ANALOG DEVICE KNOWN GOOD DIE Search Results

ANALOG DEVICE KNOWN GOOD DIE Result Highlights (6)

Part	Manufacturer	Description
74HC4053FT	Toshiba Electronic Devices & Storage Corporation	CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
74HC4051FT	Toshiba Electronic Devices & Storage Corporation	CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
TPD4164F	Toshiba Electronic Devices & Storage Corporation	Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31
TPD4207F	Toshiba Electronic Devices & Storage Corporation	Intelligent power device 600V (High voltage PWM DC brushless motor driver)
TPD4204F	Toshiba Electronic Devices & Storage Corporation	Intelligent power device 600V (High voltage PWM DC brushless motor driver)
TPD4164K	Toshiba Electronic Devices & Storage Corporation	Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30

ANALOG DEVICE KNOWN GOOD DIE Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: 0.28 Ω CMOS 1.65 V to 3.6 V Single SPST Switch ADG841-KGD Known Good Die Ultralow on resistance 0.28 Ω typical 0.48 Ω max at 125°C Excellent audio performance, ultralow distortion 0.025 Ω typical 0.052 Ω max RON flatness 1.65 V to 3.6 V single supply	Original	PDF	ADG841-KGD ADG841-KGD-CHIPS D10266-0-11/11
D1026 Abstract: No abstract text available Text: 0.28 Ω CMOS 1.65 V to 3.6 V Single SPST Switch ADG841-KGD Known Good Die Ultralow on resistance 0.28 Ω typical 0.48 Ω max at 125°C Excellent audio performance, ultralow distortion 0.025 Ω typical 0.052 Ω max RON flatness 1.65 V to 3.6 V single supply	Original	PDF	ADG841-KGD ADG841-KGD-CHIPS ADG841-KGD D10266-0-11/11 D1026
Untitled Abstract: No abstract text available Text: 25 MHz Direct Digital Synthesizer, Waveform Generator AD9832-KGD Known Good Die FEATURES GENERAL DESCRIPTION 25 MHz speed On-chip SIN lookup table On-chip, 10-bit DAC Serial loading Power-down option Temperature range: −40°C to +85°C 200 mW power consumption	Original	PDF	AD9832-KGD 10-bit AD9832-KGD 10bit AD9832-KGD-CHIPS 20-Pad D11672-0-7/13 C-20-1
Untitled Abstract: No abstract text available Text: Known Good Die 1.6 V, Micropower 12-Bit ADC AD7466-KGD FEATURES FUNCTIONAL BLOCK DIAGRAM VDD Specified for VDD of 1.6 V to 3.6 V Low power 0.62 mW typical at 100 kSPS with 3 V supplies 0.48 mW typical at 50 kSPS with 3.6 V supplies 0.12 mW typical at 100 kSPS with 1.6 V supplies	Original	PDF	12-Bit AD7466-KGD 12-BIT AD7466-KGD-DF D10315-0-11/11
Untitled Abstract: No abstract text available Text: Known Good Die 1.6 V, Micropower 12-Bit ADC AD7466-KGD FEATURES FUNCTIONAL BLOCK DIAGRAM VDD Specified for VDD of 1.6 V to 3.6 V Low power 0.62 mW typical at 100 kSPS with 3 V supplies 0.48 mW typical at 50 kSPS with 3.6 V supplies 0.12 mW typical at 100 kSPS with 1.6 V supplies	Original	PDF	12-Bit AD7466-KGD 12-BIT AD7466-KGD-DF D10315-0-11/11
Untitled Abstract: No abstract text available Text: SPI-/I2C-Compatible Temperature Sensor with 4-Channel ADC and Quad Voltage Output ADT7517-KGD Known Good Die FEATURES GENERAL DESCRIPTION Four 10-bit DACs Buffered voltage output Guaranteed monotonic by design over all codes 10-bit temperature-to-digital converter	Original	PDF	ADT7517-KGD 10-bit 10-bit, ADT7517-KGD-DF C-19-1 4-18-2012-A D10686-0-8/13
Ablestik 84-1LMIS Abstract: 737B1 AD8065 Text: Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier AD8065-KGD-CHIP Known Good Die FEATURES GENERAL DESCRIPTION FET input amplifier 1 pA input bias current Low cost High speed: 145 MHz, −3 dB bandwidth G = +1 180 V/µs slew rate (G = +2) Low noise	Original	PDF	AD8065-KGD-CHIP AD8065-KGD-CHIP 84-1LMIS 8-31-2012-A D11011-0-10/12 Ablestik 84-1LMIS 737B1 AD8065
Untitled Abstract: No abstract text available Text: 1 nV/√Hz Low Noise 210°C Instrumentation Amplifier AD8229-KGD Known Good Die FUNCTIONAL BLOCK DIAGRAM Designed for 210°C operation Low noise 1 nV/√Hz input noise 45 nV/√Hz output noise High CMRR 126 dB CMRR minimum , G = 100 80 dB CMRR (minimum) to 5 kHz, G = 1	Original	PDF	AD8229-KGD 8-16-2011-A AD8229-KGD-CHIPS D10107-0-8/11
analog devices die list Abstract: 54AC245 74ACT04 LM108 LM137K SCAN18373T SCAN18374T SCANPSC100F SCANPSC110F Text: N VOLUME NO. 2 1999 BARE DIE USE IS GROWING RAPIDLY CONTENTS he rapid demand for smaller and PAGE 1 Bare Die Use is Growing BARE DIE MEET smaller consumer products is Rapidly pushing designers and manufacQUALITY, RELIABILITY, Page 2 Boundary Scan Assists turers to reassess their selection of comAND PERFORMANCE	Original	PDF
Untitled Abstract: No abstract text available Text: Known Good Die Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier AD8028-KGD-CHIPS FEATURES High speed 190 MHz, –3 dB bandwidth G = +1 100 V/µs slew rate Low distortion 120 dBc @ 1 MHz SFDR 80 dBc @ 5 MHz SFDR Selectable input crossover threshold	Original	PDF	AD8028-KGD-CHIPS AD8028-KGDCHIPS 84-1LMIS D10787-0-7/12
nitto UV tape Abstract: 54AC245 74ACT04 LM108 COB CHIP ON BOARD Text: Technology for the Die Community Die Products Line Card 1999/2000 N Products and Technology for the Die Community As system designers search for ways to derive higher performance and reduced power consumption from smaller form factor integrated circuits ICs , they are turning to	Original	PDF
C103 pnp Abstract: transistor 131-G chip die npn transistor Ablestik 84-1LMIS Text: Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier AD8028-KGD-CHIP Known Good Die FEATURES High speed 190 MHz, –3 dB bandwidth G = +1 100 V/µs slew rate Low distortion 120 dBc @ 1 MHz SFDR 80 dBc @ 5 MHz SFDR Selectable input crossover threshold	Original	PDF	AD8028-KGD-CHIP AD8028-KGDCHIP 84-1LMIS AD8028-KGD-CHIP 10-Pad C-10-3 D10787-0-11/12 C103 pnp transistor 131-G chip die npn transistor Ablestik 84-1LMIS
transistor 131-G Abstract: No abstract text available Text: Known Good Die Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier AD8028-KGD-CHIPS FEATURES High speed 190 MHz, –3 dB bandwidth G = +1 100 V/µs slew rate Low distortion 120 dBc @ 1 MHz SFDR 80 dBc @ 5 MHz SFDR Selectable input crossover threshold	Original	PDF	AD8028-KGD-CHIPS AD8028-KGDCHIPS 84-1LMIS AD8028-KGD-CHIPS 10-Pad C-10-3 D10787-0-9/12 transistor 131-G
Ablestik 84-1LMIS Abstract: chip die npn transistor Text: Known Good Die Low Distortion, High Speed Rail-to-Rail Input/Output Amplifier AD8028-KGD-CHIPS FEATURES High speed 190 MHz, –3 dB bandwidth G = +1 100 V/µs slew rate Low distortion 120 dBc @ 1 MHz SFDR 80 dBc @ 5 MHz SFDR Selectable input crossover threshold	Original	PDF	AD8028-KGD-CHIPS AD8028-KGDCHIPS 84-1LMIS AD8028-KGD-CHIPS D10787-0-7/12 Ablestik 84-1LMIS chip die npn transistor

analog device known good die Abstract: No abstract text available Text: FEATURES Qualified for automotive applications High common-mode voltage range −8 V to +28 V operating at 5 V supply Buffered output voltage Gain = 20 V/V Low-pass filter 1-pole or 2-pole Excellent ac and dc performance ±1 mV voltage offset 1 ppm/°C typical gain drift	Original	PDF	AD8202-KGD AD8202-KGD D10596-0-3/12 analog device known good die
Architecture of TMS320C4X FLOATING POINT PROCESSOR Abstract: Architecture of TMS320C4X FLOATING POINT PROCESS SPRU159A XDS510PP TMS320C4X FLOATING POINT PROCESSOR architecture TMS320C4X FLOATING POINT PROCESSOR Text: TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024C – MARCH 1997 – REVISED OCTOBER 2001 D D D D D D D D D D D D D SMJ: QML Processing to MIL–PRF–38535 TMP: Commercial Level Processing	Original	PDF	TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT SGUS024C C40-50: 40-ns C40-40: 50-ns IEEE-745 Architecture of TMS320C4X FLOATING POINT PROCESSOR Architecture of TMS320C4X FLOATING POINT PROCESS SPRU159A XDS510PP TMS320C4X FLOATING POINT PROCESSOR architecture TMS320C4X FLOATING POINT PROCESSOR
LM358 RF receiver module Abstract: DS26C31T light sensor lm324 and lm339 in circuit functions light sensor in lm324 and lm339 LM324 temperature controller LM386-1 LM723 LMX2336 detonators functions light sensor in lm324 Text: N VOLUME NO. 5 2000 THE PROLIFERATION OF DIE PRODUCTS COMMUNICATION SYSTEMS he trend in the electronics industry is toward smaller and lighter with higher performance. Fueling this trend is continuing silicon integration as well as advanced packaging technologies. The ultimate "packaging" technology in terms of supporting	Original	PDF
CLAY31 Abstract: van allen belt satellite pico electronics transformers airmate CLC452 F100K LM117 LM7171 10195 solar cell national semiconductor 400045 Text: VOLUME NO. 14 1998 Industry Migrates to Bare Die and Known Good Die – Virtual Packaging Known Good Die I t was just a few years ago that electronics designers who wanted the smallest form factor for system upgrades were limited to assorted surface-mount packages. More recently, this has	Original	PDF
Untitled Abstract: No abstract text available Text: FUNCTIONAL BLOCK DIAGRAM FEATURES Fast throughput rate: 1 MSPS Specified for AVDD of 2.7 V to 5.25 V Low power 6 mW maximum at 1 MSPS with 3 V supplies 13.5 mW maximum at 1 MSPS with 5 V supplies 4 single-ended inputs with sequencer Wide input bandwidth: 70 dB SNR at 50 kHz input frequency	Original	PDF	16-lead AD7924-KGD-DF 24-Pad D10106-0-10/11 C-24-1
Untitled Abstract: No abstract text available Text: FEATURES Fast throughput rate: 1 MSPS Specified for AVDD of 2.7 V to 5.25 V Low power 6 mW maximum at 1 MSPS with 3 V supplies 13.5 mW maximum at 1 MSPS with 5 V supplies 4 single-ended inputs with sequencer Wide input bandwidth: 70 dB SNR at 50 kHz input frequency	Original	PDF	16-lead AD7924-KGD-DF 24-Pad D10106-0-10/11 C-24-1
seam seal process Abstract: LMC7255 Minco Products PC16552 LMC668 Text: N ANALYSIS OF VOLUME NO. 6 2000 DIE ASSEMBLY TECHNIQUES CONTENTS PAGE 1 ystem and board manufacturers that use bare die or flip-chip – such as National Semiconductor’s Die Products – have access to a wide variety of assembly methods that will produce high yield, high reliability systems. The following review of	Original	PDF
DSX221S Abstract: SiW3500 bluetooth Coexistence 3-wire OEN 46 1458 CLK32 l8838 bluetooth transmitter receiver parallel chip mobile Text: SiW3500 Preliminary • Bluetooth specification V1.2 qualified including mandatory and optional functions such as AFH and eSCO. PLL Control ADDRESS BUS VDD_P VBB_OUT VCC_OUT VBATT_DIG VBATT_ANA XTAL_N CLK_REQ_IN XTAL_P/CLK CLK_REQ_OUT VTUNE • RF System on Chip SoC for	Original	PDF	SiW3500 18-micron R00Irf DSX221S bluetooth Coexistence 3-wire OEN 46 1458 CLK32 l8838 bluetooth transmitter receiver parallel chip mobile
trace code marking RFMD Abstract: No abstract text available Text: SiW3500 Preliminary ULTIMATEBLUE Bluetooth SoC PLL Control • Uses standard 0.18-micron CMOS manufacturing process technology. Voltage Regulators and Power Distribution Clock Distribution CS, OE and WE Optional flash interface LNA ADC • Supports standard and 3-wire HCI	Original	PDF	SiW3500 18-micron R00JIrf trace code marking RFMD
A1870 Abstract: No abstract text available Text: FEATURES FUNCTIONAL BLOCK DIAGRAM Complete monolithic resolver-to-digital converter 3125 rps maximum tracking rate 10-bit resolution ±2.5 arc minutes of accuracy 10-/12-/14-/16-bit resolution, set by user Parallel and serial 10-bit to 16-bit data ports	Original	PDF	10-bit 10-/12-/14-/16-bit 16-bit AD2S1210-KGD AD2S1210-KGD-CHIPS 50-Pad D12412-0-6/14 C-50-1 A1870

ANALOG DEVICE KNOWN GOOD DIE Search Results

ANALOG DEVICE KNOWN GOOD DIE Result Highlights (6)

ANALOG DEVICE KNOWN GOOD DIE Datasheets Context Search

Untitled

D1026

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Ablestik 84-1LMIS

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analog devices die list

Untitled

nitto UV tape

C103 pnp

transistor 131-G

Ablestik 84-1LMIS

analog device known good die

Architecture of TMS320C4X FLOATING POINT PROCESSOR

LM358 RF receiver module

CLAY31

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seam seal process

DSX221S

trace code marking RFMD

A1870