Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    AN114F Search Results

    AN114F Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LTM46XX

    Abstract: bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance
    Text: Application Note 114 August 2007 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114f AN114-8 LTM46XX bga dye pry LTM4600 LGA voiding AN114 LGA rework LGA PACKAGE thermal resistance

    TAIYO PSR 4000

    Abstract: TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600
    Text: Application Note 114 August 2007 Revised March 2009 Evaluating the Integrity of LGA Package, 2nd Level Interconnect for µModule Family of Products David Pruitt Introduction A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds


    Original     		PDF an114fa AN114-8 TAIYO PSR 4000 TAIYO PSR 4000 datasheet bga dye pry PSR-4000 TAIYO PSR 2000 taiyo PSR-4000 aus LGA voiding LTM46XX land pattern BGA 0,50 LTM4600