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    ANSI Y14.5M Search Results

    ANSI Y14.5M Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    RSK-Wireless-LAN-Expansion Renesas Electronics Corporation Wireless LAN expansion board package for RSK (includes Wireless LAN module (eWBC)) Visit Renesas Electronics Corporation
    FLAC1000 Amphenol Communications Solutions FLA Shorting Cap NEMA ANSI C136.41, Shorting Contacts Visit Amphenol Communications Solutions
    FLBC70354001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Black Visit Amphenol Communications Solutions
    FLBC70602001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 60mm Height, Clear Visit Amphenol Communications Solutions
    FLBC70756001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 75mm Height, Translucent Visit Amphenol Communications Solutions

    ANSI Y14.5M Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ansi y14.5m-1982

    Abstract: Series PVT322
    Text: Series PVT322 Mechanical Specifications Dimensions in millimeters inches Figure 7. Delay Time Definitions Figure 8. Typical Output Capacitance 1. Dimensioning and tolerancing per ANSI Y14.5M-1982 2. Controlling dimension: INCH ➃ Dimension does not include mold protrusions.


    Original     		PDF PVT322 5M-1982 0111usions ansi y14.5m-1982 Series PVT322

    sot23 footprint

    Abstract: sot-23 footprint
    Text: Transient Voltage Suppressors — Surface Mounted 40 Watt Peak Power NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS


    Original     		PDF OT-23 sot23 footprint sot-23 footprint

    6-32UNC-2A

    Abstract: No abstract text available
    Text: NOTES: 1 DRAWINGS IN ACCORDANCE WITH STANDARD ANSI Y14.5M-1994. 2) UNTOLERANCED DIMENSIONS LOCATING TRUE POSITION ARE BASIC. 3) THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND IS COPYRIGHTED. EXCEPT WITH THE WRITTEN PERMISSION OF SPECTRUM CONTROL, INC. OR ITS


    Original     		PDF 5M-1994. 46317-ENG 31006-CPD 28006-CPD 26786-CPD 20833-CPD MIL-STD-105, 52F160-003-A 6-32UNC-2A

    821E

    Abstract: No abstract text available
    Text: Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 0.076 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.


    Original     		PDF

    357-D

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS POWERTAP & #153 III CASE 357D–01 ISSUE A DATE 01/02/2000 SCALE 1:1 A Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 0.235 MAXIMUM.


    Original     		PDF 20UNC 357-D

    MARKING O1B

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS CASE 483–01 ISSUE B DATE 04/20/2001 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 853–1242B 06575 1. Package dimensions conform to MIL-M-38510, Outline No. C-12, 32 leads. Rectangular Ceramic Leadless Chip Carrier. 2. Controlling dimension: Inches. Millimeters are shown in parentheses. 3. Dimension and tolerancing per ANSI Y14.5M – 1982.


    Original     		PDF 1242B 1242B 32-PIN MIL-M-38510, 254mm) 020mm)

    Untitled

    Abstract: No abstract text available
    Text: CASE OUTLINES AND PACKAGE DIMENSIONS SOIC–14 CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006


    Original     		PDF

    MS-034

    Abstract: JEDEC FBGA 11 JEDEC MS-034-AAJ-1
    Text: Altera Device Package Information 400-Pin Wirebond FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information


    Original     		PDF 400-Pin MS-034 MS-034 JEDEC FBGA 11 JEDEC MS-034-AAJ-1

    09Ah

    Abstract: 14-PIN
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT-23 TO-236 CASE 318-09 ISSUE AH SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS


    Original     		PDF OT-23 O-236) 09Ah 14-PIN

    Untitled

    Abstract: No abstract text available
    Text: NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006 PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR


    Original     		PDF

    221D-03

    Abstract: 221D
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 FULLPAK CASE 221D−03 ISSUE K −T− −B− F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03. SEATING


    Original     		PDF O-220 221D-03 221D-01 221D-02 221D-03. 11uch 221D-03 221D

    751E-04

    Abstract: No abstract text available
    Text: -A- 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 0.006 PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR


    Original     		PDF 751E-04 751E-04

    821D-03

    Abstract: No abstract text available
    Text: Q –L– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 5 LEAD TO–220 TFVA5 CASE 314N–01 ISSUE O SCALE 1:1 –T– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD–323 CASE 477–02 ISSUE C DATE 04/30/2002 SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING.


    Original     		PDF

    499AC

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 9 BUMP, 1.55X1.55X0.5 PITCH CASE 499AC−01 ISSUE B 1 SCALE 4:1 DATE 20 JUL 2004 −A− 4X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL


    Original     		PDF 499AC-01 499AC 499AC

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−553, 5 LEAD CASE 463B−01 ISSUE B SCALE 4:1 DATE 27 MAY 2005 D −X− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES


    Original     		PDF OT-553, 463B-01

    DIMENSIONS soic 16

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.


    Original     		PDF SOIC-16 751B-05 DIMENSIONS soic 16

    Untitled

    Abstract: No abstract text available
    Text: 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 0.006


    Original     		PDF

    JEDEC FBGA 12 19

    Abstract: MS-034 JEDEC OUTLINE
    Text: Altera Device Package Information 324-Pin Non-Thermally Enhanced FineLine Ball-Grid Array FBGA • ■ ■ All dimensions and tolerances conform to ANSI Y14.5M – 1994. Controlling dimension is in millimeters. M is the maximum solder ball matrix size. Package Information


    Original     		PDF 324-Pin MS-034 JEDEC FBGA 12 19 MS-034 JEDEC OUTLINE

    Untitled

    Abstract: No abstract text available
    Text: NOTES: DIMENSIONING & TOLERANCING PER ANSI Y14.5M -1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES], 18.10 [.7125] B 17.70 [.6969] OUTLINE CONFORMS TO JEDEC OUTLINE M S-013AE. E DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING


    OCR Scan     		PDF 5M-1982. MS-013AE.

    LB 11911

    Abstract: ELF120GGC-4Z50 MIL-0-45204 ECN3313 burndy CARD EDGE SE9562
    Text: NOTES: UNLESS OTHERWISE SPECIFIED, 1 INTERPRET THIS DRAWNG IN ACCORDANCE WITH ANSI Y14.5M-19B2. CATALOG NUMBER DE5CRFTI0N L1 Z COMPONENT BOARD MATERAL: P.C. BOARD: FR-4 WITH 1 OZ. [26,35fl] MIN COPPER PADS. PAD PLATING. 30 MICRONCHES [0,75 MICRONS] MN. 0CLD,


    OCR Scan     		PDF 5M-19B2. MIL-0-45204. 00-N-290. 155iOD1 030tQD2 SKME29219-D ELF120GGC-3Z50 SE95622 LB 11911 ELF120GGC-4Z50 MIL-0-45204 ECN3313 burndy CARD EDGE SE9562

    8XD0

    Abstract: No abstract text available
    Text: Package Information P SUFFIX PLASTIC PACKAGE CASE 626-05 ISSUE K NOTES: 1. 2. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. PACKAGE CONTOUR OPTIONAL ROUND OR SQUARE CORNERS . DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. MILLIMETERS INCHES


    OCR Scan     		PDF BR1330 8XD0