Untitled
Abstract: No abstract text available
Text: CASE OUTLINES AND PACKAGE DIMENSIONS SOIC–14 CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006
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485AG
Abstract: No abstract text available
Text: CHAPTER 2 Case Outlines and Package Dimensions http://onsemi.com 421 CASE OUTLINES AND PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE M 1 DATE 07 JUN 2004 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.
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318G-02
004ON.
485AG
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948D
Abstract: No abstract text available
Text: A 20X 0.200 0.004 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
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Untitled
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 8 LEAD PDIP CASE 626A–01 ISSUE O DATE 07/15/2002 SCALE 1:1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. PACKAGE CONTOUR OPTIONAL ROUND OR SQUARE CORNERS .
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Untitled
Abstract: No abstract text available
Text: CHAPTER 2 Case Outlines and Package Dimensions http://onsemi.com 83 CASE OUTLINES AND PACKAGE DIMENSIONS 16 PIN QFN CASE 485G-01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION D APPLIES TO PLATED TERMINAL
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485G-01
5M-1994.
89A-01
89A-02.
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Yb113
Abstract: No abstract text available
Text: Case Dimensions D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J -A- 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006
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751B-05
Yb113
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Untitled
Abstract: No abstract text available
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 277 CASE OUTLINES AND PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE N DATE 04 MAY 2004 1 SCALE 1:1 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
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PDIP-14
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Untitled
Abstract: No abstract text available
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 388 CASE OUTLINES AND PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE N DATE 04 MAY 2004 1 SCALE 1:1 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
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PDIP-14
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Untitled
Abstract: No abstract text available
Text: CHAPTER 3 Case Outlines and Package Dimensions http://onsemi.com 3356 CASE OUTLINES AND PACKAGE DIMENSIONS TO–92 TO–226 CASE 29–11 ISSUE AL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R
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Untitled
Abstract: No abstract text available
Text: 8x 0.15 0.006 T U 0.10 (0.004) S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
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Untitled
Abstract: No abstract text available
Text: 40 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSIONS A AND B INCLUDE MENISCUS. 4. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 21 B 20 1 –A– L N C –T– SEATING PLANE K DATUM PLANE J G
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SOIC-7
Abstract: 751U
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−7 CASE 751U−01 ISSUE E DATE 20 OCT 2009 SCALE 1:1 −A− 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B ARE DATUMS AND T IS A DATUM SURFACE.
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751U-01
SOIC-7
751U
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C8PL
Abstract: 369G-01 1206A-01
Text: A TO−22 TO−226 CASE 29−11 ISSUE AL B R P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM.
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O-226)
206A-01
206A-02
206A-03.
C8PL
369G-01
1206A-01
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Untitled
Abstract: No abstract text available
Text: 14X K REF 0.10 0.004 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT
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948G
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14 DATE 06 OCT 2006 1 SCALE 2:1 14X K REF 0.10 0.004 0.15 (0.006) T U T U M V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER.
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TSSOP-14
948G-01
948G
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553AA
Abstract: 553AA-01
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SPAK, 7 LEAD CASE 553AA-01 ISSUE O DATE 07 MAR 2003 SCALE 1:1 A A1 U K E M V B NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURR.
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553AA-01
553AA
553AA
553AA-01
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LB160
Abstract: No abstract text available
Text: S A 120 81 G 80 121 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DEFINE MAXIMUM CERAMIC BODY DIMENSIONS INCLUDING GLASS PROTRUSION AND MISMATCH OF CERAMIC BODY TOP AND BOTTOM. 4. DIMENSION S AND V TO BE DETERMINED AT
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PL-321
Abstract: PL321 AFAF
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TQFP 32 LEAD 873F–01 ISSUE O 06/01/2001 SCALE 2:1 0.20 0.008 T X-Y Z M M/2 AF AF –Z– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MM. 3. DATUM X", Y" AND Z" TO BE DETERMINED AT
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8XD0
Abstract: No abstract text available
Text: Package Information P SUFFIX PLASTIC PACKAGE CASE 626-05 ISSUE K NOTES: 1. 2. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. PACKAGE CONTOUR OPTIONAL ROUND OR SQUARE CORNERS . DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. MILLIMETERS INCHES
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BR1330
8XD0
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Untitled
Abstract: No abstract text available
Text: 7.11 [.280] 6.10 [.240] h d t d h d td 14X 1.77 [.0701 _ 4 1.15 [.045] NOTES: 1. DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES], 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-001AC.
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5M-1982.
MS-001AC.
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HF 1932
Abstract: No abstract text available
Text: Case Outlines L SUFFIX - s CERAMIC PACKAGE CASE 620-10 ISSUE V i - NOTES. 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982 2. CONTROLLING DIMENSION: INCH. 3. OlMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 0 030
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BR1334
HF 1932
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1J27
Abstract: No abstract text available
Text: Case Outlines 1 4 -P in P ackag es D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F - S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MHUMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.0061
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51A-03
BR1492
1J27
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Untitled
Abstract: No abstract text available
Text: Case Outlines J SUFFIX - E CERAMIC PACKAGE CASE 632-08 ISSUE Y h NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL 4. DIM F MAY NARROW TO 0.76 0.030 WHERE THE LEAD ENTERS THE CERAMIC BODY.
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motorola plastic package outlines
Abstract: No abstract text available
Text: Case Outlines C a se O utlines 4-P in P ackage DT SUFFIX PLASTIC PACKAGE CASE 369A-13 DPAK ISSUE W _ f _ 1 SEATING — — 1 PLANE NOTES: 1. 2 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES ' 1 MIN MAX MIN MAX A 0.235
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69A-13
BR1486
motorola plastic package outlines
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