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    AMPHENOL SIM BLOCK Search Results

    AMPHENOL SIM BLOCK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SF-SFPP2EPASS-005 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-005 5m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (16.4 ft) Datasheet
    SF-SFPP2EPASS-001 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-001 1m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (3.3 ft) Datasheet
    AV-DPMDPM0000-001 Amphenol Cables on Demand Amphenol AV-DPMDPM0000-001 1m DisplayPort Cable - Amphenol DisplayPort 1.1 Certified Cable (3.3ft) 1m (3.3') Datasheet
    SF-SFPP2EPASS-007 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-007 7m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (23 ft) Datasheet
    SF-SFPP2EPASS-002 Amphenol Cables on Demand Amphenol SF-SFPP2EPASS-002 2m SFP+ Cable - Amphenol 10GbE SFP+ Direct Attach Copper Cable (6.6 ft) Datasheet

    AMPHENOL SIM BLOCK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    sim card 6PIN

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		PDF UL94V-0, 5000cycles CAD-06-S1-20-1 sim card 6PIN

    sim card 6PIN

    Abstract: 06S1 sim card
    Text: Amphenol SIM Card Connector 1. Material: Contacts: Copper Alloy, Switch: Copper Alloy Insulator: High temperature. Thermoplastic, UL94V-0, Black. 2. Finish: Contacts: 30u” Gold plated on contact area,100u” min Matte-Tin on solder tail, Nickel underplated over all.


    Original     		PDF UL94V-0, 5000cycles CAD-06-S1-20-1 sim card 6PIN 06S1 sim card

    CAD-0601-302

    Abstract: CAD0601302 amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601302 CAD-0601-302 amphenol sim block

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601402 amphenol sim block

    CAD-0601-262

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601262 CAD-0601-262 amphenol sim block

    amphenol sim block

    Abstract: No abstract text available
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601242 amphenol sim block

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601382 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601342 amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601322 amphenol sim block sim block

    SIM BLOCK amphenol

    Abstract: amphenol sim block SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601362 SIM BLOCK amphenol amphenol sim block SIM BLOCK

    amphenol sim block

    Abstract: SIM BLOCK
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601282 amphenol sim block SIM BLOCK

    sim block

    Abstract: amphenol sim block
    Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area, 2.54-5.08 micron matte tin at solder tail and 1.27-2.54 micron nickel under


    Original     		PDF UL94V0, CAD0601222 sim block amphenol sim block

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-132

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-172

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-112

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-182

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-222

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-162 SIM READER amphenol

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-192

    CAD-0605-122

    Abstract: CAD0605122
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-122 CAD0605122

    CAD-0605-212

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-212

    SIM READER amphenol

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-152 SIM READER amphenol

    Untitled

    Abstract: No abstract text available
    Text: Amphenol SIM Reader 1. Material: Contact: Beryllium copper Insulator: 30% lass-filled thermoplastic LCP or equivalent UL94V-0, black 2. Finish: 15 micro-inch 0.38 micron min gold plating at matign area, 100-200 micro-inch(2.54-5.08 micron) pure tin at solder tail and 50-100 microinch(1.27-2.54 micron) nickel under plated


    Original     		PDF UL94V-0, 30Vac CAD-0605-142

    Optical SAS QSFP

    Abstract: Amphenol QSFP L77SDB25S1ACH4F U65B044010T MD5ML50S10 Amphenol 191-2801-110 Amphenol d 40 - e16a VCSEL array HDMI G38A71214AEU amphenol airbag
    Text: Amphenol Amphenol Preferred Parts Catalogue Amphenol Corporation Amphenol was founded in 1932. Today the company is one of the largest manufacturers of interconnect products in the world serving towards 8 major markets: Aerospace/Military, Automotive, Broadband


    Original     		PDF M22520/2-01 Optical SAS QSFP Amphenol QSFP L77SDB25S1ACH4F U65B044010T MD5ML50S10 Amphenol 191-2801-110 Amphenol d 40 - e16a VCSEL array HDMI G38A71214AEU amphenol airbag