tm2313
Abstract: No abstract text available
Text: Technical Data November 2013 3M Anisotropic Conductive Film 7376-10 for Camera Module Devices Product Description 3M™ Anisotropic Conductive Film (ACF) 7376-10 is a heat-bondable, electrically conductive adhesive film. The unbonded film is slightly tacky at room
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Text: Technical Data November 2013 3M Anisotropic Conductive Film 7371-20 for Touch Screen Panel Product Description 3M™ Anisotropic Conductive Film (ACF) 7371-20 is a heat-bondable, electrically conductive adhesive film. It is slightly tacky at room temperature and consists of
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Text: Technical Data November 2013 3M Anisotropic Conductive Film 7376-30 for Camera Module Devices Product Description 3M™ Anisotropic Conductive Film (ACF) 7376-30 is a heat-bondable, electrically conductive adhesive film. The unbonded film is slightly tacky at room temperature
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Text: Technical Data November 2013 3M Anisotropic Conductive Film 7371 Product Description Typical Physical Properties and Performance Characteristics 3M™ Anisotropic Conductive Film ACF 7371 is a heatbondable, electrically conductive adhesive film. The unbonded film is slightly tacky at room temperature and
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Text: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9706 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9706 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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Text: Technical Data June 2011 3M Electrically Conductive Adhesive Transfer Tape 9705 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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Text: Technical Data May 2011 3M Electrically Conductive Adhesive Transfer Tape 9704 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape ECATT 9704 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection
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ACF msds
Abstract: NASA SP-R-0022 CONDUCTIVE INK FLEX CIRCUITS D33-30 dupont kapton rohs CONDUCTIVE INK FOR FLEX CIRCUITS glass filled polyester physical properties ASTM-D3330 ideas
Text: Technical Data April 2011 3M Electrically Conductive Adhesive Transfer Tape 9703 Product Description 3M™ Electrically Conductive Adhesive Transfer Tape 9703 is a pressure sensitive adhesive PSA transfer tape with anisotropic electrical conductivity. The PSA matrix is filled with conductive particles which allow interconnection between
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ACF msds
NASA SP-R-0022
CONDUCTIVE INK FLEX CIRCUITS
D33-30
dupont kapton rohs
CONDUCTIVE INK FOR FLEX CIRCUITS
glass filled polyester physical properties
ASTM-D3330
ideas
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K612
Abstract: underfill FR4 epoxy dielectric constant 3.2 Dielectric Constant Silicon Nitride K810 FR4 substrate height and thickness ltcc chip fine line bga thermal cycling reliability
Text: Bourns Microelectronic Modules Packaging Solutions Device Mounting Technology Surface Mount Technology Surface mounting is still the most common and economical approach for many applications. Bourns® Microelectronic Module products offer the latest in surface mount technology:
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K612
underfill
FR4 epoxy dielectric constant 3.2
Dielectric Constant Silicon Nitride
K810
FR4 substrate height and thickness
ltcc chip
fine line bga thermal cycling reliability
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COG lcd
Abstract: Chip-on-Glass LCD Driver Technology
Text: Chip-on-Glass LCD Driver Technology Well-proven Approach from NXP Reduces Medical System Design Costs Executive Summary 1 Use of LCD Displays in Medical Imaging 1 The Chip-on-Glass Value Proposition 2 Understanding the Conventional Surface Mount Method 2 The Alternative Chip-on-Glass Concept 3
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UM10204
AN10853
COG lcd
Chip-on-Glass LCD Driver Technology
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optically clear adhesive
Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.
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7193HB
optically clear adhesive
ecg master replacement guide
1115b
silver conductive ink resins
QTM-500
MGC 7805
CONDUCTIVE INK FOR FLEX CIRCUITS
3m 7815
8880-S7
UL-746
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Adwill D-175
Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
Text: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct
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AN106920lusion
Adwill D-175
UE-111AJ
lintec adwill UV tape D-175
UV tape D-175
adwill
Lintec UV tape
Lintec
nitto UE111AJ
nitto UV tape
D175 lintec
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COG lcd
Abstract: Chip-on-Glass LCD Driver Technology on/2X16 cog lcd
Text: R_10015 Chip-On-Glass COG - a cost-effective and reliable technology for LCD displays Rev. 2 — 18 June 2012 White paper 1. The Chip-On-Glass value proposition Today, many LCDs are implemented by connecting a cased1 LCD driver IC with the physical display via a Printed-Circuit Board (PCB) (see Figure 1a). This concept - referred
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13,56 MHz RFID antenna
Abstract: ISO 14443-A mass transit FCI Microconnections nickel corrosion electroplating
Text: BANKING, MASS TRANSIT, ACCESS CONTROL DESCRIPTION FCI Microconnections is a reference supplier for designing and manufacturing copper planar RFID antennas. This core technology is based on a chemical copper etching followed by nickel/gold electroplating. Mass production is done in a
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TETRA etch
Abstract: semitool equinox AL 2001 AL-2001 al2001 Electrophoretic Deposition Coating AuSn eutectic ma 150 karl suss PLA-501F Canon PLA-501F
Text: Copyright Institute of Physics and IOP Publishing Ltd 2003. GaAs IC M ANUFACTURING compoundsemiconductor.net Photoresist application for 3D features on wafer surfaces The increasing use of via holes and other 3D features is posing a challenge to conventional resist
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Text: Transient Thermal, Electrical and Lifetime Analysis of Large-Can Aluminum Electrolytic Capacitors Sam G. Parler, Jr., P.E. Director of Research and Development Presented at The Applied Power Electronics Conference APEC 2015 1 Outline: I. Consequences and analysis techniques of transient behavior
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Abstract: EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC
Text: EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automated-bonding TAB technology in order to meet the requirement to put the watch IC into
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EM HEATSINK PROFILE
Swatch Group
wristwatch lcd
flip chip bga 0,8 mm
ceramic pin grid array package wire bond
ACF COG
DSAE005753
acf film
watch IC
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Abstract: No abstract text available
Text: 3MTM RFID CD Tag – Technical Data Sheet 35mm O.D. 17mm I.D. 75-0500-8304-9 Description This tag is provided as circular pressure sensitive label on a silicon paper liner and is applied to hub of a CD or a DVD disk. The tags are wound on a single tag width roll. The integrated circuit
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Text: 3MTM RFID Premium Tag – Technical Data Sheet 57mm x 48mm 2.25” x 1.89” 75-0500-6593-9 Description This tag is provided as a pressure sensitive label on a silicon paper liner. The tags are wound on a single tag width roll. The integrated circuit is a 13.56 MHz 2048 bit memory design that is ISO
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lcd cross reference
Abstract: NJU6406B 1000H 100CC QFP-100
Text: TCP MOUNTED LCD DRIVER 1. General Description 1 Preface TC P ( Tape Carrier Package ) mount a LSI chip on thethin polyimide fiImdirectly. It applies to the small size LCD for communication equipment, pager and other handheld equipment which having a LCD
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1000H
30min
30min
100cycles
100CC
10cycles
lcd cross reference
NJU6406B
1000H
QFP-100
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lcd cross reference
Abstract: No abstract text available
Text: TCP 1. MOUNTED LCD DRIVER General Description 1 Preface TCP( Tape Carrier Package) mount a LSI chip on thethin polyimide fiIndirectly. It applies to the small size LCD for communication equipment, pager and other handheld equipment which having a LCD display for its feature of flexible shape, smallness and
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Abstract: "LCD DRIVER"
Text: TCP 1. MOUNTED LCD DRIVER General Description 1 Preface TCP( Tape Carrier Package) mount a LSI chip on the thin polyiraide fi Im directly. It applies to the small size LCD for communication equipment, pager and other handheld equipment which having a LCD display for its feature of flexible shape, smallness and
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lcd cross reference
Abstract: SN 102 lcd DE 113 LCD 1000H 100CC NJU6406B NJU6408B NJU6460A QFP-100 NJU6432
Text: TCP MOUNTED LCD DRIVER 1. General Description 1 Preface TC P ( Tape Carrier Package ) mount a LSI chip on thethin polyimide fiImdirectly. It applies to the small size LCD for communication equipment, pager and other handheld equipment which having a LCD
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lcd cross reference
Abstract: LCD heat seal connectors MIL-STD-883J CH85 6452A 1000H NJU6406B NJU6460A QFP-100 10-CHARACTER
Text: TCP 1. MOUNTED LCD DRIVER General Description 1 Preface TCP( Tape Carrier Package ) mount a LSI chip on thethin polyinide fiIndirectly. It applies to the small size LCD for communication equipment, pager and other handheld equipment which having a LCD display for its feature of flexible shape, smallness and
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