scale-On-Chip ASIC Technical Specification August 2002 Document order number: SOC-4000-0001-SP CybraTech 2000 Ltd. SOC-4000/i Scale-On-Chip ASIC	Original	PDF	SOC-4000/i SOC-4000-0001-SP SOC-4000/i D-64297 8051 program code for the weighing scales 8051 assembly program weighing scales assembly CODE program for weighing scales thermal printer 8051 microcontroller p120 2d motor dc motor interface with 8051 using uln2003 thermistor M53 weighing machine using 8051 WEIGHING SCALE 8051 ULN2003 PIN DIAGRAM configuration

actel PLL schematic Abstract: 624 CCGA hardness tester radhard overview HX2000 RH1020 RH1280 XC8100 624-CCGA 256-CQFP Text: Semicustom Products FPGA to ASIC Conversions Fact Sheet July 2010 OVERVIEW Aeroflex Colorado Springs has over 20 years experience in converting FPGA and 3rd-party ASIC netlists into Aeroflex RadHard and non-RadHard ASICs. We maintain a growing database of FPGA and 3rd-party ASIC cell libraries used for conversion, and	Original	PDF	RH1020, RH1280, RT54SX32S/72S, RTAX250S/1000S/2000S XC2/3/4000, XC8100, EMP5/7000 HR2/3000, HX2000 actel PLL schematic 624 CCGA hardness tester radhard overview HX2000 RH1020 RH1280 XC8100 624-CCGA 256-CQFP
TOSHIBA TC160G Abstract: Toshiba NAND 67 Bga 568ps tc160g TC190G04 tc170g TC190G TC190G02 TC190G10 C2878 Text: TOSHIBA System ASIC TC190 Series CMOS ASICs 0.6µ 3.0/3.3V ASIC Family The 0.6µm, 5V TC190 ASIC series provides higher system performance and device integration with lower power than previous generation 5V families. Highly accurate delay models, area efficient memory cells and a very fine pitch TAB bonding capability	Original	PDF	TC190 TC190G) TC190E) TC190C) TC190E TOSHIBA TC160G Toshiba NAND 67 Bga 568ps tc160g TC190G04 tc170g TC190G TC190G02 TC190G10 C2878
Fabrication process steps Abstract: advanced technology in embedded projects OC-768 edram dram structure edram nec 130 nm CMOS standard cell library Text: NEW ASIC PROCESS TECHNOLOGY MAKES EMBEDDED DRAM PRACTICAL CHOICE FOR HIGH-PERFORMANCE APPLICATIONS February 2003 The advantages of embedding large blocks of memory into a system-on-a-chip SoC ASIC have become increasingly clear in the face of growing performance demands for many	Original	PDF
AT17 Abstract: ATMEL 812 250 Text: March 1995 Field Sales Guide RF ID ASIC Fact Sheet educating the Atmel sales force since 1992 Key RF ID ASIC Advantages • • • • • High Performance CMOS E2PROM Available Low Voltage 1.8 volt Mixed Voltage (1.8/3.0/5.0 volts) Flexible Design Interfaces	Original	PDF
toshiba TC200 Abstract: toshiba TC200C TOSHIBA GATE ARRAY Toshiba BGA 224 TC200E TC200 TC200C02 TC200G Edison time delay TC180 Text: TOSHIBA System ASIC TC200 Series CMOS ASICs 0.4µ 3.0/3.3V ASIC Family The TC200 series is a family of 0.4µm, 3.0/3.3V ASICs. They are the first of a new generation of deep sub-micron “System ASIC” products with highly accurate delay models, area efficient memory cells and a very fine pitch TAB bonding capability for high	Original	PDF	TC200 TC200G) TC200E) TC200C) TC200E toshiba TC200 toshiba TC200C TOSHIBA GATE ARRAY Toshiba BGA 224 TC200C02 TC200G Edison time delay TC180
inverter PURE SINE WAVE schematic diagram Abstract: PURE SINE WAVE inverter schematic diagram Q2368 data circuit schematics satellite connector 1 phase pure sine wave inverter schematic ups PURE SINE WAVE schematic diagram q2220I-50n Q2334C-50N qualcomm msm 3000 microcontroller 1 phase pure sine wave inverter Text: QUALCOMM ASIC PRODUCTS APPLICATIONS QUALCOMM ASIC Products provide complex solutions for a variety of wireless communications applications. • Cellular • Digital Radio • Personal Communications Services PCS • Mobile Radio • Wireless Local Loop (WLL)	Original	PDF
Q1900C1S3 Abstract: 16 PSK modulation Q1900C-1N Q1900C-1S3 16psk block diagram 8psk Demodulator Q1900 Viterbi oqpsk vsat Qualcomm DDS iess-309 standard Text: QUALCOMM ASIC PRODUCTS APPLICATIONS QUALCOMM ASIC Products provide complex solutions for a variety of wireless communications applications. • Cellular • Digital Radio • Personal Communications Services PCS • Mobile Radio • Wireless Local Loop (WLL)	Original	PDF
Untitled Abstract: No abstract text available Text: Freescale Semiconductor White Paper ASICRCFWP Rev. 1, 11/2004 ASIC Versus Reconfigurable Compute Fabric RCF Solutions By Roman Robles Design managers often accept application-specific integrated circuit (ASIC)-based solutions as their least expensive option in	Original	PDF
QUALCOMM Reference manual Abstract: qualcomm device specification manual report on jammer 1DN14 long range MOBILE jammer circuit diagram Qualcomm MSM2300 block diagram of qualcomm qualcomm q5505 MSM2300 Text: QUALCOMM ASIC PRODUCTS APPLICATIONS QUALCOMM ASIC Products provide complex solutions for a variety of wireless communications applications. • Cellular • Digital Radio • Personal Communications Services PCS • Mobile Radio • Wireless Local Loop (WLL)	Original	PDF
DDR PHY ASIC Abstract: CX3000 CX5000 CX6100 PLL in RTL ARM926EJ BA12 BA22 cx-5900 ASIC USB 2.0 Text: ChipX Offers Analog and Mixed-Signal ASIC Excellence ChipX, Inc. is a leading Analog and M ixed-Signal ASIC com pany with unique technology that allows you to reduce the cost, developm ent cycle and risk associated with com plex SoC/ASIC designs. ChipX brings more than 22 years of experience to the A SIC m arket	OCR Scan	PDF	550MHz CX4000 CX3000 CX6800 CX6900 CX5900 CX49Q0 CX6100 CX6200 1-800-95-CHIPX DDR PHY ASIC CX5000 PLL in RTL ARM926EJ BA12 BA22 cx-5900 ASIC USB 2.0

ASIC ADVANTAGE Search Results

ASIC ADVANTAGE Result Highlights (3)

ASIC ADVANTAGE Datasheets Context Search

fpga

250 mhz IBM PowerPC Processor

TEMIC PLD

Untitled

AMBA AHB bus protocol

XC3S1000-FT256

PCB design for very fine pitch csp package

verilog code for DFT

memory 6116

LCA500K

SA-27E

Untitled

ra1613

8051 program code for the weighing scales

actel PLL schematic

TOSHIBA TC160G

Fabrication process steps

AT17

toshiba TC200

inverter PURE SINE WAVE schematic diagram

Q1900C1S3

Untitled

QUALCOMM Reference manual

DDR PHY ASIC