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    Abstract: No abstract text available
    Text: ANLPS205 MIC45212-1/MIC45212-2 64-Lead H4QFN 12mm x 12mm Package Soldering Guidelines Introduction This document provides a simplified guideline focused on the solderability process for the MIC45212 power module. It is intended to assist with the PCB layout design and should be used in conjunction with the MIC45212


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    PDF ANLPS205 MIC45212-1/MIC45212-2 64-Lead MIC45212 MIC45212