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    0.3mm pitch csp package

    Abstract: 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112
    Text: ご注意 ：日本語のア プ リ ケーシ ョ ン ・ ノ ー ト は参考資料 と し て提供 し てお り 内容が 最新で ない場合があ り ます。 製品のご使用に際 し ては、 必ず最新の英文ア プ リ ケーシ ョ ン ・ ノ ー ト を ご確認 く だ さ い。


    Original     		PDF AN-1112 0.3mm pitch csp package 0.3mm pitch package bga 0.3mm pitch BGA jp smd code AN100926-26-JP AN-1112 micro pitch BGA ALIVH ic micro AN1112

    lm78l05

    Abstract: zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611
    Text: LM78L05IBP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM78L05IBP AN-1112 LM78L05 zener SMD MARK A9 smd transistor marking A10 marking code hr 31 SMD zener diode 1.6v sot-23 Marking 40g BGA-3000 lm78l05 smd MARKING SMD IC CODE 611

    ic 555 timer 10 minute

    Abstract: proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator
    Text: LMC555 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LMC555 AN-1112 ic 555 timer 10 minute proportional control ELECTRIC CONVECTION WALL OVEN pulse position modulator

    AN-1112

    Abstract: 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national
    Text: ご注意 ：日本語のア プ リ ケーシ ョ ン ・ ノ ー ト は参考資料 と し て提供 し てお り 内容が 最新で ない場合があ り ます。 製品のご使用に際 し ては、 必ず最新の英文ア プ リ ケーシ ョ ン ・ ノ ー ト を ご確認 く だ さ い。


    Original     		PDF AN-1112 AN-1112 0.3mm pitch BGA ALIVH 0.3mm pitch csp package SMD CODE AN-1112 national

    BGA-3000

    Abstract: smd ic marking A9 smd a10 shaker smd diode A4 smd marking a7 smd transistor A6 transistor SMD a4 top mark smd A9 250 micro solder ball
    Text: National Semiconductor Application Note 1112 August 2000 CONTENTS Package Construction Key attributes for micro SMD 4, 5, and 8 bump Smallest Footprint Micro SMD Handling Surface Mount Technology SMT Assembly Considerations Printed Circuit Board Layout Stencil Printing Solder Paste


    Original     		PDF

    AN-1112

    Abstract: AN1112
    Text: ெࡔࡔॆӷ‫ິࠅ༹ڞ‬ ᆌᆩጀ๥!2223 3116!౎!:!ሆ ణ୤ ᆅჾ! ////////////////////////////////////////////////////////////////////////////////// !3 ‫ހ‬ጎࠓሰ! ////////////////////////////////////////////////////////////////////////////// !3


    Original     		PDF AN-1112 AN100926 AN-1112 AN1112

    DIODE smd marking 22-16

    Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621
    Text: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height


    Original     		PDF LM358, LMC6035, LM431, LM78L05, LMC555 OT23-5 DIODE smd marking 22-16 vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621

    ALIVH

    Abstract: 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT
    Text: ご注意：日本語のアプリケーション・ノートは参考資料として提供しており内容が 最新でない場合があります。製品のご使用に際しては、必ず最新の英文アプ リケーション・ノートをご確認ください。


    Original     		PDF AN-1112 ALIVH 0.3mm pitch csp package ALIVH PCB AN-1112 IPC-SM-785 0.3mm pitch BGA SMD Devices SMD CODE 185M wlcsp SMT

    smd transistor marking A6

    Abstract: ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7
    Text: LM358BP MICRO SMD QUALIFICATION PACKAGE Winter 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM358BP AN-1112 LM358 smd transistor marking A6 ir sensing circuit using LM358 TRANSISTOR SMD MARKING CODE a6 water level control using lm358 TRANSISTOR SMD MARKING CODE LF temperature control using lm358 LM358I lm358 water level lm358 laser current driver smd transistor marking a7

    TRANSISTOR SMD MARKING CODE LF

    Abstract: SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin
    Text: LM431 MICRO SMD QUALIFICATION PACKAGE Summer 1999 Table of Contents 1.0 Introduction 1.1 General Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 1.2 Technical Product Description . . . . . . . . . . . . . . . . . . . . . . . . . 1-1


    Original     		PDF LM431 AN-1112 TRANSISTOR SMD MARKING CODE LF SMD SOT23 transistor MARK ck TRANSISTOR SMD MARKING CODE loc TRANSISTOR SMD MARKING CODE SAW BGA-3000 transistor smd marking KA Zener diode smd marking ck diode SMD MARKING CODE SAW smd transistor marking HR MARKING BA SMD IC CODE 8-pin

    BGA-3000

    Abstract: BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar
    Text: National Semiconductor Application Note 1112 May 1999 CONTENTS Package Construction lation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for micro-SMD 8 I/O Smallest Footprint


    Original     		PDF AN-1112 BGA-3000 BGA reflow guide AN-1112 DEK268 AN100926-6 Amistar

    military relay

    Abstract: BGA-3000 AN-1112 LMC6035 LMC6035IBP LMC6035IBPX Lay out of 10 Bump Micro smd package CD laser pickup assembly
    Text: ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy zzzzzzzzzzzzz | ,    yyyyyyyyyyyy


    Original     		PDF

    IPC-SM-785

    Abstract: stencil tension AN-1112
    Text: National Semiconductor Application Note 1112 April 2003 Table of Contents Introduction . Package Construction .


    Original     		PDF

    AN-1112

    Abstract: solder joint reliability IPC-SM-785 Solder paste stencil life thick bga die size Semiconductor smd marking BY SMD 420
    Text: National Semiconductor Application Note 1112 March 2002 Table of Contents Introduction to MICRO SMD . Package Construction .


    Original     		PDF

    ALIVH

    Abstract: HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC
    Text: National Semiconductor Application Note 1112 September 2005 Table of Contents Introduction . 2 Package Construction . 2


    Original     		PDF CSP-9-111S2) CSP-9-111S2. AN-1112 ALIVH HASL 250 B 340 smd Transistor WLCSP stencil design AN-1112 MARKING CODE SMD IC

    8 PIN SMD IC 211

    Abstract: BGA-3000 top mark smd A9 SMD MARK A9 shaker
    Text: National Semiconductor Application Note 1112 September 1999 CONTENTS Package Construction ing, singulation and shipping in tape and reel. The package is assembled on PCB using standard surface mount assembly techniques SMT . Key Attributes for Micro SMD 4 and 8 I/O Packages


    Original     		PDF AN-1112 8 PIN SMD IC 211 BGA-3000 top mark smd A9 SMD MARK A9 shaker

    stencil tension

    Abstract: IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design
    Text: National Semiconductor Application Note 1112 June 2001 CONTENTS Introduction to Micro SMD Package Construction Micro SMD Package Data Surface Mount Assembly Considerations PCB Layout Stencil Printing Process Component Placement Solder Paste Reflow and Cleaning


    Original     		PDF AN-1112 stencil tension IPC-SM-785 PT100 bridge AN-1112 GENERAL SEMICONDUCTOR MARKING UM Solder paste stencil life WLCSP stencil design